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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EPF10K70RC240-2N~~

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EPF10K70RC240-2N - Intel

Name: Intel EPF10K70RC240-2N
Brand: Intel
SKU: EPF10K70RC240-2N
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: EPF10K70RC240-2N

Manufacturer: Intel

Allelco Part Number: 98D-EPF10K70RC240-2N

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 8,584 pcs available, New & Original

Parts Description: IC FPGA 189 I/O 240RQFP

Package: 240-RQFP (32x32)

Data sheet: EPF10K70RC240-2.pdf

Datasheets
FLEX 10K.pdf

PCN Design/Specification
Laser Mark 17/Feb/2016.pdf Mult Series Software Chgs 26/Mar/2020.pdf

PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf

PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf

PCN Other
Software Disc 06/Nov/2020.pdf

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In stock: 8584

Specifications

EPF10K70RC240-2N Tech Specifications
Intel - EPF10K70RC240-2N technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF10K70RC240-2N

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	4.75V ~ 5.25V
Total RAM Bits	18432
Supplier Device Package	240-RQFP (32x32)
Series	FLEX-10K®
Package / Case	240-BFQFP Exposed Pad
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 70°C (TA)
Number of Logic Elements/Cells	3744
Number of LABs/CLBs	468
Number of I/O	189
Number of Gates	118000
Mounting Type	Surface Mount
Base Product Number	EPF10K70

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A2A
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the EPF10K70RC240-2N compare to other FLEX-10K series FPGAs in terms of logic density and power efficiency for embedded control applications?: The EPF10K70RC240-2N offers 3,744 logic elements and 18,432 RAM bits within a compact 240-pin package, providing moderate logic density suitable for mid-complexity embedded designs. Compared to lower-density variants like the EPF10K30 or higher-end models such as the EPF10K100, it balances gate count (118,000 gates) with power characteristics under its 4.75V–5.25V operating range. Its surface-mount RQFP packaging and commercial temperature rating (0°C to 70°C) make it viable for industrial edge devices where size and moderate performance are prioritized over ultra-low power or extreme scalability.

What are the key thermal and electrical constraints when integrating the EPF10K70RC240-2N into a 5V system design?: The EPF10K70RC240-2N operates reliably only within a 4.75V to 5.25V supply window, necessitating precise voltage regulation if using a nominal 5V source. Voltage deviations outside this range may cause functional instability or reduced reliability. Thermally, while the device lacks an explicit junction temperature limit in the datasheet, its 0°C to 70°C ambient rating implies careful layout is required to avoid localized heating near high-gate-count blocks. The exposed pad on the 240-RQFP package aids heat dissipation but must be properly soldered to a PCB ground plane to ensure thermal conductivity and long-term reliability.

Can the EPF10K70RC240-2N be used in safety-critical or radiation-tolerant applications?: No, the EPF10K70RC240-2N is not designed or qualified for safety-critical or radiation-hardened environments. It belongs to Intel’s standard FLEX-10K family, which uses conventional CMOS processes without enhanced fault tolerance features. In high-reliability applications—such as aerospace or medical systems—additional redundancy, watchdog circuits, and environmental derating would be required, significantly increasing system complexity and cost.

How many I/O pins can be actively driven by the EPF10K70RC240-2N, and what are the implications for peripheral interfacing?: The EPF10K70RC240-2N provides 189 general-purpose I/O pins, though not all can be simultaneously active depending on configuration and power delivery. These support multiple I/O standards including LVCMOS and LVTTL, enabling direct connectivity to SPI, UART, parallel buses, and memory interfaces. However, designers must account for pin contention and signal integrity when driving multiple high-speed lines, especially given the limited number relative to total logic capacity—meaning efficient resource mapping is essential to avoid bottlenecks in real-time data paths.

Is the EPF10K70RC240-2N suitable for battery-powered embedded systems due to its power consumption profile?: While the EPF10K70RC240-2N consumes less power than larger FPGAs, its static and dynamic current draw remains relatively high for low-power applications. Operating at 5V across 468 LABs and 3,744 logic elements results in measurable quiescent current even at idle, making it suboptimal for extended battery life scenarios. For portable or energy-constrained devices, alternative architectures using microcontrollers with FPGA co-processors or newer low-voltage FPGAs would offer better efficiency.

How does the EPF10K70RC240-2N compare to modern CPLDs in terms of programmability and reconfiguration flexibility?: Unlike compact CPLDs optimized for glue logic and instant-on operation, the EPF10K70RC240-2N supports full FPGA-level programmability with thousands of logic cells and distributed RAM. This enables complex state machines and parallel processing unavailable in CPLD families like Altera MAX series. However, CPLDs typically boot faster and consume less static power, so for simple control tasks with deterministic timing, they remain preferable. The EPF10K70RC240-2N excels in applications requiring algorithmic flexibility and moderate throughput.

What development tools and programming methods are officially supported for configuring the EPF10K70RC240-2N?: The EPF10K70RC240-2N is supported by Intel Quartus Prime software, particularly legacy versions compatible with FLEX-10K architecture. Design entry typically occurs via VHDL or Verilog, followed by synthesis targeting the 468 LABs and routing through the programmable interconnect matrix. Configuration occurs via JTAG or serial flash, though external configuration devices may be needed depending on boot requirements. Note that newer toolchains may lack full optimization for older families, potentially affecting timing closure.

What are the risks associated with moisture sensitivity during assembly of the EPF10K70RC240-2N?: With an MSL rating of 3 (168 hours), the EPF10K70RC240-2N is classified as moisture-sensitive. Exposure to ambient humidity beyond 168 hours before reflow increases the risk of internal delamination or popcorning during thermal cycling. To mitigate this, manufacturers should follow IPC-J-STD-033 guidelines, including baking prior to assembly and storage in dry cabinets. Failure to adhere could compromise solder joint integrity and lead to latent reliability failures post-deployment.

How many logic elements does the EPF10K70RC240-2N contain, and how does this impact partitioning strategies in multi-module designs?: The EPF10K70RC240-2N contains 3,744 logic elements organized into 468 LABs, each comprising multiple adaptive logic modules (ALMs). When designing modular firmware—such as separating communication stacks from data processing—engineers must allocate LABs carefully to prevent congestion in routing channels. Overutilization of adjacent LABs can degrade timing performance, necessitating floorplanning and constraint-based placement during synthesis to maintain predictable behavior.

Can the EPF10K70RC240-2N interface directly with DDR memory controllers without external PHY components?: No, the EPF10K70RC240-2N lacks integrated high-speed transceivers and dedicated memory PHYs required for native DDR signaling. While basic SRAM or SDRAM interfaces are feasible using general-purpose I/O, synchronous double-data-rate protocols demand precise timing control and termination matching that exceed typical FPGA I/O capabilities without additional buffering or clock recovery circuitry. For such use cases, pairing with a companion memory controller IC or upgrading to a device with embedded transceivers is recommended.

How does the gate count of the EPF10K70RC240-2N compare to equivalent ASIC implementations in terms of NRE and time-to-market?: At 118,000 gates, the EPF10K70RC240-2N offers sufficient logic to implement moderately complex digital systems without full ASIC development. Compared to an equivalent gate-count ASIC, FPGA-based designs avoid non-recurring engineering (NRE) costs and reduce prototyping time from months to weeks. However, per-unit costs remain higher, and power consumption is greater—making the EPF10K70RC240-2N ideal for low-to-medium volume applications requiring rapid iteration or field updates.

What are the limitations of using the EPF10K70RC240-2N in high-frequency clock distribution networks?: Due to its age and technology node, the EPF10K70RC240-2N has limited support for global clock networks with skew control below 100 ps. Global clock buffers consume significant routing resources, and the FLEX-10K architecture lacks hardened PLLs optimized for fine-grained phase alignment. Attempting sub-nanosecond synchronization across multiple domains risks metastability and jitter accumulation, especially when distributing clocks to fast peripherals like FIFOs or ADCs connected via GPIO.

Is backward compatibility maintained between EPF10K70RC240-2N firmware and newer FLEX-10K devices?: Yes, EPF10K70RC240-2N bitstreams are generally compatible with other FLEX-10K family members sharing the same base architecture. However, differences in LAB count, I/O banks, or available resources may cause placement failures or require constraint adjustments. Designers should verify that timing constraints and pin assignments align with target devices before deployment, as minor revisions may alter routing topologies or delay characteristics.

How does the total RAM bit capacity of the EPF10K70RC240-2N influence block memory implementation choices?: With 18,432 total RAM bits, the EPF10K70RC240-2N supports small to medium-sized block memories up to 2K x 9 bits or 1K x 18 bits. This allows implementation of lookup tables, FIFO buffers, or packet headers but limits larger frame buffers or deep queues. Engineers must balance block RAM usage against logic utilization, as excessive memory allocation reduces available LABs and complicates routing congestion in dense designs.

What precautions should be taken when replacing the EPF10K70RC240-2N with another FPGA in an existing design?: Substituting the EPF10K70RC240-2N requires verifying pin compatibility, supply voltage thresholds, I/O standard support, and thermal characteristics. Even if functionally similar, new devices may have different propagation delays, drive strength, or power sequencing requirements that affect PCB layout and decoupling. Additionally, toolchain changes may introduce synthesis or timing anomalies, necessitating regression testing across all operational modes before release.

How does the commercial-grade temperature range of the EPF10K70RC240-2N affect reliability in outdoor or industrial settings?: Operating from 0°C to 70°C means the EPF10K70RC240-2N is unsuitable for direct exposure to extreme cold or heat without environmental controls. Thermal expansion mismatches with PCB materials and solder joints can accelerate fatigue under cyclic conditions. In harsh environments, conformal coating and enclosure-rated designs are advised, along with derating logic utilization to reduce internal self-heating and improve mean time between failures (MTBF).

What role does the exposed pad play in the thermal performance of the EPF10K70RC240-2N?: The exposed pad on the 240-RQFP package acts as a primary thermal interface, drawing heat away from internal power-dissipating nodes toward the PCB copper plane. Proper soldering and connection to a solid ground layer enhance convective cooling and stabilize junction temperatures. Neglecting this connection isolates the die thermally, increasing hotspots and potentially triggering latch-up or reduced electromigration margins during continuous operation.

Can the EPF10K70RC240-2N support partial reconfiguration of specific logic regions during runtime?: Partial reconfiguration is not natively supported on the EPF10K70RC240-2N due to its static architecture and lack of dynamic region partitioning features found in modern FPGAs like Stratix or Arria series. All configuration occurs at startup via JTAG or serial interface. While firmware patches can simulate modularity through time-division multiplexing, true concurrent region updates are infeasible, limiting flexibility in adaptive systems requiring runtime updates.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF10K70RC240-2N

Product Attribute
Part Number	EPF10K70RC240-3N	EPF10K70RC240-2	EPF10K70RC240-4N	EPF10K70RC240-3GZ
Manufacturer	Intel	Intel	Intel	Intel
Voltage - Supply	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Logic Elements/Cells	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Series	-	-	-	-
Number of I/O	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Total RAM Bits	-	-	-	-
Number of Gates	-	-	-	-

EPF10K70RC240-2N Datasheet PDF

Download EPF10K70RC240-2N pdf datasheets and Intel documentation for EPF10K70RC240-2N - Intel.

Datasheets: FLEX 10K.pdf
PCN Design/Specification: Laser Mark 17/Feb/2016.pdf Mult Series Software Chgs 26/Mar/2020.pdf
PCN Packaging: All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL: EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Other: Software Disc 06/Nov/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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