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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LCMXO2-4000HC-4BG256C~~

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LCMXO2-4000HC-4BG256C - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LCMXO2-4000HC-4BG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-4000HC-4BG256C
Price: 4.6 USD
Availability: InStock
Rating: 5 (7 reviews)

Manufacturer Part Number: LCMXO2-4000HC-4BG256C

Manufacturer: Lattice Semiconductor

Allelco Part Number: 32D-LCMXO2-4000HC-4BG256C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 2,526 pcs available, New & Original

Parts Description: IC FPGA 206 I/O 256CABGA

Package: 256-CABGA (14x14)

Data sheet: LCMXO2-4000HC-4.pdf

Datasheets
MachXO2 Family Datasheet.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Assembly/Origin
Alternate Assembly/Test Site 14/Apr/2014.pdf

PCN Design/Specification
Datasheet Chg 21/Mar/2016.pdf Multiple Devices Cu Wire 01/Jul/2013.pdf

PCN Other
I2C Read-Back Failure Feb/2015.pdf

Getting Started Guide
Product Selector Guide.pdf

RoHs Status: ROHS3 Compliant

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In stock: 2526

Unit Price: $12.54
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1000+	$4.60	$4,600.00

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Specifications

LCMXO2-4000HC-4BG256C Tech Specifications
Lattice Semiconductor Corporation - LCMXO2-4000HC-4BG256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LCMXO2-4000HC-4BG256C

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.375V ~ 3.465V
Total RAM Bits	94208
Supplier Device Package	256-CABGA (14x14)
Series	MachXO2
Package / Case	256-LFBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	4320
Number of LABs/CLBs	540
Number of I/O	206
Mounting Type	Surface Mount
Base Product Number	LCMXO2-4000

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Parts Introduction

LCMXO2-4000HC-4BG256C (1)

Manufacturer Part Number

LCMXO2-4000HC-4BG256C

Manufacturer

Lattice Semiconductor

Introduction

High-performance, low-power FPGA designed for a variety of applications

Product Features and Performance

540 LABs/CLBs

4320 Logic Elements/Cells

94208 Total RAM Bits

206 Number of I/O Ports

Supports voltage supply from 2.375V to 3.465V

Surface Mountable

Compatible with 256-LFBGA packaging

Operational temperature range from 0°C to 85°C

Product Advantages

Efficient power usage

High logic capacity

Ample I/O ports for versatile connectivity

Adaptable voltage range for different power environments

Key Technical Parameters

Number of LABs/CLBs: 540

Number of Logic Elements/Cells: 4320

Total RAM Bits: 94208

Number of I/O: 206

Voltage - Supply Range: 2.375V to 3.465V

Mounting Type: Surface Mount

Operating Temperature Range: 0°C to 85°C

Quality and Safety Features

Guaranteed operational temperature range for reliable performance

LFBGA packaging for robust physical integrity

Compatibility

Lattice MachXO2 series compatible

Standard surface mount LFBGA technology

Application Areas

Industrial controls

Consumer electronics

Automotive systems

Telecommunications infrastructure

Computing platforms

Product Lifecycle

Active status product

Not reported near discontinuation

Potential availability of replacement or upgrades exists through Lattice Semiconductor

Several Key Reasons to Choose This Product

Versatility in a wide range of applications

Optimized for low-power consumption

Strong input/output capability

Sustained performance within specified temperature ranges

Supported by a reputable manufacturer in FPGA technology

Continuous product lifecycle with active status

High functionality embedded within a small footprint (256-CABGA package)

Frequently Asked Questions(FAQ)

What is the typical power consumption and thermal performance of the LCMXO2-4000HC-4BG256C FPGA when configured for low-power standby operation?: The LCMXO2-4000HC-4BG256C exhibits a quiescent current of approximately 3.5 mA at 3.3 V supply voltage in standby mode, with dynamic power consumption scaling with switching activity. At full utilization with typical I/O toggling, total power dissipation ranges between 80 mW to 120 mW under normal operating conditions. This makes it suitable for battery-powered and thermally constrained embedded systems where power efficiency is critical.

How does the LCMXO2-4000HC-4BG256C compare to the LCMXO2-2500HC variant in terms of logic capacity, RAM resources, and maximum achievable clock frequency?: The LCMXO2-4000HC-4BG256C offers nearly double the logic elements (4320 vs. 2560) and significantly more embedded RAM (94208 bits vs. 58368 bits) compared to the LCMXO2-2500HC. While both devices operate within similar voltage and temperature ranges, the higher-density LCMXO2-4000HC supports more complex state machines and larger FIFO structures. However, due to increased capacitive loading, the maximum recommended core clock frequency may be slightly lower than the LCMXO2-2500HC unless careful floorplanning and clock tree optimization are applied.

What are the key considerations when implementing synchronous reset logic in designs targeting the LCMXO2-4000HC-4BG256C?: The LCMXO2-4000HC-4BG256C supports global and local reset networks, but asynchronous resets must be synchronized to the internal clock domain to avoid metastability. It is recommended to use two flip-flops in series for input synchronization and generate reset signals through dedicated reset controller IP blocks provided in Lattice Diamond or Radiant software. Improper handling can lead to timing failures or unpredictable initialization behavior during power-up sequences.

Can the LCMXO2-4000HC-4BG256C support multiple independent clock domains, and what precautions should be taken during cross-clock domain communication?: Yes, the LCMXO2-4000HC-4BG256C includes dedicated routing and clock management resources supporting multiple clock domains. When crossing from one clock domain to another, such as between a 50 MHz system clock and a 100 MHz high-speed interface clock, dual-flop synchronizers or FIFOs with gray-code pointers should be used to prevent data corruption. The device lacks hardened PLLs, so external oscillators or crystal references are typically required for stable multi-domain operation.

How does the Moisture Sensitivity Level (MSL) rating of 3 for the LCMXO2-4000HC-4BG256C influence storage, handling, and reflow soldering procedures?: With an MSL of 3, the LCMXO2-4000HC-4BG256C must be stored in dry packaging and baked if exposed to ambient humidity for over 168 hours before assembly. During reflow, the cumulative thermal exposure must not exceed 6 standard reflow cycles or violate the peak temperature profile specified in the datasheet—typically ≤260°C for ≤10 seconds. Failure to follow JEDEC J-STD-020 guidelines can result in popcorning or bond wire degradation.

Is it feasible to implement a soft-core processor like RISC-V on the LCMXO2-4000HC-4BG256C, and what logic overhead would this incur?: Yes, the LCMXO2-4000HC-4BG256C can accommodate a lightweight soft-core processor such as the PicoRV32 or LatticeMico32. Implementing a RISC-V core typically consumes around 15–20% of the available LABs depending on configuration, leaving sufficient resources for peripherals and glue logic. However, the absence of block RAM means all memory must be implemented using distributed RAM or external SRAM, which increases resource utilization and latency.

What are the limitations of using the internal oscillator in the LCMXO2-4000HC-4BG256C for precision timing applications?: The internal oscillator on the LCMXO2-4000HC-4BG256C has a typical accuracy of ±1.5% across temperature and voltage variations, making it unsuitable for high-precision applications requiring sub-millisecond timing accuracy. While adequate for boot sequencing and basic control loops, users needing better than ±0.1% stability should rely on external crystal oscillators or MEMS-based clocks referenced via the global clock buffers.

How does the package size and pinout of the 256-CABGA affect PCB layout complexity and signal integrity for the LCMXO2-4000HC-4BG256C?: The 14x14 mm CABGA package of the LCMXO2-4000HC-4BG256C features 0.8 mm ball pitch, demanding high-precision PCB fabrication with tight impedance control. High-speed signals should avoid vias unless necessary, and power delivery requires careful decoupling placement near power pins. Due to the small form factor, thermal vias under the package are recommended to dissipate heat effectively into the ground plane.

What is the recommended configuration method for the LCMXO2-4000HC-4BG256C upon power-up, and what security features are supported?: The LCMXO2-4000HC-4BG256C supports in-system programming via SPI flash using a dedicated JTAG or I2C interface. Configuration data is typically stored in an external serial flash device. The device offers basic anti-tamper protection through bitstream encryption when combined with Lattice’s security IP, though it does not include hardware cryptographic engines like some high-end FPGAs.

How many user-programmable I/O banks does the LCMXO2-4000HC-4BG256C have, and how do they constrain voltage-level translation?: The LCMXO2-4000HC-4BG256C provides four independent I/O banks, each supporting configurable voltage levels from 1.2 V to 3.3 V. This allows flexible interfacing between 1.8 V and 3.3 V devices without level shifters, but mixing incompatible voltages within the same bank may cause contention. Careful assignment of I/O standards per application is essential to ensure reliable communication across heterogeneous subsystems.

Can the LCMXO2-4000HC-4BG256C be used in automotive-grade temperature applications, and what modifications are required?: No, the LCMXO2-4000HC-4BG256C is rated only up to 85°C junction temperature, making it unsuitable for most automotive environments. For extended industrial or automotive use, a higher-temperature variant such as the LCMXO2-4000HE-4BG256C, which supports -40°C to +100°C, would be required. Additionally, qualification testing and AEC-Q100 compliance would need to be performed by the end user.

What tools and development kits are officially supported for prototyping designs with the LCMXO2-4000HC-4BG256C?: Lattice provides the MachXO2 Evaluation Kit (LFE2H100B-EVN) compatible with the LCMXO2-4000HC-4BG256C, featuring breakout boards for all I/Os and onboard flash programming. Development is supported through Lattice Diamond or Radiant design suites, with IP cores for common interfaces such as UART, I2C, and GPIO. Third-party toolchains like Yosys and Project IceStorm are community-supported for open-source workflows.

What is the impact of using distributed RAM versus block RAM in the LCMXO2-4000HC-4BG256C on area, speed, and power consumption?: The LCMXO2-4000HC-4BG256C does not contain dedicated block RAM; instead, all memory must be implemented using distributed RAM built from LUTs. Distributed RAM uses combinational logic resources, increasing LAB usage and potentially affecting routing congestion. It operates at full clock speed without additional latency but consumes more area than equivalent block RAM found in larger FPGAs, reducing overall logic headroom.

How does the absence of hard processor cores in the LCMXO2-4000HC-4BG256C affect system architecture decisions compared to SoC FPGAs?: Unlike SoC FPGAs such as Xilinx Zynq or Intel Cyclone V, the LCMXO2-4000HC-4BG256C contains only programmable logic without integrated ARM processors or DSP blocks. This means software execution must occur either on external microcontrollers or soft cores consuming significant logic resources. System architects must weigh the trade-off between flexibility and performance when choosing between pure FPGA platforms and hybrid SoC solutions.

What are the best practices for managing clock jitter and skew when driving high-speed serial interfaces with the LCMXO2-4000HC-4BG256C?: Since the LCMXO2-4000HC-4BG256C lacks hardened SERDES blocks, any high-speed serial communication relies on parallel I/Os with precise timing constraints. Clock skew should be minimized through balanced clock tree synthesis in the place-and-route tool. Output delays must be calibrated using delay-locked loops (DLLs) or manual offset adjustments, and input sampling should use phase-aligned clocks derived from a common reference to maintain valid setup/hold margins.

Can the LCMXO2-4000HC-4BG256C interface directly with DDR3 memory, and if not, what alternatives exist?: No, the LCMXO2-4000HC-4BG256C cannot natively support DDR3 due to the lack of differential I/O standards and high-speed termination requirements. Instead, designers often use external SRAM or SDRAM controlled via custom state machines, or implement lower-speed memory interfaces like SPI Flash or QSPI RAM. For higher bandwidth needs, bridging to a microcontroller with dedicated memory controllers is a common workaround.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LCMXO2-4000HC-4BG256C

Product Attribute
Part Number	LCMXO2-4000HC-4BG256I	LCMXO2-4000HC-4FTG256C	LCMXO2-4000HC-4BG332C	LCMXO2-4000HC-4FTG256I
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Supply	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Total RAM Bits	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Logic Elements/Cells	-	-	-	-
Number of I/O	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Series	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad

LCMXO2-4000HC-4BG256C Datasheet PDF

Download LCMXO2-4000HC-4BG256C pdf datasheets and Lattice Semiconductor Corporation documentation for LCMXO2-4000HC-4BG256C - Lattice Semiconductor Corporation.

Datasheets: MachXO2 Family Datasheet.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Assembly/Origin: Alternate Assembly/Test Site 14/Apr/2014.pdf
PCN Design/Specification: Datasheet Chg 21/Mar/2016.pdf Multiple Devices Cu Wire 01/Jul/2013.pdf
PCN Other: I2C Read-Back Failure Feb/2015.pdf
Getting Started Guide: Product Selector Guide.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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Shipment charges(KG)	Reference DHL(USD$)
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1.00kg-2.00kg	USD$40.00 - USD$80.00
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