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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LCMXO2-4000HC-4FG484I~~

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LCMXO2-4000HC-4FG484I - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LCMXO2-4000HC-4FG484I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-4000HC-4FG484I
Price: 31.95 USD
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: LCMXO2-4000HC-4FG484I

Manufacturer: Lattice Semiconductor

Allelco Part Number: 98D-LCMXO2-4000HC-4FG484I

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 31,821 pcs available, New & Original

Parts Description: IC FPGA 278 I/O 484FBGA

Package: 484-FBGA (23x23)

Data sheet: LCMXO2-4000HC-4.pdf

Datasheets
MachXO2 Family Datasheet.pdf MachXO2 Family Handbook.pdf

Getting Started Guide
Product Selector Guide.pdf

PCN Other
I2C Read-Back Failure Feb/2015.pdf

PCN Design/Specification
Datasheet Chg 21/Mar/2016.pdf Multiple Devices Cu Wire 01/Jul/2013.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Assembly/Origin
Alternate Qualified Test Site 30/Sep/2013.pdf

RoHs Status: ROHS3 Compliant

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Specifications

LCMXO2-4000HC-4FG484I Tech Specifications
Lattice Semiconductor Corporation - LCMXO2-4000HC-4FG484I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LCMXO2-4000HC-4FG484I

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.375V ~ 3.465V
Total RAM Bits	94208
Supplier Device Package	484-FBGA (23x23)
Series	MachXO2
Package / Case	484-BBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells	4320
Number of LABs/CLBs	540
Number of I/O	278
Mounting Type	Surface Mount
Base Product Number	LCMXO2-4000

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the LCMXO2-4000HC-4FG484I compare to other MachXO2 devices in terms of logic density and power efficiency for low-power embedded applications?: The LCMXO2-4000HC-4FG484I provides 4,320 logic elements and 94,208 RAM bits within the MachXO2 family, positioning it above lower-density models such as the -1200E or -680E variants. Its HC (High-Capacity) designation indicates optimized performance at lower core voltages compared to standard versions, making it suitable for systems requiring moderate complexity with strict power budgets. While not as high-performance as larger FPGAs from other vendors, its balance of logic resources and sub-10 mW standby current makes it a strong candidate for always-on monitoring and control tasks.

What are the key considerations when selecting decoupling capacitors for the LCMXO2-4000HC-4FG484I in a production PCB layout?: Given the LCMXO2-4000HC-4FG484I’s operating voltage range of 2.375 V to 3.465 V and high pin count (278 I/O), effective power integrity is critical. A minimum of one 0.1 µF ceramic capacitor should be placed within 1 mm of each VCCIO and VCCINT pin, with additional bulk capacitance of 2.2 µF recommended per power rail. Care must be taken to minimize loop inductance using short, wide traces and avoiding vias where possible. Simulation of transient response under worst-case switching conditions can help validate stability.

Can the LCMXO2-4000HC-4FG484I be used in automotive-grade temperature environments, and what design precautions are necessary?: Although the LCMXO2-4000HC-4FG484I operates over a commercial temperature range of -40°C to +100°C (TJ), it is not qualified to AEC-Q100 standards unless specified by an automotive-grade variant. For non-automotive use in industrial or harsh environments, thermal management remains important—ensure adequate airflow and avoid localized hotspots due to high I/O bank loading. Thermal resistance from junction to ambient should be considered when estimating maximum continuous operating current.

How does the number of LABs (Logic Array Blocks) in the LCMXO2-4000HC-4FG484I impact timing closure in synchronous designs?: With 540 LABs distributed across the device, the LCMXO2-4000HC-4FG484I offers sufficient granularity for medium-complexity state machines and data path logic. However, large combinatorial paths spanning multiple LAB rows may introduce routing delays that affect setup times. Designers should limit combinational depth within a single LAB and use pipelining strategies when crossing LAB boundaries. Static timing analysis tools must account for the device’s known routing characteristics, especially in dense interconnect scenarios.

What is the typical inrush current behavior during power-up for the LCMXO2-4000HC-4FG484I, and how should this influence power sequencing?: The LCMXO2-4000HC-4FG484I typically draws peak inrush currents in the tens of milliamperes during initial configuration, depending on the supply ramp rate and internal biasing circuits. To prevent brownout conditions on shared rails, the power supply should have a controlled slew rate (typically < 10 ms rise time). In systems with multiple voltage domains, sequencing between core and I/O supplies must ensure VCCINT stabilizes before significant I/O activity occurs to avoid latch-up risk.

How does the package size and pinout of the 484-FBGA affect signal integrity and routing congestion in high-speed interfaces?: The 23x23 mm FBGA package of the LCMXO2-4000HC-4FG484I places all 278 I/O pins on a tight 1 mm pitch grid, enabling compact board layouts but increasing difficulty in managing crosstalk and impedance matching. High-speed signals should be routed with controlled impedance traces, preferably over solid ground planes, and differential pairs maintained with consistent spacing. Avoid placing clock lines adjacent to bidirectional buses unless proper isolation techniques are applied.

What programming interface options are available for the LCMXO2-4000HC-4FG484I, and which offers the best throughput for mass production?: The LCMXO2-4000HC-4FG484I supports JTAG via IEEE 1149.1-compliant boundary scan, allowing in-system programming and debugging. For higher-volume production, Lattice recommends using their FlashPro programmer in batch mode, which leverages parallel programming of multiple devices via a dedicated host interface. Configuration files (.jlcf) generated by Diamond software must include correct fuse maps and security settings to ensure reliable reprogramming cycles exceeding 10,000 writes.

How does the LCMXO2-4000HC-4FG484I compare to CPLDs from Microchip in terms of reconfigurability and memory capacity?: Unlike traditional CPLDs, the LCMXO2-4000HC-4FG484I features full FPGA-style block RAM and programmable interconnect, offering significantly more flexible logic organization than fixed macrocell architectures common in CPLDs. While CPLDs excel at simple glue logic, the MachXO2 supports complex sequential circuits, state machines, and moderate-memory buffers—up to 94,208 bits total—making it preferable for designs requiring both logic integration and local data buffering beyond what CPLDs provide.

Are there any known limitations in using LVDS signaling with the LCMXO2-4000HC-4FG484I’s I/O banks?: The LCMXO2-4000HC-4FG484I supports user-configurable I/O standards including LVDS through its flexible I/O blocks, but only certain banks allow differential pair routing depending on physical pin adjacency. Designers must consult the device pinout diagram to identify valid LVDS channels and adhere to recommended trace lengths (< 75 mm typical). Additionally, termination resistors must be placed close to the receiver inputs, and reference voltage levels must comply with target system requirements.

What role does the internal oscillator play in boot reliability for the LCMXO2-4000HC-4FG484I, and when should external clocks be preferred?: The LCMXO2-4000HC-4FG484I includes a factory-trimmed internal oscillator providing stable clocking during startup before external clocks are active. This helps ensure deterministic initialization, but accuracy is limited (±2%) and drift may occur with temperature. For applications requiring precise timing (e.g., communication protocols), an external crystal or oscillator should replace the internal source after configuration completes. Always verify startup sequence in hardware to confirm PLL lock times align with application needs.

How does the Moisture Sensitivity Level (MSL) of 3 for the LCMXO2-4000HC-4FG484I influence handling procedures in assembly facilities?: As an MSL 3 component with a floor life of 168 hours, the LCMXO2-4000HC-4FG484I requires dry storage (below 60% RH) after desiccant packaging until use. Once opened, it must be assembled within 168 hours or baked if needed. Facilities without nitrogen-flush capabilities face increased risk of popcorning during reflow. Documentation per JEDEC J-STD-020 must be followed, and operators should track timestamps post-opening to avoid reliability issues.

What trade-offs exist between using global versus regional clocks in designs implemented on the LCMXO2-4000HC-4FG484I?: The LCMXO2-4000HC-4FG484I supports both global and regional clock networks. Global clocks distribute signals efficiently across all LABs with minimal skew but consume more routing resources. Regional clocks reduce resource usage by limiting distribution to specific quadrants but increase skew if mismanaged. For time-critical paths, global clocks are preferable; for distributed, asynchronous subsystems, regional clocks may improve area utilization without sacrificing functionality.

Is it possible to partially reconfigure the LCMXO2-4000HC-4FG484I dynamically, and what constraints apply?: Full dynamic partial reconfiguration is not natively supported in MachXO2 devices; however, designers can implement coarse-grained updates by switching between pre-built image partitions during idle periods. The LCMXO2-4000HC-4FG484I lacks runtime partial bitstream capability found in larger FPGA families, so any update requires complete reprogramming via JTAG or SPI interface. This limits real-time adaptability but simplifies timing closure and verification efforts.

How does the choice of I/O voltage affect compatibility with downstream components when using the LCMXO2-4000HC-4FG484I?: Each I/O bank of the LCMXO2-4000HC-4FG484I can operate independently from 1.2 V to 3.465 V, enabling mixed-voltage system integration. When interfacing with 1.8 V or 3.3 V peripherals, level translation is unnecessary if the FPGA bank matches the peripheral voltage. However, crossing domains requires care—bidirectional signals need direction control, and asynchronous clocks demand synchronization logic to prevent metastability. Always validate timing margins under worst-case process corners.

What is the expected lifespan and write endurance for configuration memory in the LCMXO2-4000HC-4FG484I?: The LCMXO2-4000HC-4FG484I uses flash-based configuration memory, which is inherently non-volatile and theoretically unlimited in write cycles. In practice, manufacturers specify >10,000 reprogramming cycles for reliability, though environmental stressors like radiation or extreme temperatures may degrade retention over decades. For most embedded applications, lifecycle exceeds 15 years without active reprogramming, assuming stable operating conditions within datasheet limits.

How does the ECCN classification (3A991D) for the LCMXO2-4000HC-4FG484I impact export controls for end products?: Classified under ECCN 3A991D, the LCMXO2-4000HC-4FG484I falls under U.S. Commerce Control List Category 3 for electronics, indicating it may require export licensing for certain destinations (e.g., military or embargoed countries) even if used in civilian equipment. End-product integrators must assess whether their system qualifies for License Exception ENC or needs formal authorization based on final application and destination. Consult BIS guidelines before international shipment.

What simulation and synthesis considerations are unique to implementing designs on the LCMXO2-4000HC-4FG484I?: Synthesis tools targeting the LCMXO2-4000HC-4FG484I must respect its hierarchical LAB structure and avoid overly aggressive optimizations that assume uniform routing delays. Clock domain crossing logic should incorporate synchronizer chains compliant with Xilinx/Intel methodologies, even though the architecture differs. Timing constraints must reflect actual routing estimates from place-and-route results, as generic libraries may not accurately model MachXO2-specific delays.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LCMXO2-4000HC-4FG484I

Product Attribute
Part Number	LCMXO2-4000HC-4FG484C2U	LCMXO2-4000HC-4FG484C	LCMXO2-4000HC-4TG144I	LCMXO2-4000HC-4TG144C
Manufacturer	Lattice Semiconductor	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Voltage - Supply	-	-	-	-
Total RAM Bits	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Logic Elements/Cells	-	-	-	-
Number of I/O	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of LABs/CLBs	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Series	-	-	-	-

LCMXO2-4000HC-4FG484I Datasheet PDF

Download LCMXO2-4000HC-4FG484I pdf datasheets and Lattice Semiconductor Corporation documentation for LCMXO2-4000HC-4FG484I - Lattice Semiconductor Corporation.

Datasheets: MachXO2 Family Datasheet.pdf MachXO2 Family Handbook.pdf
Getting Started Guide: Product Selector Guide.pdf
PCN Other: I2C Read-Back Failure Feb/2015.pdf
PCN Design/Specification: Datasheet Chg 21/Mar/2016.pdf Multiple Devices Cu Wire 01/Jul/2013.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Assembly/Origin: Alternate Qualified Test Site 30/Sep/2013.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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