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Home Products Integrated Circuits (ICs)Interface - Drivers, Receivers, Transceivers~~AM26LV31EIRGYRG4~~

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AM26LV31EIRGYRG4 - Texas Instruments

Name: Texas Instruments AM26LV31EIRGYRG4
Brand: Texas Instruments
SKU: AM26LV31EIRGYRG4
Price: 0.314 USD
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: AM26LV31EIRGYRG4

Manufacturer: Texas Instruments

Allelco Part Number: 98D-AM26LV31EIRGYRG4

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 15,921 pcs available, New & Original

Parts Description: IC DRIVER 4/0 16VQFN

Package: 16-VQFN (4x3.5)

Data sheet: AM26LV31EIRGYRG.pdf

HTML Datasheet
AM26LV31E.pdf

RoHs Status: ROHS3 Compliant

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Specifications

AM26LV31EIRGYRG4 Tech Specifications
Texas Instruments - AM26LV31EIRGYRG4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - AM26LV31EIRGYRG4

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply	3V ~ 3.6V
Type	Driver
Supplier Device Package	16-VQFN (4x3.5)
Series	-
Protocol	RS422, RS485
Package / Case	16-VFQFN Exposed Pad

Product Attribute	Attribute Value
Package	Tape & Reel (TR)
Operating Temperature	-40°C ~ 85°C
Number of Drivers/Receivers	4/0
Mounting Type	Surface Mount
Duplex	-
Data Rate	-
Base Product Number	AM26LV31

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	2 (1 Year)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

What are the key electrical characteristics and performance specifications of the AM26LV31EIRGYRG4 that influence its suitability for industrial RS-485 communication systems?: The AM26LV31EIRGYRG4 is a 4-channel, single-ended driver IC designed for RS-485 applications, operating from a supply voltage range of 3.0V to 3.6V, making it compatible with low-voltage digital systems. It supports data rates up to 25 Mbps, which enables high-speed serial communication in noisy industrial environments. The device features a wide common-mode voltage range, typically ±7V, allowing robust signal integrity over long cable runs without requiring external biasing components in most cases. Its propagation delay skew across channels is tightly matched, ensuring reliable multi-drop network operation. With an input hysteresis of approximately 200 mV, the device provides strong noise immunity at the receiver side, critical for maintaining signal fidelity in electrically harsh settings.

How does the AM26LV31EIRGYRG4 compare to other Texas Instruments RS-485 transceivers like the SN65HVD12 in terms of power consumption and noise margin under low-voltage conditions?: Compared to the SN65HVD12, which operates from a 5V supply and consumes higher quiescent current due to its legacy design, the AM26LV31EIRGYRG4 is optimized for 3.3V systems and draws significantly less power—typically below 2 mA per channel at 3.3V. This results in lower overall system power dissipation, especially beneficial in battery-powered or thermally constrained designs. Additionally, the AM26LV31 offers improved noise margins through its enhanced input threshold stability and superior common-mode rejection ratio (CMRR), particularly at lower supply voltages. While the SN65HVD12 may support slightly higher output drive levels, the AM26LV31’s tighter tolerance on VOH and VOL ensures better signal compatibility with modern microcontrollers operating at 3.3V logic thresholds.

What considerations should be taken into account when selecting termination resistors for networks using the AM26LV31EIRGYRG4 to ensure signal integrity over long distances?: When deploying the AM26LV31EIRGYRG4 in multi-point RS-485 networks exceeding 10 meters, proper termination is essential to prevent reflections that degrade signal quality. A 120Ω resistor should be placed across the differential lines at each end of the bus to match the characteristic impedance of standard twisted-pair cables. Given the AM26LV31’s maximum output current capability of ±35 mA, the termination resistor must be rated to handle continuous power dissipation; for example, at 3.3V, 120Ω draws about 92 mW, necessitating a 1/4 W or higher rating. Additionally, the high-speed switching capability (up to 25 Mbps) means edge rates can approach 10 ns, increasing susceptibility to ringing if termination is omitted or mismatched.

Can the AM26LV31EIRGYRG4 be used in half-duplex applications, and what design precautions are necessary to avoid bus contention?: Yes, the AM26LV31EIRGYRG4 supports half-duplex communication by enabling time-division multiplexing between transmit and receive modes using direction control signals. However, since this model contains only drivers (no integrated receivers), an external transceiver with receiver functionality must be paired to form a complete half-duplex node. To prevent bus contention during mode transitions, designers should implement software-controlled enable sequencing that ensures the driver is disabled before switching direction. Delays of at least 1 µs should be inserted between TXEN deassertion and RXEN assertion to allow for signal settling. Failure to do so risks back-to-back transmissions that can cause excessive stress on the output stages.

What environmental and reliability factors should engineers evaluate when integrating the AM26LV31EIRGYRG4 into automotive or industrial control systems?: The AM26LV31EIRGYRG4 is specified for operation from -40°C to +85°C, aligning with many industrial temperature grades but falling short of AEC-Q100 qualification required for demanding automotive applications. Engineers considering use in vehicles must assess whether additional thermal derating or conformal coating is needed to mitigate moisture ingress, as the part has an MSL2 rating indicating sensitivity to humidity during assembly. In high-vibration environments, proper PCB layout with short traces and ground stitching helps maintain signal integrity. The device’s ESD protection exceeds ±15 kV HBM per IEC 61000-4-2, offering resilience against static discharge events common in field installations.

How does the pinout configuration of the AM26LV31EIRGYRG4 support compact board layouts, and what layout best practices reduce electromagnetic interference (EMI)?: The AM26LV31EIRGYRG4 uses a 16-pin VQFN package measuring just 4×3.5 mm with an exposed thermal pad, enabling highly space-efficient designs ideal for portable instruments and compact automation modules. The compact footprint allows four independent driver channels within minimal area, facilitating multi-drop topologies in tight enclosures. To minimize EMI, place decoupling capacitors (0.1 µF ceramic) as close as possible to the VCC and GND pins, and route differential pairs symmetrically with controlled impedance (typically 120Ω). Avoid routing high-speed signals near crystal oscillators or clock inputs, and use guard rings around sensitive nodes to contain radiated emissions.

What are the implications of using the AM26LV31EIRGYRG4 without external biasing resistors in long-distance RS-485 deployments?: Without external bias resistors pulling the A and B lines toward a defined idle state (e.g., A > B), the AM26LV31EIRGYRG4 relies on internal circuitry to establish a default condition. However, in long cables with capacitive loading and high transmission distances (>500 m), this internal bias may be insufficient to maintain valid differential voltage levels during idle periods, leading to undetectable bus states and potential false wake-up events. Adding 1 kΩ pull-up and pull-down resistors to define the idle state improves noise margin and ensures deterministic behavior, especially when multiple nodes share the same bus line.

In what scenarios would substituting the AM26LV31EIRGYRG4 with the AM26LV31EIRGYR affect system reliability or certification status?: The AM26LV31EIRGYRG4 includes a lead-free (RoHS3 compliant) finish and meets JEDEC JESD22-A113 moisture sensitivity level 2, whereas the base part AM26LV31EIRGYR lacks explicit RoHS3 documentation and may not guarantee full compliance with newer halogen-free standards. Substituting without verifying chemical composition could jeopardize product certification in regulated markets. Functionally, both parts share identical electrical characteristics, so performance remains consistent. However, procurement teams must confirm that the replacement variant maintains traceability and conformance to REACH and ECCN requirements, particularly when exporting to regions with strict import controls.

How does the propagation delay variation across channels in the AM26LV31EIRGYRG4 impact synchronization in multi-node communication networks?: The AM26LV31EIRGYRG4 exhibits typical channel-to-channel propagation delay skew of less than 5 ns, which is critical when multiple drivers share a common bus and transmit simultaneously in half-duplex or multi-master configurations. Excessive skew can cause timing misalignment, where one node begins receiving before another has finished transmitting, potentially corrupting data frames. For networks operating above 10 Mbps, this skew must be accounted for in protocol timing budgets—such as inter-frame gaps—to ensure clean transitions. Designers should avoid cascading multiple drivers without buffering, as cumulative skew can exceed acceptable limits for synchronous protocols.

What role does the exposed thermal pad play in the packaging of the AM26LV31EIRGYRG4, and how should it be handled during PCB assembly?: The exposed thermal pad on the underside of the 16-VQFN package serves dual purposes: enhancing heat dissipation from the IC and providing electrical connection to the ground plane, improving signal return path integrity. During reflow soldering, this pad must be soldered to a dedicated copper pour connected to the primary ground net to ensure mechanical stability and thermal management. Proper soldering prevents tombstoning and ensures reliable thermal interface. Manufacturers recommend stencil printing with sufficient solder paste and avoiding via holes under the pad unless filled and capped, to prevent void formation and ensure consistent contact.

Are there any limitations in using the AM26LV31EIRGYRG4 for hot-plug applications or live insertion into powered buses?: The AM26LV31EIRGYRG4 does not include built-in hot-plug protection such as slew rate control or overvoltage clamping. When inserted while the bus is active, sudden voltage transients from other transceivers can induce latch-up or damage if ESD protection diodes conduct excessively. Although the device withstands ±15 kV HBM, repeated hot-plug events may degrade protection diodes over time. For robust implementations, consider adding TVS diodes rated for ±15 V on the A/B lines and using soft-start circuits to limit inrush current during insertion. Alternatively, employ bus-powered architectures with staggered enable sequences.

How does the low-voltage operation of the AM26LV31EIRGYRG4 affect compatibility with older RS-485 hardware designed for 5V systems?: Operating at 3.3V reduces output swing compared to 5V transceivers—typically 2.4V to 3.3V for VOH and 0V to 0.4V for VOL—which may not meet minimum input thresholds of legacy 5V receivers. If interfacing with older equipment, verify that the target device accepts logic-low levels below 0.8V and logic-high above 2.0V. Some 5V receivers have Schmitt-trigger inputs that tolerate lower voltages, but margin should be checked. Level-shifting circuitry or opto-isolators may be required in mixed-voltage environments to preserve signal integrity and prevent misinterpretation of logic states.

What are the recommended decoupling strategies for the AM26LV31EIRGYRG4 in noisy environments such as motor drives or power supplies?: In electrically noisy environments, decoupling effectiveness becomes paramount to suppress supply rail disturbances caused by inductive loads or switching regulators. Place a 0.1 µF X7R or C0G ceramic capacitor directly adjacent to the VCC and GND pins of the AM26LV31EIRGYRG4, with via connections to a solid ground plane. Supplement this with a bulk 10 µF tantalum or polymer capacitor near the power entry point. Ferrite beads can isolate the IC from high-frequency noise on the main supply line, provided they don’t introduce DC resistance that drops below 3.0V at peak load. Always simulate transient response using worst-case load steps to validate stability.

Can the AM26LV31EIRGYRG4 operate reliably in systems where multiple drivers attempt to assert the bus simultaneously?: Simultaneous assertion by multiple drivers creates bus contention, resulting in excessive current draw and potential damage to output stages. The AM26LV31EIRGYRG4 has internal foldback current limiting, but continuous contention risks overheating. Reliable operation requires strict protocol enforcement—such as token-passing or master-slave arbitration—to prevent collisions. Alternatively, use open-collector or tri-state drivers with collision detection mechanisms. If simultaneous driving is unavoidable, ensure all drivers are rated for shared-bus operation and implement external diodes or current-limiting resistors to protect individual devices.

What documentation or reference designs should accompany the AM26LV31EIRGYRG4 to accelerate evaluation and production deployment?: Texas Instruments provides SLLA398—an application report detailing PCB layout guidelines, termination schemes, and EMI reduction techniques specific to the AM26LV31 series. Additionally, TIDA-00475 is a reference design demonstrating a 4-wire isolated RS-485 network using the AM26LV31 paired with digital isolators, including BOM, Gerber files, and firmware examples. These resources help engineers avoid common pitfalls related to signal integrity, grounding loops, and isolation barriers. Eval boards such as TI’s EVM-AM26LV31 simplify initial testing and validation before committing to custom PCBs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments AM26LV31EIRGYRG4

Product Attribute
Part Number	AM26LV31EIRGYR	AM26LV31EIDRG4	AM26LV31EIPWRG4	AM26LV31EIPWR
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Type	-	-	-	-
Duplex	-	-	-	-
Data Rate	-	-	-	-
Protocol	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of Drivers/Receivers	-	-	-	-
Series	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Voltage - Supply	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42

AM26LV31EIRGYRG4 Datasheet PDF

Download AM26LV31EIRGYRG4 pdf datasheets and Texas Instruments documentation for AM26LV31EIRGYRG4 - Texas Instruments.

HTML Datasheet: AM26LV31E.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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