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HomeProductsIntegrated Circuits (ICs)Interface - ControllersDP83826IRHBR
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DP83826IRHBR - Texas Instruments

Manufacturer Part Number
DP83826IRHBR
Manufacturer
Texas Instruments
Allelco Part Number
32D-DP83826IRHBR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
30,938 pcs available, New & Original
Parts Description
LOW COST ENET PHY INDUSTRIAL
Package
32-VQFN (5x5)
Data sheet
DP83826IRHBR.pdf

Datasheets

DP83826.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 30938
  • Unit Price: $0.607
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.607 $0.61
10+ $0.497 $4.97
30+ $0.442 $13.26
100+ $0.369 $36.90
500+ $0.335 $167.50
1000+ $0.319 $319.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

DP83826IRHBR Tech Specifications
Texas Instruments - DP83826IRHBR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - DP83826IRHBR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 1.62V ~ 1.98V, 3V ~ 3.6V
Supplier Device Package 32-VQFN (5x5)
Standards IEEE 802.3, 10/100 Base-T/TX PHY
Series -
Protocol Ethernet
Package / Case 32-VFQFN Exposed Pad
Product Attribute Attribute Value
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
Interface MII, RMII
Function MAC Controller
Current - Supply 55mA
Base Product Number DP83826

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

DP83826IRHBR Image
DP83826IRHBR (1)

Manufacturer Part Number

DP83826IRHBR

Manufacturer

Texas Instruments

Introduction

Integrated Ethernet MAC Controller with PHY

Product Features and Performance

Supports 10/100 Mbps Ethernet standards

Integrated 10/100 Ethernet PHY

Automatic MDIX detection

Integrated 1.8V and 3.3V regulators

Automatic crossover detection and correction

Low power consumption

Product Advantages

Highly integrated solution

Simplified system design

Low power operation

Automatic MDIX and crossover detection

DP83826IRHBR Image
DP83826IRHBR (2)

Key Technical Parameters

32-VQFN (5x5) package

Operating temperature: -40°C to 85°C

Supply voltage: 1.62V to 1.98V, 3V to 3.6V

Supply current: 55mA

Quality and Safety Features

RoHS3 compliant

Reliable, industrial-grade design

Compatibility

Supports IEEE 802.3 10/100 Base-T/TX PHY standards

Application Areas

Embedded systems

Industrial automation

Home and building automation

Networking equipment

Product Lifecycle

Currently in production

Replacement or upgrade options available

Key Reasons to Choose This Product

Highly integrated Ethernet MAC and PHY solution

Low power consumption for energy-efficient designs

Automatic MDIX and crossover detection for simplified system integration

Wide operating temperature range for industrial applications

Reliable, RoHS3 compliant design for quality assurance

Frequently Asked Questions(FAQ)

When designing a 10/100 Ethernet interface for an industrial control system with a -40°C to +85°C ambient requirement, what are the key considerations for integrating the DP83826IRHBR, particularly regarding its dual voltage supply architecture?
The DP83826IRHBR requires careful decoupling of its dual supply rails: 1.62V to 1.98V for the core and 3.0V to 3.6V for the I/O. In a -40°C environment, regulator stability is critical, as the 55mA typical current draw can have a higher inrush during cold starts. The 1.8V core supply should be sequenced or simultaneously ramped with the 3.3V I/O rail to avoid latch-up conditions specified in the datasheet. For industrial temperature range operation, you must ensure that the voltage ripple on the 3.3V rail stays within the specified limits for the RMII or MII interface to maintain signal integrity over extended cable lengths, especially if using the MAC Interface loopback mode for diagnostic testing during system initialization.
For a space-constrained design requiring a 5x5 mm footprint, what are the practical routing trade-offs between using the MII and RMII interface modes on the DP83826IRHBR?
The DP83826IRHBR offers both MII and RMII interfaces, but the choice significantly impacts PCB layout complexity. In MII mode, you are routing up to 18 signals between the PHY and MAC, which can be difficult to achieve with matched trace lengths in a 32-VQFN (5x5) package without increasing layer count. RMII mode reduces this to approximately 9 signals, which is better suited for the 0.5mm pitch of the VQFN package. However, the trade-off is that RMII requires a 50MHz reference clock sourced from either the DP83826IRHBR’s XTAL output or an external oscillator to the MAC, and any skew on this clock line directly impacts the setup-and-hold timing margins, which are less forgiving than the 25MHz MII clocking scheme.
How does the DP83826IRHBR handle electrostatic discharge (ESD) events on the Ethernet cable in an unshielded industrial environment without external protection?
While the DP83826IRHBR integrates some level of ESD protection typical for industrial-rated PHYs, relying solely on the internal structure for port protection is generally insufficient for heavy industrial applications. The "LOW COST ENET PHY" designation indicates the internal protection is designed to handle manufacturing ESD (HBM) but not sustained surge events from long cable runs in high-EMI environments. For field deployments, you must implement external transient voltage suppression (TVS) diodes on the MDI (Media Dependent Interface) lines, specifically rated for the 10/100 Base-T/TX voltage swings, to ensure the device’s 32-VQFN package and silicon maintain long-term reliability across the -40°C to 85°C operating temperature.
When selecting between the DP83826IRHBR and a competitor’s industrial PHY with integrated magnetics, how do the BOM cost and layout density compare?
The DP83826IRHBR’s value proposition hinges on its "low cost" silicon, but this shifts costs to the external magnetics. Unlike integrated connector-magnetics (RJ45 with magnetics), using the DP83826IRHBR requires discrete magnetics that meet IEEE 802.3 isolation requirements. While the discrete approach increases the component count and requires careful routing of the 100-ohm differential pairs from pins 19-22 to the magnetics, it allows for greater flexibility in meeting EMI compliance. In terms of density, the 5x5 mm VQFN package frees up board area compared to PHYs with larger QFP packages, but this space is often consumed by the external termination resistors (4x 49.9 ohms) and center-tap capacitors required for the 10/100 Base-TX interface, which must be placed extremely close to the device pins to maintain return loss specifications.
In an application using an FPGA with a configurable MAC, what is the correct procedure to ensure the DP83826IRHBR reliably initializes the MII bus after power-up without a microcontroller?
The DP83826IRHBR relies on hardware strapping options to define its operating mode at reset. Since the device is "Not Verified" for programmable sequencing in some supply chains, you must rely on the hard-wired configuration of pins like COL (LED_CFG) and CRS (AN_EN) at the rising edge of reset. When using an FPGA, you cannot simply rely on the internal power-on reset (POR) timing. You must hold the reset pin low until the core and I/O supplies are fully stabilized (meeting the 1.62V and 3.0V minimum thresholds) and the 25MHz (MII) or 50MHz (RMII) reference clock is stable and toggling. Releasing reset before the clock is stable can result in indeterminate strap latch states, causing the MAC Interface to default to an unexpected mode, which can be difficult to debug without a register read-back mechanism.
How does the 55mA current consumption of the DP83826IRHBR impact thermal dissipation in the 32-VQFN package when operating at 85°C ambient with no airflow?
With a typical current of 55mA and maximum supply voltages of 1.98V and 3.6V, the total power dissipation can approach 300mW in worst-case conditions. The 32-VQFN (5x5) with exposed pad relies heavily on the PCB thermal vias to dissipate heat. At 85°C ambient, the junction temperature can approach the silicon limit if the thermal pad is not properly soldered to the ground plane with an adequate array of thermal vias. This is critical for industrial applications where the device might be in a sealed enclosure. The thermal performance directly impacts the long-term reliability of the analog transceiver circuitry; a rise in die temperature can shift the baseline wander correction performance, potentially reducing the maximum achievable cable length on 100-meter segments.
What specific IEEE 802.3 features are supported by the DP83826IRHBR for diagnosing cable faults in a remote industrial sensor network?
The DP83826IRHBR includes Time Domain Reflectometry (TDR) capabilities, a critical diagnostic feature for industrial applications where cable damage is common. Unlike a basic PHY, this allows the system to estimate the distance to an open or short circuit on the twisted-pair cable. The diagnostic data is accessed via the MII management interface (MDC/MDIO). When integrating this part, engineers must allocate MDIO pins to a processor to run the TDR routine during system initialization or scheduled maintenance. The resolution and accuracy of the TDR are influenced by the quality of the external magnetics and the termination impedance; any mismatch introduced by poor layout will skew the distance estimation results returned by the DP83826IRHBR.
The DP83826IRHBR supports both 3.3V and 1.8V I/O voltages. How does this dual I/O capability affect signal integrity when interfacing with a 3.3V-only MAC or FPGA?
The DP83826IRHBR’s I/O voltage is determined by the VDDIO supply pin (3V to 3.6V). If you are interfacing with a 3.3V MAC, you connect VDDIO to 3.3V. However, the device also contains a built-in 1.8V regulator for the core, which is separate. A common engineering oversight is assuming the MAC interface is 5V tolerant; it is not. The maximum voltage on the MII/RMII pins is limited by VDDIO + 0.3V. Conversely, if you attempt to run the I/O at 1.8V to interface with a low-voltage FPGA, you must ensure the VDDIO supply is tightly regulated to 1.8V ±0.18V. Droop on this 1.8V I/O rail during simultaneous switching of multiple MII data lines can cause false edge triggering on the MAC side, leading to CRC errors that are often misdiagnosed as clock jitter issues.
Given the DP83826IRHBR’s MSL rating of 1 (Unlimited), what does this imply for the manufacturing process compared to components with higher MSL ratings?
A Moisture Sensitivity Level of 1 (Unlimited) for the DP83826IRHBR indicates that the 32-VQFN package has extremely low moisture absorption characteristics. This eliminates the need for a pre-bake or dry-pack storage requirement before reflow soldering, even for devices that have been exposed to ambient humidity for extended periods. For high-volume manufacturing, this simplifies logistics and reduces the risk of popcorning (package cracking) during reflow. However, engineers should still verify that the board assembly profile matches the peak temperature rating of the package to ensure reliable solder joint formation on the exposed thermal pad, which is critical for both thermal and electrical grounding of the device.
In a mixed-supply system where the DP83826IRHBR is powered by 1.8V core and 3.3V I/O, how should power-on reset (POR) be managed to ensure reliable startup?
The DP83826IRHBR does not have a built-in supply voltage supervisor that guarantees reset assertion if only one supply ramps slowly. The POR circuit monitors both VDD (core) and VDDIO. If VDDIO reaches 3.3V while VDD is still below 1.62V, or vice versa, the internal reset state may not be properly initialized. The most robust design approach is to use a dedicated voltage supervisor IC to monitor both rails and drive the device reset pin high only after both supplies are stable and within their operating ranges. Alternatively, if using a system microcontroller, the GPIO controlling the reset must be held low for at least 1ms after the later of the two power supplies has stabilized, ensuring the internal bias currents and crystal oscillator have settled before releasing the DP83826IRHBR for operation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments DP83826IRHBR

Product Attribute DP83826IRHBT DP83826ERHBR DP83826ERHBT DP83840AVCE
Part Number DP83826IRHBT DP83826ERHBR DP83826ERHBT DP83840AVCE
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Protocol - - - -
Function - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Current - Supply - - - -
Standards - - - -
Interface - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply - - - -

DP83826IRHBR Datasheet PDF

Download DP83826IRHBR pdf datasheets and Texas Instruments documentation for DP83826IRHBR - Texas Instruments.

Datasheets
DP83826.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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2.00kg-3.00kg USD$50.00 - USD$100.00
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DP83826IRHBR Image

DP83826IRHBR

Texas Instruments
32D-DP83826IRHBR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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