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Home Products Integrated Circuits (ICs)Logic - Signal Switches, Multiplexers, Decoders~~SN74CBTD16210DGGR~~

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SN74CBTD16210DGGR - Texas Instruments

Name: Texas Instruments SN74CBTD16210DGGR
Brand: Texas Instruments
SKU: SN74CBTD16210DGGR
Price: 1.372 USD
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: SN74CBTD16210DGGR

Manufacturer: Texas Instruments

Allelco Part Number: 32D-SN74CBTD16210DGGR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 19,026 pcs available, New & Original

Parts Description: IC BUS SWITCH 10 X 1:1 48TSSOP

Package: 48-TSSOP

Data sheet: SN74CBTD16210DG.pdf

PCN Design/Specification
Cylindrical Battery Holders.pdf

HTML Datasheet
SN74CBTD16210.pdf

PCN Packaging
TSSOP Carrier Tape Chg 1/Sep/2016.pdf

RoHs Status: ROHS3 Compliant

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Specifications

SN74CBTD16210DGGR Tech Specifications
Texas Instruments - SN74CBTD16210DGGR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN74CBTD16210DGGR

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage Supply Source	Single Supply
Voltage - Supply	4.5V ~ 5.5V
Type	Bus Switch
Supplier Device Package	48-TSSOP
Series	74CBTD
Package / Case	48-TFSOP (0.240', 6.10mm Width)

Product Attribute	Attribute Value
Package	Tape & Reel (TR)
Operating Temperature	-40°C ~ 85°C
Mounting Type	Surface Mount
Independent Circuits	2
Current - Output High, Low	-
Circuit	10 x 1:1
Base Product Number	74CBTD16210

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

SN74CBTD16210DGGR (1)

Manufacturer Part Number

SN74CBTD16210DGGR

Manufacturer

Texas Instruments

Introduction

High-bandwidth bus switch designed for routing signals with minimal propagation delay.

Product Features and Performance

High-speed signal switching

Low crosstalk

Low bit-to-bit skew

Quick turn-on and turn-off times

5-ohm switch connection between two ports

Minimal power consumption

Product Advantages

Reduces signal distortion

Enhances system performance in high-speed applications

Provides improved signal integrity

Ease of signal routing in complex circuits

Robust design for high reliability

SN74CBTD16210DGGR (2)

Key Technical Parameters

10 x 1:1 bus switch configuration

Two independent circuits

Single supply voltage: 4.5V ~ 5.5V

Available in 48-TFSOP package

Operating Temperature range: -40°C to 85°C

Quality and Safety Features

Built-in over-voltage tolerance

Robust ESD protection

Compatibility

Compatible with TTL (Transistor-Transistor Logic) levels

Interoperable with a wide range of digital ICs

Application Areas

High-speed data transmission paths

Communication systems

Servers and networking equipment

Computer peripherals

Signal routing applications

Product Lifecycle

Status: Active

Continued manufacturing with no near-term discontinuation

Replacements or upgrades: Please consult Texas Instruments for future products

Several Key Reasons to Choose This Product

High signal bandwidth conserves signal integrity in fast systems

Reduced latency enhances overall system performance

Flexibility in handling multiple data paths

Durable construction for long-term reliability

Supported by Texas Instruments' commitment to quality and long-term availability

Frequently Asked Questions(FAQ)

How does the SN74CBTD16210DGGR handle signal integrity when switching between high-speed digital buses in a 5V system, and what are the practical limitations for use cases involving 10-channel bus isolation?: The SN74CBTD16210DGGR supports single-supply operation from 4.5V to 5.5V, making it suitable for standard 5V logic environments commonly found in embedded systems. Its 10 x 1:1 bus switch architecture allows bidirectional signal routing across multiple channels, which is ideal for isolating or multiplexing data lines such as in memory interfaces or peripheral communication paths. However, due to its general-purpose design without built-in impedance control or termination circuitry, signal rise and fall times may be limited by PCB trace capacitance and load conditions, especially when driving longer traces or capacitive loads beyond 50pF per channel. Designers should ensure adequate layout practices—such as minimizing stub lengths and using controlled impedance routing where necessary—to maintain timing margins above 10ns propagation delay per channel.

What is the key difference between the SN74CBTD16210DGGR and similar switches like the SN74CBT3257 when implementing bidirectional level shifting in mixed-voltage systems?: While both the SN74CBTD16210DGGR and SN74CBT3257 are Texas Instruments bus switches, the primary distinction lies in pin count and integration density. The SN74CBTD16210DGGR integrates 10 independent switches in a 48-pin package, whereas the SN74CBT3257 offers four switches in a 14-pin package. This makes the SN74CBTD16210DGGR more efficient for applications requiring multiple simultaneous connections—such as parallel bus expansion or redundant signal paths—without increasing board real estate. In contrast, the CBT3257 may suffice for simpler two-wire protocols like I²C but lacks the scalability needed for wider data buses. Additionally, the CBTD series typically features lower on-resistance (around 3.5Ω typical at 5V), enabling faster switching with less voltage drop compared to older generations.

Can the SN74CBTD16210DGGR be used to implement hot-swappable USB hubs, and what precautions must be taken regarding power sequencing and ESD protection?: The SN74CBTD16210DGGR is not inherently designed for hot-plug USB applications, which require precise current limiting, overvoltage detection, and compliance with USB-IF specifications. While its bidirectional capability supports signal routing, USB hot-swap demands additional features such as inrush current control and transient suppression that go beyond this component’s scope. Using the SN74CBTD16210DGGR in such a role would necessitate external protection circuits like TVS diodes and polyfuses to meet safety standards. Moreover, improper power sequencing could lead to latch-up if VCC ramps up before input signals stabilize. Therefore, while the device can assist in signal switching within a compliant USB hub design, it should not serve as the sole interface element for hot-swap functionality.

How does operating temperature affect the leakage current of the SN74CBTD16210DGGR, and what implications does this have for low-power battery-operated designs?: At the upper end of its specified operating range—85°C—the SN74CBTD16210DGGR exhibits increased leakage current compared to room temperature performance, though exact values aren't detailed in the datasheet. Given its sub-1µA typical off-state leakage at 25°C, it remains suitable for most battery-powered applications. However, in systems where total quiescent current must stay below 10µA average over time, prolonged operation near 85°C could push cumulative charge loss into marginal territory, particularly if many channels are left floating. Engineers should avoid leaving unused inputs unterminated or floating, as this increases effective leakage path counts. Instead, tie unused inputs to ground or VCC via appropriate resistors to minimize risk.

When replacing an obsolete bus switch in an industrial controller, how do you verify compatibility with the SN74CBTD16210DGGR in terms of package footprint and electrical characteristics?: To ensure drop-in replacement feasibility, first confirm mechanical compatibility: the SN74CBTD16210DGGR uses a 48-TSSOP package measuring 6.10mm wide with a 0.65mm pitch, matching industry-standard footprints for high-density layouts. Electrically, compare supply voltage tolerance (4.5–5.5V), on-resistance (<5Ω typical), and propagation delay (<10ns) against legacy parts. Also assess enable/disable control logic levels; the CBTD family supports active-low or active-high EN pins depending on variant, so verify control signal polarity matches existing firmware. Finally, validate thermal derating under worst-case ambient conditions: at 85°C junction temperature, output drive strength degrades slightly, potentially affecting fanout in high-capacitance environments.

Is the SN74CBTD16210DGGR suitable for automotive-grade applications requiring AEC-Q100 qualification, and what modifications might be needed?: No, the SN74CBTD16210DGGR is not qualified to AEC-Q100 standards and operates only over -40°C to +85°C, which falls short of typical automotive temperature ranges (-40°C to +125°C). While it may function reliably in non-critical infotainment subsystems with conservative thermal management, its absence of automotive-grade screening and reliability testing precludes use in safety-related functions like brake control or airbag deployment. For automotive designs, engineers should select TI’s automotive-qualified alternatives such as those in the TCANxxxx series or equivalent AEC-compliant bus switches, ensuring full traceability and failure mode analysis.

What are the recommended pull-up or pull-down resistor values when using the SN74CBTD16210DGGR to manage undefined states on bidirectional lines during MCU reset cycles?: During microcontroller reset, open-drain or tri-stated outputs may float, creating undefined conditions on shared buses routed through the SN74CBTD16210DGGR. To prevent unintended conduction, each floating input should be tied to a defined logic state using a resistor. Typical values range from 1kΩ to 10kΩ: 4.7kΩ strikes a balance between noise immunity and power draw, while 10kΩ reduces static consumption in low-current designs. Avoid lower resistances (<1kΩ) as they increase susceptibility to electrostatic discharge and elevate standby power. Place resistors as close as possible to the IC pins to minimize parasitic inductance and ensure fast settling during wake-up sequences.

How does the SN74CBTD16210DGGR perform in terms of crosstalk and mutual interference when multiple adjacent channels are simultaneously switching high-speed signals?: Due to its compact 48-pin TSSOP layout, the SN74CBTD16210DGGR exhibits moderate coupling between adjacent switch nodes, particularly at frequencies above 100MHz. Without guard rings or ground shielding between channels, switching one line can induce transient glitches on neighboring inputs, potentially causing false triggering in sensitive analog-digital mixed-signal designs. In practice, crosstalk magnitude depends heavily on PCB stackup: tighter dielectric spacing and higher dielectric constant materials exacerbate coupling. For critical applications, route high-impedance or clock signals away from active switch columns, add ground vias between adjacent signal pairs, and limit simultaneous switching activity to no more than two channels unless careful layout compensation is applied.

What is the expected lifetime and failure rate of the SN74CBTD16210DGGR under continuous thermal cycling between -20°C and +70°C in a consumer electronics product?: Although the SN74CBTD16210DGGR is rated for industrial temperature range (-40°C to +85°C), its long-term reliability under repeated thermal cycling follows established JEDEC guidelines for commercial-grade components. Assuming proper solder joint integrity and no mechanical stress, MTBF estimates exceed 100 years under normal operating conditions. Failure modes are predominantly associated with solder fatigue or electromigration rather than intrinsic semiconductor degradation. As long as the device stays within absolute maximum ratings and ambient temperatures remain stable, the probability of functional failure due to thermal cycling alone is negligible for typical consumer product lifespans (5–7 years). However, extreme vibration environments may accelerate solder joint cracks, so conformal coating or strain relief measures are advisable.

Can the SN74CBTD16210DGGR replace discrete MOSFET-based analog switches in precision measurement front-ends without degrading signal fidelity?: Generally, no. While the SN74CBTD16210DGGR offers convenient integrated switching, its inherent resistance (several ohms) and voltage offset introduce errors unsuitable for precision analog signal conditioning. In precision applications—such as sensor multiplexing or ADC input routing—discrete MOSFET switches with ultra-low Ron (<1Ω) and matched channel characteristics are preferred to preserve gain accuracy and linearity. The CBTD device’s digital nature also means it lacks soft-switching behavior, risking charge injection artifacts during rapid transitions. Thus, while acceptable for coarse digital routing, it should not substitute for true analog switches in high-resolution measurement systems.

How should the enable pin(s) of the SN74CBTD16210DGGR be managed when only a subset of the ten channels needs activation in a partial-bus reconfiguration scenario?: The SN74CBTD16210DGGR features individual channel enables, allowing selective activation without disabling the entire switch bank. Each channel has its own ENx pin, so unused channels can remain disabled to reduce power consumption and prevent back-driving. To activate only specific channels, drive their corresponding EN pins high while keeping others low. Ensure all EN lines settle before asserting valid data signals to avoid transient misrouting. If global control is desired, use a NAND gate to combine individual EN signals, but note that this approach still permits fine-grained control per channel. Always verify timing alignment between EN assertion and data transition to prevent metastability issues.

What precautions apply when soldering the SN74CBTD16210DGGR in lead-free reflow processes exceeding 260°C peak temperature?: The SN74CBTD16210DGGR is compatible with standard lead-free reflow profiles, but prolonged exposure to peak temperatures above 260°C risks delamination of the plastic package or degradation of internal bond wires. Most assembly houses target 245°C to 255°C peak with ramp rates <4°C/s. Ensure flux chemistry avoids halogen residues that could corrode copper traces post-assembly. After reflow, inspect for tombstoning or skew in adjacent leads, especially given the 0.65mm pitch. Moisture sensitivity level (MSL) 1 indicates unlimited shelf life if stored properly, but bake-out is unnecessary unless humidity exposure exceeds 30 days at 60°C/60% RH prior to processing.

In a redundant CAN bus architecture using optical couplers, where should the SN74CBTD16210DGGR be positioned relative to optoisolators for optimal noise immunity?: For maximum noise rejection in CAN bus redundancy designs, place the SN74CBTD16210DGGR between the microcontroller’s CAN transceiver and the optical coupler’s LED driver stage—not after the optocoupler. This positioning isolates digital switching noise generated by the MCU from the high-impedance analog side of the optoisolator, reducing risk of false triggering due to common-mode transients. The switch handles bidirectional TXD/RXD signaling cleanly within the 5V domain, while the optocoupler provides galvanic separation. Ensure the switch’s output slew rate is sufficient for CAN baud rates up to 1Mbps; otherwise, add RC filtering at the optocoupler input to dampen edges without distorting data integrity.

Does the SN74CBTD16210DGGR support hot insertion of daughter cards in rack-mount equipment, and what additional protections are mandatory?: Hot insertion capability requires protection against inrush current, electrostatic discharge, and voltage spikes during mating events. The SN74CBTD16210DGGR itself does not include these safeguards, so external components are essential: TVS diodes clamp inductive kickback from connectors, and current-limiting resistors (e.g., 10Ω) in series with VCC reduce surge magnitude. Additionally, use Schottky diodes to isolate local power rails until full contact is established. Never rely solely on the IC’s ESD protection diodes (rated at ±2kV HBM), as they cannot handle sustained energy from hot-plug events. Implement interlocks in firmware to delay signal assertion until power stabilizes.

How does the SN74CBTD16210DGGR compare to FPGA-based soft switches in terms of power efficiency and area utilization for large-scale bus replication?: FPGA-based routing consumes negligible static power but incurs dynamic overhead during configuration and suffers from latency and resource contention. In contrast, the SN74CBTD16210DGGR draws minimal quiescent current (<1µA) and provides deterministic, nanosecond-scale propagation delay with zero configuration time. For replicating 10 parallel buses, the IC solution saves significant PCB area versus FPGA LUT usage and eliminates timing skew across channels. However, FPGAs offer flexibility for protocol adaptation, while the CBTD device excels in fixed-function, high-throughput environments where power and determinism outweigh reprogrammability needs. Choose based on whether the application prioritizes silicon footprint and energy efficiency (IC) or adaptability (FPGA).

What steps are required to validate the SN74CBTD16210DGGR in a prototype before committing to mass production, especially regarding signal integrity and timing budgets?: Begin with schematic review to ensure correct enable logic and supply decoupling (0.1µF ceramic capacitors placed within 5mm of each VCC/GND pair). Then conduct bench tests measuring propagation delay, rise/fall times, and eye diagrams at maximum load capacitance (e.g., 100pF). Verify that all 10 channels operate independently without cross-talk using TDR or network analyzers if available. Simulate worst-case scenarios: simultaneous switching, back-to-back transitions, and supply droop. Finally, run accelerated aging tests at elevated temperature (80°C) for 1,000 hours to assess long-term stability. Only after confirming these parameters within spec should the design proceed to pilot production; otherwise, consider alternative devices with tighter tolerances or enhanced robustness.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN74CBTD16210DGGR

Product Attribute
Part Number	SN74CBTD16210DGVR	SN74CBTD16211DGGR	SN74CBTD16211DGVR	SN74CBTD16210DLG4
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Luminary Micro / Texas Instruments
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Circuit	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Series	-	-	-	-
Current - Output High, Low	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Voltage Supply Source	-	-	-	-
Type	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Independent Circuits	-	-	-	-
Voltage - Supply	-	-	-	-

SN74CBTD16210DGGR Datasheet PDF

Download SN74CBTD16210DGGR pdf datasheets and Texas Instruments documentation for SN74CBTD16210DGGR - Texas Instruments.

PCN Design/Specification: Cylindrical Battery Holders.pdf
HTML Datasheet: SN74CBTD16210.pdf
PCN Packaging: TSSOP Carrier Tape Chg 1/Sep/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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