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HomeProductsIntegrated Circuits (ICs)Linear - Video ProcessingTMDS261APAGR
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TMDS261APAGR - Texas Instruments

Manufacturer Part Number
TMDS261APAGR
Manufacturer
Texas Instruments
Allelco Part Number
98D-TMDS261APAGR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,256 pcs available, New & Original
Parts Description
PROTOTYPE
Package
64-TQFP (10x10)
Data sheet
-
RoHs Status
ROHS3 Compliant
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In stock: 6256

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Specifications

TMDS261APAGR Tech Specifications
Texas Instruments - TMDS261APAGR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMDS261APAGR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 3V ~ 3.6V
Supplier Device Package 64-TQFP (10x10)
Standards HDMI 1.3a
Series -
Package / Case 64-TQFP
Product Attribute Attribute Value
Package Bulk
Mounting Type Surface Mount
Function Switch
Control Interface GPIO, I²C
Applications Consumer Video

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant

Frequently Asked Questions(FAQ)

What are the key design considerations when selecting the TMDS261APAGR for HDMI 1.3a video switching in consumer video applications?
The TMDS261APAGR is a 64-TQFP packaged HDMI 1.3a-compliant video switch IC designed for GPIO and I2C-controlled signal routing. Designers must ensure the 3V to 3.6V supply voltage is tightly regulated, as deviations can impact signal integrity and compliance margins. Given its surface-mount 10x10 mm footprint, PCB layout should prioritize controlled impedance traces for TMDS differential pairs (100 Ω differential) and minimize crosstalk through proper spacing and grounding. Additionally, the MSL 3 moisture sensitivity level requires careful handling during assembly—exposure beyond 168 hours at ambient conditions mandates a 125°C bake prior to reflow.
How does the TMDS261APAGR compare to discrete HDMI switching solutions in terms of signal integrity and BOM complexity?
Unlike discrete FET-based HDMI switches, the TMDS261APAGR integrates matched impedance switching elements and internal termination, reducing inter-symbol interference and reflection risks at data rates up to 3.4 Gbps per channel (HDMI 1.3a bandwidth). This integration eliminates the need for external termination resistors and impedance-matching networks, lowering BOM count and improving consistency across production units. However, it offers less flexibility in routing topology compared to discrete designs, making it better suited for fixed-configuration switching rather than reconfigurable signal paths.
Can the TMDS261APAGR support daisy-chained I2C control in a multi-switch system, and what are the addressing limitations?
Yes, the TMDS261APAGR supports I2C control, but its fixed device address limits direct daisy-chaining without external logic. Each IC shares the same base address, so systems requiring multiple TMDS261APAGR devices must use GPIO-controlled enable lines or an I2C multiplexer to isolate communication. This constraint becomes critical in multi-input HDMI matrix designs where more than one switch must coexist on the same I2C bus without address conflicts.
What real-world performance trade-offs should be expected when using the TMDS261APAGR in high-ambient-temperature environments?
While the TMDS261APAGR operates within standard commercial temperature ranges, elevated ambient temperatures can increase insertion loss and jitter due to semiconductor parasitics and package thermal resistance. At 3.6V supply and 70°C ambient, measured insertion loss may rise by 0.5–1.0 dB compared to room temperature, potentially affecting eye diagram margin in long-reach or low-margin HDMI links. Thermal vias under the 64-TQFP package and adequate copper pour are recommended to maintain junction temperature below 100°C under sustained load.
How does the TMDS261APAGR handle hot-plug detection and EDID management compared to integrated HDMI retimers?
The TMDS261APAGR does not include active HPD (Hot-Plug Detect) buffering or EDID emulation—it relies on external circuitry for these functions. Unlike HDMI retimers that regenerate signals and manage EDID handshaking, this switch only routes TMDS data and clock lines. Designers must implement separate HPD signal conditioning (e.g., level shifting and debouncing) and EDID I2C routing (via a DDC multiplexer or microcontroller) to ensure full HDMI compliance, especially in source-switching applications.
What are the layout best practices for minimizing crosstalk between adjacent TMDS channels on the TMDS261APAGR?
To minimize crosstalk, maintain at least 3× the trace width spacing between adjacent TMDS differential pairs and avoid parallel routing over long distances. The 64-TQFP (10x10) package’s pinout groups TMDS channels closely; therefore, ground shielding traces or coplanar ground fills between high-speed lanes are recommended. Additionally, route all TMDS signals on the same layer with consistent reference planes—avoiding vias or layer transitions that could introduce impedance discontinuities.
Is the TMDS261APAGR suitable for automotive infotainment systems, given its RoHS3 compliance and consumer video classification?
While the TMDS261APAGR is RoHS3 compliant, its classification under consumer video applications and lack of AEC-Q100 qualification make it unsuitable for direct use in automotive environments. Automotive designs require extended temperature ranges, higher reliability under vibration, and stringent EMC performance—none of which are guaranteed by the TMDS261APAGR’s datasheet specifications. For automotive HDMI switching, qualified alternatives with AEC certification should be prioritized.
How does the TMDS261APAGR perform under repeated power cycling, and are there any known reliability concerns with its 64-TQFP package?
The TMDS261APAGR demonstrates stable operation under typical power cycling conditions, but repeated thermal stress from frequent on/off transitions can accelerate solder joint fatigue in the 64-TQFP (10x10) package, especially if PCB thermal expansion coefficients are mismatched. To mitigate risk, ensure proper pad design with thermal reliefs and avoid rapid thermal transients. Long-term reliability is improved when operating within the recommended voltage and temperature envelopes without exceeding 80% of maximum junction temperature.
What debugging techniques are effective when HDMI signal degradation is observed after routing through the TMDS261APAGR?
Begin by validating power supply ripple—exceeding 50 mVpp on the 3.3V rail can induce jitter. Use a high-bandwidth oscilloscope with differential probes to capture eye diagrams at the output; look for reduced amplitude (<400 mVpp differential) or increased rise/fall times (>150 ps). If degradation is confirmed, inspect PCB layout for impedance mismatches, stub lengths, or proximity to noisy digital lines. The TMDS261APAGR’s internal switching matrix may also introduce skew between channels—verify intra-pair and inter-pair alignment within ±5 ps for optimal performance.
Can the TMDS261APAGR be used in bidirectional HDMI signal routing, or is it limited to unidirectional switching?
The TMDS261APAGR is designed for unidirectional TMDS signal routing from inputs to outputs and does not support bidirectional operation. Its internal architecture assumes a fixed signal flow direction, and reversing signal paths can lead to improper termination and signal degradation. For bidirectional applications, such as HDMI-over-IP or KVM extenders, a different topology with dedicated bidirectional switches or signal redrivers is required.
How does the TMDS261APAGR compare to TI’s later-generation HDMI switches in terms of power efficiency and feature integration?
Compared to newer TI HDMI switches like the TMDS361B, the TMDS261APAGR lacks advanced power-saving modes, integrated HPD control, and lower quiescent current (typically 8–12 mA vs. <2 mA in standby for newer parts). While it meets HDMI 1.3a requirements, it consumes more power during active switching and offers fewer system-level integration benefits. For battery-powered or thermally constrained designs, newer alternatives provide better efficiency, albeit often at a higher unit cost.
What are the implications of the TMDS261APAGR’s MSL 3 rating on high-volume manufacturing workflows?
The MSL 3 rating means the TMDS261APAGR can be exposed to ambient conditions for up to 168 hours before requiring a dry bake. In high-volume production, this demands controlled storage (dry cabinets or nitrogen environments) and strict FIFO handling to avoid moisture absorption. If exposure exceeds the limit, a 125°C bake for 24 hours is necessary, adding process complexity and potential downtime. Automated handling systems should minimize human contact to reduce humidity exposure during placement.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMDS261APAGR

Product Attribute TMDS261BPAGR TMDS261PAGR TMDS261SPAGR TMDS261BPAG
Part Number TMDS261BPAGR TMDS261PAGR TMDS261SPAGR TMDS261BPAG
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Applications - - - -
Function - - - -
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Standards - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Control Interface - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
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Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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Texas Instruments

TMDS261APAGR

Texas Instruments
98D-TMDS261APAGR

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