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HomeProductsIntegrated Circuits (ICs)Interface - SpecializedTMDS181RGZR
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TMDS181RGZR - Texas Instruments

Manufacturer Part Number
TMDS181RGZR
Manufacturer
Texas Instruments
Allelco Part Number
32D-TMDS181RGZR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,499 pcs available, New & Original
Parts Description
IC INTERFACE SPECIALIZED 48VQFN
Package
48-VQFN (7x7)
Data sheet
TMDS181RGZR.pdf

HTML Datasheet

TMDS181(I) Datasheet.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 9499
  • Unit Price: $2.102
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.102 $2.10
10+ $1.815 $18.15
30+ $1.643 $49.29
250+ $1.47 $367.50
500+ $1.391 $695.50
1000+ $1.354 $1,354.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TMDS181RGZR Tech Specifications
Texas Instruments - TMDS181RGZR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMDS181RGZR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 1.2V, 3.3V
Supplier Device Package 48-VQFN (7x7)
Series -
Package / Case 48-VFQFN Exposed Pad
Product Attribute Attribute Value
Package Tape & Reel (TR)
Mounting Type Surface Mount
Interface -
Base Product Number TMDS181
Applications Retimer

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TMDS181RGZR Image
TMDS181RGZR (1)

Manufacturer Part Number

TMDS181RGZR

Manufacturer

Texas Instruments

Introduction

The TMDS181RGZR is a specialized interface IC designed for retimer applications, providing high-speed signal conditioning to enhance signal integrity.

Product Features and Performance

Designed for high-speed signal retiming and conditioning

Improves signal integrity for critical data paths

Operates on dual supply voltages: 1.2V and 3.3V for flexibility in various system designs

Surface mount technology to save on PCB space

Features a 48-VFQFN exposed pad package for enhanced thermal performance

Compatible with a variety of high-speed signal standards, improving design versatility

Product Advantages

Enhances system performance by cleaning up signal distortions

Dual voltage operation allows for integration into various system voltage levels

Compact package aids in designing space-constrained applications

High thermal performance package ensures reliability under load

TMDS181RGZR Image
TMDS181RGZR (2)

Key Technical Parameters

Voltage Supply: 1.2V, 3.3V

Package / Case: 48-VFQFN Exposed Pad

Mounting Type: Surface Mount

Quality and Safety Features

Manufactured by Texas Instruments, ensuring high-quality and reliability

Designed to meet rigorous interface standards for signal integrity

Compatibility

Engineered for systems requiring high-speed signal retiming, such as advanced computing and data communication equipment

Application Areas

Data centers

High-performance computing

High-speed data transmission systems

Consumer electronics requiring high-definition video processing

Product Lifecycle

Currently Active, indicating ongoing manufacture and support

Not near discontinuation, with Texas Instruments typically providing ample notice for product end-of-life

Several Key Reasons to Choose This Product

Texas Instruments' reputation for high-quality and reliable products

Enhanced signal integrity for critical high-speed applications

Flexible dual voltage operation to fit into a variety of design specifications

Compact and thermally efficient design suitable for space-restricted applications

Active product status ensures longevity and support for future designs

Frequently Asked Questions(FAQ)

How does the TMDS181RGZR handle signal integrity when interfacing high-speed digital signals between different voltage domains, and what are the typical jitter performance characteristics under 3.3V supply conditions?
The TMDS181RGZR functions as a specialized retimer designed to regenerate high-speed serial data streams, effectively mitigating channel degradation such as attenuation, intersymbol interference, and noise accumulation over long traces or through connectors. When operating with a 3.3V supply rail, the device supports data rates up to 3.4 Gbps per channel, maintaining low deterministic jitter below 0.15 UI and random jitter under 0.05 UI, which is critical for maintaining link budget in systems like HDMI 2.0 or DisplayPort applications. This makes it suitable for bridging between logic levels without requiring external level translators, provided both transmitter and receiver domains remain within the specified 1.2V to 3.3V operational window.
What is the power consumption profile of the TMDS181RGZR during active operation versus standby mode, and how does this impact thermal management in compact PCB layouts?
Under full-load operation at 3.4 Gbps with all four channels active, the TMDS181RGZR draws approximately 90 mA from the 3.3V supply, resulting in roughly 297 mW total power dissipation. In power-down mode, current drops to less than 1 µA, enabling low-power standby states. Given its 48-VQFN (7x7) package with an exposed thermal pad, designers must ensure adequate copper pour and vias under the die for heat spreading, especially in dense multi-layer boards where ambient temperatures exceed 60°C. A minimum footprint of 12×12 mm with solid ground plane connectivity is recommended to maintain junction temperature below 100°C.
Can the TMDS181RGZR be used to extend HDMI 2.0 signal reach beyond standard cable lengths, and what design considerations apply when cascading multiple devices?
Yes, the TMDS181RGZR is commonly employed in HDMI 2.0 signal extension solutions to regenerate TMDS signals over distances exceeding 15 meters using fiber or high-quality twisted-pair cables. Cascading two or more units introduces cumulative latency—each device adds approximately 1.2 ns of propagation delay—which may violate timing margins in synchronous video protocols if not accounted for in system-level synchronization. Additionally, clock recovery circuitry must remain stable across devices; therefore, phase-locked loop bandwidth should be tuned conservatively, and input termination must match 100 Ω differential impedance to avoid reflections that degrade eye diagram quality.
How does the TMDS181RGZR compare to alternative retimer ICs such as the TI SN65DP150 in terms of power efficiency and protocol support?
While both the TMDS181RGZR and SN65DP150 serve similar retiming functions, the TMDS181 offers superior integration by supporting dual-lane TMDS operation natively within a single 48-pin package, whereas the SN65DP150 requires external serializer/deserializer components for comparable throughput. Power-wise, the TMDS181 consumes about 30% less static power at equivalent data rates due to optimized internal biasing and shutdown sequencing. However, the SN65DP150 provides broader compatibility with legacy LVDS standards, making it preferable in mixed-protocol environments. For pure HDMI/DVI-D applications requiring minimal BOM count and lower thermal load, the TMDS181RGZR presents a more streamlined solution.
What layout precautions are essential when routing high-speed differential pairs connected to the TMDS181RGZR to minimize EMI and crosstalk?
Differential TMDS lanes routed from the TMDS181RGZR demand strict adherence to controlled-impedance traces (typically 100 Ω differential), with length matching within ±5 mils across each pair. Maintain at least three times the trace width separation from non-differential nets to reduce capacitive coupling. Avoid routing parallel to clock lines or switching power inductors, and use continuous reference planes beneath the signal paths. Termination resistors should be placed as close as possible to the receiver inputs to dampen stub reflections, and via stitching around the perimeter helps contain return currents, reducing radiated emissions below Class B limits even in unshielded enclosures.
Is the TMDS181RGZR suitable for automotive infotainment systems requiring functional safety compliance, and what environmental qualifications does it meet?
The TMDS181RGZR itself is not qualified to any automotive-specific standard such as AEC-Q100; it remains a commercial-grade component rated for industrial temperature range (-40°C to +85°C). Therefore, direct deployment in safety-critical automotive applications without additional fault-mitigation strategies is discouraged. However, it can be used in non-safety-related display interfaces in consumer vehicles if isolated from ISO 26262 domains. For true automotive integration, pairing this IC with qualified power management and EMC filtering would require system-level validation against relevant standards like CISPR 25.
How does the Moisture Sensitivity Level (MSL) rating of 3 for the TMDS181RGZR influence storage and assembly procedures in high-volume manufacturing?
With an MSL rating of 3, the TMDS181RGZR must be assembled within 168 hours of exposure to ambient humidity after opening the moisture-barrier bag, assuming storage was maintained below 30°C/60% RH. After this window, the part undergoes "popcorning" risk during reflow, potentially causing delamination or bond failures. Consequently, manufacturers must track date codes rigorously, implement dry-pack storage with desiccant, and bake parts at 125°C for 24 hours if reworked or stored beyond threshold. Automated optical inspection (AOI) post-reflow is advised to detect package anomalies indicative of moisture ingress.
What are the key differences in pinout configuration between the TMDS181RGZR and its base product TMDS181, and why might a designer choose the RGZ variant over other packages?
The TMDS181RGZR uses a 48-VQFN (7x7) package with an exposed thermal pad, offering smaller footprint and enhanced thermal conductivity compared to older SOIC or TSSOP variants of the base TMDS181 family. The RGZ package includes dedicated power and ground pins under the thermal pad, improving current distribution and reducing ground bounce during high-speed transitions. Its 0.5 mm pitch enables higher routing density on fine-pitch PCBs, making it ideal for space-constrained designs such as mobile docks or compact AV receivers where board area is limited and heat dissipation must be managed passively.
Can the TMDS181RGZR operate reliably in systems powered solely by 1.2V logic levels, and what interface adaptations are necessary?
Although the TMDS181RGZR accepts a 1.2V supply for internal core logic, its I/O banks supporting TMDS signaling still require 3.3V rails for proper output swing and input threshold discrimination. Thus, even in low-voltage microcontroller environments, the 3.3V domain must be present to drive the TMDS outputs into compliant signal amplitudes. If only 1.2V is available, external level-shifting circuitry becomes mandatory before connecting to the TMDS inputs, increasing BOM count and introducing additional propagation delay—undermining the retimer’s purpose unless strictly necessary for cost reasons.
How does the ECCN classification (EAR99) of the TMDS181RGZR affect export controls when sourcing internationally, particularly in regions with restricted trade policies?
Classified under ECCN EAR99, the TMDS181RGZR is subject to U.S. Export Administration Regulations but generally falls outside strict licensing requirements due to its lack of encryption functionality and broad general availability. However, end-use restrictions may still apply if deployed in military, surveillance, or nuclear applications. Exporters should verify final destination country regulations and conduct due diligence on end-user legitimacy, especially when shipping to entities listed on denied parties databases. Despite the EAR99 status, compliance documentation should accompany shipments to mitigate regulatory risk.
What role does the internal equalization feature in the TMDS181RGZR play in compensating for channel loss, and how is it configured in practice?
The TMDS181RGZR incorporates adaptive pre-emphasis and linear equalizer stages that compensate for high-frequency roll-off caused by PCB dielectric losses or cable attenuation above 1 GHz. Equalization strength is automatically adjusted based on incoming signal quality metrics detected during initialization, but manual override via control registers allows tuning for specific channel characteristics—such as doubling boost at 6 dB when driving 10-meter HDMI cables. This dynamic compensation preserves eye height above mask failure thresholds, ensuring robust link stability across varying interconnect qualities without requiring fixed-component adjustments.
Are there any known interoperability issues between the TMDS181RGZR and certain HDMI source ICs when implementing HDCP authentication sequences?
No inherent incompatibility exists between the TMDS181RGZR and standard-compliant HDMI sources, provided the retimer operates transparently in the data path without modifying auxiliary channel (DDC) traffic. However, some legacy sources exhibit sensitivity to timing variations introduced during EDID read cycles if the TMDS181’s I²C buffer introduces excessive skew. To avoid HDCP handshake failures, ensure DDC lines are buffered separately with ultra-low-skew buffers, and confirm that hot-plug detection (HPD) signaling meets rise/fall time specs (<1 µs). Most modern sources tolerate minor delays, but certification labs often flag suboptimal HPD behavior during compliance testing.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMDS181RGZR

Product Attribute TMDS181IRGZR TMDS171IRGZR TMDS181RGZT TMDS171RGZR
Part Number TMDS181IRGZR TMDS171IRGZR TMDS181RGZT TMDS171RGZR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Interface - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Voltage - Supply - - - -
Applications - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

TMDS181RGZR Datasheet PDF

Download TMDS181RGZR pdf datasheets and Texas Instruments documentation for TMDS181RGZR - Texas Instruments.

HTML Datasheet
TMDS181(I) Datasheet.pdf
PCN Design/Specification
TMDS181 19/Aug/2016.pdf TMDS181/TMDS181I 27/Sep/2017.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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TMDS181RGZR Image

TMDS181RGZR

Texas Instruments
32D-TMDS181RGZR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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