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HomeProductsIntegrated Circuits (ICs)Interface - SpecializedTMDS171IRGZR
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TMDS171IRGZR - Texas Instruments

Manufacturer Part Number
TMDS171IRGZR
Manufacturer
Texas Instruments
Allelco Part Number
32D-TMDS171IRGZR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,722 pcs available, New & Original
Parts Description
IC INTERFACE SPECIALIZED 48VQFN
Package
48-VQFN (7x7)
Data sheet
TMDS171IRGZR.pdf

HTML Datasheet

TMDS171(I) Datasheet.pdf
RoHs Status
ROHS3 Compliant
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In stock: 11722
  • Unit Price: $3.738
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $3.738 $3.74
10+ $3.33 $33.30
30+ $3.07 $92.10
100+ $2.818 $281.80
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TMDS171IRGZR Tech Specifications
Texas Instruments - TMDS171IRGZR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMDS171IRGZR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 3.135V ~ 3.465V
Supplier Device Package 48-VQFN (7x7)
Series -
Package / Case 48-VFQFN Exposed Pad
Product Attribute Attribute Value
Package Tape & Reel (TR)
Mounting Type Surface Mount
Interface I²C
Base Product Number TMDS171
Applications Retimer

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TMDS171IRGZR Image
TMDS171IRGZR (1)

Manufacturer Part Number

TMDS171IRGZR

Manufacturer

Texas Instruments

Introduction

The TMDS171IRGZR is a high-speed interface retimer from Texas Instruments designed to enhance signal quality for various digital video applications.

Product Features and Performance

Supports HDMI 1.4 and DVI interfaces

Enhances signal quality over long cable distances

Supports data rates up to 3.4 Gbps

Features I2C interface for control and monitoring

Adaptive Equalization for optimized signal quality

Programmable transmitter pre-emphasis and output swing

Low power consumption

ESD protection

Product Advantages

Reduces signal integrity issues in video transmission

Improves user experience by maintaining video quality

Flexible integration with other systems through I2C

Enhanced durability with built-in ESD protection

Reduces the need for additional signal conditioning hardware

TMDS171IRGZR Image
TMDS171IRGZR (2)

Key Technical Parameters

I2C Interface support

135V to 3.465V supply voltage range

48-VFQFN Exposed Pad package

Surface-mount technology

Quality and Safety Features

Incorporates advanced signal conditioning technology

Robust ESD protection circuitry

Compatibility

Compatible with HDMI 1.4 and DVI standards

Supports a variety of video devices and systems

Application Areas

Digital TVs

Game Consoles

Digital Signage

Video Projectors

Computer Monitors

Product Lifecycle

Currently active product status

Not nearing discontinuation at the time of knowledge cutoff

Replacements or upgrades should be checked with Texas Instruments

Several Key Reasons to Choose This Product

Improves video signal integrity for a high-quality viewing experience

Supports high data rate transmissions, making it suitable for advanced digital video applications

Backward compatible with HDMI and DVI interfaces

Low power operation for energy-efficient designs

Ease of design integration with surface-mount packaging and I2C control

Texas Instruments' reputation for reliability and quality in semiconductor manufacturing

Frequently Asked Questions(FAQ)

How does the TMDS171IRGZR support system-level timing recovery in high-speed serial link designs, and what are the implications for jitter tolerance?
The TMDS171IRGZR operates as a retimer IC that regenerates clock and data signals by extracting the embedded clock from incoming high-speed serial streams and reconstructing clean output data. This process inherently improves jitter performance by filtering out accumulated transmission impairments. With a supply voltage range of 3.135V to 3.465V, it is optimized for 3.3V digital logic environments commonly used in video and display interface applications. The device supports I2C configuration, allowing system designers to adjust internal parameters such as equalization and de-emphasis based on channel characteristics. In practical deployment, this means that systems using the TMDS171IRGZR can maintain reliable signal integrity over longer cable lengths or through connectors with higher insertion loss compared to non-regenerated links.
What design considerations should be taken into account when integrating the TMDS171IRGZR into a PCB layout to ensure optimal performance and minimize EMI?
Given its operation at high frequencies typical of HDMI or DisplayPort retimer applications, proper PCB layout is critical for the TMDS171IRGZR. The 48-VQFN (7x7) package includes an exposed thermal pad that must be properly soldered and connected to a solid ground plane to ensure thermal dissipation and electrical stability. High-speed differential pairs—such as TMDS data channels—should maintain controlled impedance (typically 100 Ω differential), avoid vias unless absolutely necessary, and be routed as tightly coupled traces. Power delivery requires decoupling capacitors placed as close as possible to the VCC pins, especially considering the narrow supply window around 3.3V. Ground return paths should be minimized in length, and analog and digital grounds may need careful partitioning if the IC contains mixed-signal blocks. These practices help reduce electromagnetic emissions and improve noise immunity, which is essential in consumer electronics where regulatory compliance is required.
Can the TMDS171IRGZR be used in automotive applications, and what environmental and qualification criteria apply?
While the TMDS171IRGZR is not inherently qualified for automotive temperature grades beyond standard commercial specifications, its base product number TMDS171 suggests compatibility with industrial-grade interfaces. However, automotive systems often require AEC-Q100 certification, extended operating temperatures (-40°C to +125°C), and additional reliability testing not reflected in the current datasheet. If deployed in automotive infotainment or ADAS displays, engineers must verify that the entire system—including connectors, cables, and power management—meets automotive standards. The RoHS3 and REACH compliance indicate adherence to hazardous substance restrictions but do not imply automotive suitability. Therefore, direct use in automotive environments would require further qualification unless supplemented with appropriate derating and environmental controls.
How does the TMDS171IRGZR compare to alternative retimer solutions like the TI TPS650861 or external FPGA-based approaches in terms of power efficiency and latency?
Unlike the TPS650861—a power management IC rather than a signal regenerator—the TMDS171IRGZR is specifically designed for high-speed serial signal regeneration with minimal latency. FPGA-based retimers offer flexibility but consume significantly more power due to parallel processing overhead and clock domain complexity. In contrast, the TMDS171IRGZR integrates specialized SerDes circuitry optimized for low-latency, low-power retiming of TMDS signals. Typical power consumption ranges from tens of milliwatts under normal operation, making it suitable for battery-powered or space-constrained devices. Its fixed-function architecture avoids the configuration overhead of FPGAs and ensures deterministic timing behavior. For applications where signal integrity over distance or connector loss is paramount, the TMDS171IRGZR provides a more efficient and reliable solution than software-defined alternatives.
What role does the I2C interface play in configuring the TMDS171IRGZR, and how can developers leverage it for real-time optimization during system bring-up?
The I2C interface enables access to internal registers that control features such as input equalization, output de-emphasis, loop bandwidth, and power-down modes. During system bring-up, engineers can dynamically adjust these settings based on observed eye diagram quality or BER performance. For instance, increasing input equalization may compensate for high-frequency loss in long cables, while adjusting de-emphasis helps match output drive strength to downstream receivers. Because I2C operates at much lower speeds than the TMDS lanes, it introduces negligible latency to the high-speed path. This configurability allows fine-tuning without hardware changes, supporting iterative optimization across different PCB versions or environmental conditions. Proper implementation requires pull-up resistors on SDA/SCL lines and careful attention to bus loading and timing constraints.
Is there a recommended method for verifying TMDS signal integrity when using the TMDS171IRGZR in a prototype stage?
Yes. Using a high-bandwidth oscilloscope with active differential probes capable of capturing rise times below 35 ps is essential for evaluating the TMDS171IRGZR’s output performance. Key metrics include peak-to-peak jitter, eye height, and eye width—particularly at the receiver end after regeneration. Additionally, a BERT (Bit Error Rate Test) setup can quantify link margin under various stress conditions such as temperature or cable length. It is also advisable to monitor power supply ripple on the 3.3V rail using a spectrum analyzer or fast-sampling DMM to ensure it does not couple into the high-speed signals. Observing the I2C communication with a logic analyzer helps confirm successful register reads/writes, ensuring the device is correctly configured before full-speed operation.
How does the moisture sensitivity level (MSL) rating of 3 for the TMDS171IRGZR affect storage and handling in manufacturing?
An MSL of 3 indicates that the TMDS171IRGZR is sensitive to moisture and must be handled according to IPC/JEDEC J-STD-033 guidelines. After opening the moisture barrier bag, the component should be processed within 168 hours (7 days) at 30°C/60% RH or less. If stored in a dry cabinet (below 10% RH), the window extends to 168 hours plus the time spent in ambient conditions. Failure to adhere to these rules risks popcorning during reflow soldering, which can crack the die or compromise solder joints. Manufacturers must track bake cycles and use desiccant packs in shipping containers. Proper documentation and traceability are required for audit purposes, especially in high-reliability production environments.
Can the TMDS171IRGZR operate reliably in systems with noisy power rails, and what measures mitigate susceptibility to power supply variations?
The TMDS171IRGZR specifies a tight supply range of 3.135V to 3.465V, corresponding to nominal 3.3V ±5%. Operation outside this range risks functional failure or degraded signal integrity. To mitigate noise, designers should implement local LDO regulation close to the IC, use multilayer PCBs with dedicated power and ground planes, and place bulk capacitance (e.g., 10 µF ceramic) alongside high-frequency decoupling caps (0.1 µF). Ferrite beads may be added selectively if switching regulators are upstream. Additionally, minimizing loop area in power traces reduces inductance, which is crucial for high-speed circuits. Monitoring startup behavior under worst-case load transients ensures robust initialization, particularly when multiple ICs share the same power rail.
Are there any known limitations regarding backward compatibility when using the TMDS171IRGZR with older HDMI versions?
The TMDS171IRGZR is designed for general-purpose TMDS signal regeneration and does not enforce specific HDMI protocol versions. As such, it can support HDMI 1.0 through HDMI 2.1 content, provided the host and sink devices comply with their respective standards. However, advanced features like HDCP encryption, CEC control, or deep color encoding are typically handled at the protocol layer above the physical TMDS signal. Since the TMDS171IRGZR only regenerates the electrical TMDS lanes, it does not perform authentication or packet decoding. Thus, compatibility depends on the broader system implementation rather than the retimer itself. Engineers should verify that auxiliary data channels (if used) are routed separately and that EDID communication remains uninterrupted through the I2C pass-through or separate connection.
What impact does package size have on thermal performance when using the TMDS171IRGZR in densely populated boards?
The 48-pin VQFN (7x7 mm) package offers a balance between pin count and board real estate, making it suitable for compact designs. However, its small form factor limits exposed copper area for heat spreading. Although the IC consumes modest power (<100 mW typically), localized heating can still occur during prolonged operation. Adequate thermal relief and connection of the exposed pad to an internal or bottom-layer ground plane enhance convective cooling. In high-ambient-temperature environments or enclosed enclosures, consider adding vias under the pad to draw heat toward heatsinks or adjacent copper pours. Thermal simulations or empirical testing under maximum load are recommended to validate junction temperature, especially if adjacent components generate significant heat.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMDS171IRGZR

Product Attribute TMDS181IRGZR TMDS171RGZR TMDS171IRGZT TMDS181RGZR
Part Number TMDS181IRGZR TMDS171RGZR TMDS171IRGZT TMDS181RGZR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Applications - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Interface - - - -
Voltage - Supply - - - -
Series - - - -

TMDS171IRGZR Datasheet PDF

Download TMDS171IRGZR pdf datasheets and Texas Instruments documentation for TMDS171IRGZR - Texas Instruments.

HTML Datasheet
TMDS171(I) Datasheet.pdf
PCN Design/Specification
Mult Dev Material Chg 29/Mar/2018.pdf TMDS171/TMDS171I 16/Dec/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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TMDS171IRGZR Image

TMDS171IRGZR

Texas Instruments
32D-TMDS171IRGZR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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