Please refer to the English Version as our Official Version.

Europe: France~~(Français)~~ Germany~~(Deutsch)~~ Italy~~(Italia)~~ Russian~~(русский)~~ Poland~~(polski)~~ Czech~~(Čeština)~~ Luxembourg~~(Lëtzebuergesch)~~ Netherlands~~(Nederland)~~ Iceland~~(íslenska)~~ Hungarian~~(Magyarország)~~ Spain~~(español)~~ Portugal~~(Português)~~ Turkey~~(Türk dili)~~ Bulgaria~~(Български език)~~ Ukraine~~(Україна)~~ Greece~~(Ελλάδα)~~ Israel~~(עִבְרִית)~~ Sweden~~(Svenska)~~ Finland~~(Svenska)~~ Finland~~(Suomi)~~ Romania~~(românesc)~~ Moldova~~(românesc)~~ Slovakia~~(Slovenská)~~ Denmark~~(Dansk)~~ Slovenia~~(Slovenija)~~ Slovenia~~(Hrvatska)~~ Croatia~~(Hrvatska)~~ Serbia~~(Hrvatska)~~ Montenegro~~(Hrvatska)~~ Bosnia and Herzegovina~~(Hrvatska)~~ Lithuania~~(lietuvių)~~ Spain~~(Português)~~ Switzerland~~(Deutsch)~~ United Kingdom~~(English)~~

Asia/Pacific: Japan~~(日本語)~~ Korea~~(한국의)~~ Thailand~~(ภาษาไทย)~~ Malaysia~~(Melayu)~~ Singapore~~(Melayu)~~ Vietnam~~(Tiếng Việt)~~ Philippines~~(Pilipino)~~

Africa, India and Middle East: United Arab Emirates~~(العربية)~~ Iran~~(فارسی)~~ Tajikistan~~(فارسی)~~ India~~(हिंदी)~~ Madagascar~~(malaɡasʲ)~~

South America / Oceania: New Zealand~~(Maori)~~ Brazil~~(Português)~~ Angola~~(Português)~~ Mozambique~~(Português)~~

North America: United States~~(English)~~ Canada~~(English)~~ Haiti~~(Ayiti)~~ Mexico~~(español)~~

Home Products Integrated Circuits (ICs)Embedded - DSP (Digital Signal Processors)~~TMS320C5514AZCH12~~

Image may be representation.
See specifications for product details.

~~Favorite~~

EXPRESS OPTION

Payment method

TMS320C5514AZCH12 - Texas Instruments

Manufacturer Part Number: TMS320C5514AZCH12

Manufacturer: Texas Instruments

Allelco Part Number: 98D-TMS320C5514AZCH12

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 34,757 pcs available, New & Original

Parts Description: IC DSP FIXED-POINT 196NFBGA

Package: 196-NFBGA (10x10)

Data sheet: TMS320C5514AZCH.pdf

PCN Packaging
10x10 BGA 29/Apr/2013.pdf Revision 20/Jun/2016.pdf

PCN Design/Specification
TMS320C55x4,TMS320C55x5 Datasheet Update 05/Nov/20.pdf

HTML Datasheet
TMS320C5514.pdf

RoHs Status: ROHS3 Compliant

~~Compare~~

Our certification

In stock: 34757

Unit Price: $4.552
Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity	Unit Price	Ext. Price
1+	$4.552	$4.55
200+	$1.763	$352.60
500+	$1.70	$850.00
1000+	$1.67	$1,670.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TMS320C5514AZCH12 Tech Specifications
Texas Instruments - TMS320C5514AZCH12 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320C5514AZCH12

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	1.8V, 2.5V, 2.8V, 3.3V
Voltage - Core	1.30V
Type	Fixed Point
Supplier Device Package	196-NFBGA (10x10)
Series	TMS320C55x
Package / Case	196-LFBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-10°C ~ 70°C (TC)
On-Chip RAM	256kB
Non-Volatile Memory	ROM (128kB)
Mounting Type	Surface Mount
Interface	EBI/EMI, I²C, I²S, MMC/SD, SPI, UART/USART, USB
Clock Rate	120MHz
Base Product Number	TMS320

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

What are the key considerations when selecting the TMS320C5514AZCH12 for low-power signal processing applications?: The TMS320C5514AZCH12 integrates a 120MHz fixed-point DSP core with 256kB of on-chip RAM and 128kB ROM, enabling efficient execution of complex algorithms without external memory bottlenecks. Its multiple I/O voltage options (1.8V, 2.5V, 2.8V, 3.3V) allow interface flexibility with peripheral devices operating at different logic levels, while the 1.30V core voltage supports dynamic power scaling. Engineers should evaluate the device’s idle and active current profiles under typical workloads—such as voice codecs or sensor fusion—to ensure compatibility with battery-powered systems. The 196NFBGA package also supports compact layouts, but thermal dissipation must be assessed given the 10x10mm footprint and surface-mount constraints.

How does the TMS320C5514AZCH12 compare to other members of the TMS320C55x series in terms of memory and peripheral integration?: The TMS320C5514AZCH12 offers a balanced configuration with 256kB RAM and 128kB ROM, which is sufficient for mid-tier embedded audio and industrial control applications. Compared to lower-end C55x variants with reduced on-chip memory, this model reduces dependency on external SDRAM, lowering system cost and complexity. However, it lacks the larger RAM blocks found in higher-tier C55x+ devices, making it less suitable for applications requiring extensive data buffering. Its peripheral set—including EBI/EMI, USB, and multiple serial interfaces—provides broader connectivity than basic C55x models, though it omits advanced features like Ethernet MAC or high-speed ADCs present in competing architectures.

Can the TMS320C5514AZCH12 operate reliably in industrial temperature environments?: The TMS320C5514AZCH12 is rated for an operating temperature range of -10°C to 70°C (case temperature), which aligns with commercial-grade specifications. This limits its use in harsh industrial environments where ambient temperatures may exceed 70°C or drop below -10°C without additional thermal management. Designers targeting industrial applications should consider heat dissipation through PCB copper pours and airflow, as junction temperatures may rise significantly under sustained 120MHz operation. For extended temperature ranges, alternative automotive or industrial-grade DSPs from TI’s portfolio may be more appropriate.

What are the implications of the 196NFBGA package on PCB design and manufacturing yield?: The 196NFBGA package (10x10mm, 0.8mm pitch) demands precise PCB layout practices, including controlled impedance routing for high-speed signals and via-in-pad or microvia techniques to manage escape routing. The fine pitch increases the risk of solder bridging during reflow, requiring strict adherence to stencil design and solder paste volume control. Additionally, the Moisture Sensitivity Level (MSL) of 3 (168 hours floor life) necessitates dry storage and baking protocols if exposure limits are exceeded. These factors can impact assembly yield and should be addressed early in the design phase through DFM (Design for Manufacturing) reviews.

How does the TMS320C5514AZCH12 support real-time audio processing with its integrated peripherals?: The TMS320C5514AZCH12 includes dedicated I2S and MMC/SD interfaces, enabling direct connection to audio codecs and digital microphones without external glue logic. Combined with the 120MHz core and 256kB RAM, it can handle multi-channel audio pipelines such as beamforming or echo cancellation with low latency. The USB interface allows firmware updates or data streaming, while SPI and I2C support control of external audio components. Engineers should verify interrupt latency and DMA throughput during concurrent peripheral use to ensure deterministic response times in real-time audio applications.

What power management strategies are effective when using the TMS320C5514AZCH12 in portable systems?: The TMS320C5514AZCH12 supports dynamic voltage and frequency scaling through software-controlled clock gating and power domains. By reducing the core clock below 120MHz during low-compute tasks and leveraging idle modes, designers can significantly extend battery life. The 1.30V core supply enables lower dynamic power compared to higher-voltage alternatives, but care must be taken to ensure stable I/O signaling when mixing 1.8V and 3.3V interfaces. Power supply sequencing and transient response of the core and I/O rails should be validated under worst-case load conditions to prevent brownouts.

How does the TMS320C5514AZCH12 handle mixed-voltage I/O interfacing in a multi-supply system?: The TMS320C5514AZCH12 supports multiple I/O voltage levels (1.8V, 2.5V, 2.8V, 3.3V), allowing direct connection to a variety of sensors, memory, and communication ICs without level shifters. However, simultaneous operation at different I/O voltages requires careful power rail sequencing to avoid latch-up or signal contention. The EBI/EMI interface, for example, can interface with 3.3V SRAM while the I2C bus operates at 1.8V for low-power sensors. Engineers must ensure that input thresholds are compatible across voltage domains and that unused pins are properly terminated to prevent leakage.

What development tools and software ecosystem support the TMS320C5514AZCH12?: The TMS320C5514AZCH12 is supported by Texas Instruments’ Code Composer Studio (CCS) IDE, which includes optimized compilers, debuggers, and DSP libraries for common signal processing functions. TI provides device-specific headers, bootloader examples, and reference designs for audio and industrial applications. Additionally, the TMS320C55x architecture benefits from legacy software compatibility, allowing reuse of code from earlier C55x projects. Engineers should verify library support for USB and MMC/SD protocols, as implementation complexity can vary based on stack integration.

How does the TMS320C5514AZCH12 compare to ARM Cortex-M7-based MCUs for digital signal processing tasks?: The TMS320C5514AZCH12 offers superior computational efficiency for fixed-point DSP workloads due to its optimized instruction set and hardware multiply-accumulate (MAC) units, achieving higher MIPS per milliwatt in signal processing kernels. While Cortex-M7 devices may offer higher clock speeds and floating-point support, the TMS320C5514AZCH12 excels in deterministic, low-latency applications such as FIR filtering or FFTs. However, it lacks the general-purpose processing flexibility and rich OS support of ARM-based MCUs, making it better suited for dedicated signal processing rather than complex control tasks.

What are the risks of using the TMS320C5514AZCH12 in designs requiring long-term firmware storage?: The TMS320C5514AZCH12 includes 128kB of on-chip ROM, which is typically used for boot code and critical firmware routines. However, application code must reside in RAM or external memory, increasing vulnerability to corruption during power cycles or EMI events. For field-upgradable systems, engineers should implement robust bootloaders via SPI, UART, or USB and consider external non-volatile memory for firmware storage. The lack of embedded flash necessitates careful validation of memory initialization sequences and error-handling mechanisms during startup.

Can the TMS320C5514AZCH12 support real-time operating systems (RTOS), and what are the memory constraints?: Yes, the TMS320C5514AZCH12 can run lightweight RTOS such as TI-RTOS or FreeRTOS, leveraging its 256kB RAM for task stacks, heaps, and peripheral drivers. However, memory fragmentation and stack allocation must be carefully managed, especially when using multiple communication interfaces concurrently. The absence of an MMU limits virtual memory use, requiring static memory planning. Engineers should profile memory usage during worst-case task scheduling to avoid overflow, particularly in applications combining USB, I2S, and external memory access.

What EMI/EMC considerations apply when designing with the TMS320C5514AZCH12?: The 120MHz core clock and high-speed I/O interfaces (e.g., EBI/EMI, USB) generate significant electromagnetic emissions, requiring careful PCB layout with ground planes, decoupling capacitors, and controlled trace lengths. The 196NFBGA package’s low inductance improves signal integrity but demands tight impedance control on high-speed nets. Engineers should follow TI’s layout guidelines for crystal oscillators and power delivery networks, and consider shielding or filtering for sensitive analog sections. Pre-compliance testing is recommended, especially for consumer audio or medical devices requiring FCC or CE certification.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TMS320C5514AZCH12

Product Attribute
Part Number	TMS320C5514AZCHA12	TMS320C5515AZCHA12	TMS320C5515AZCH12	TMS320C5504AZCHA12
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Type	-	-	-	-
Non-Volatile Memory	-	-	-	-
Clock Rate	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Voltage - I/O	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Core	-	-	-	-
On-Chip RAM	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Interface	-	-	-	-
Series	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

TMS320C5514AZCH12 Datasheet PDF

Download TMS320C5514AZCH12 pdf datasheets and Texas Instruments documentation for TMS320C5514AZCH12 - Texas Instruments.

PCN Packaging: 10x10 BGA 29/Apr/2013.pdf Revision 20/Jun/2016.pdf
PCN Design/Specification: TMS320C55x4,TMS320C55x5 Datasheet Update 05/Nov/20.pdf
HTML Datasheet: TMS320C5514.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA