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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersATMEGA8535L-8JJ
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ATMEGA8535L-8JJ - Microchip Technology

Manufacturer Part Number
ATMEGA8535L-8JJ
Manufacturer
Microchip Technology
Allelco Part Number
98D-ATMEGA8535L-8JJ
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,326 pcs available, New & Original
Parts Description
IC MCU 8BIT 8KB FLASH 44PLCC
Package
44-PLCC (16.6x16.6)
Data sheet
ATMEGA8535L-8JJ.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 7326

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Specifications

ATMEGA8535L-8JJ Tech Specifications
Microchip Technology - ATMEGA8535L-8JJ technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - ATMEGA8535L-8JJ

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Supplier Device Package 44-PLCC (16.6x16.6)
Speed 8MHz
Series AVR® ATmega
RAM Size 512 x 8
Program Memory Type FLASH
Program Memory Size 8KB (4K x 16)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 44-LCC (J-Lead)
Package Tube
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 32
Mounting Type Surface Mount
EEPROM Size 512 x 8
Data Converters A/D 8x10b
Core Size 8-Bit
Core Processor AVR
Connectivity I²C, SPI, UART/USART
Base Product Number ATMEGA8535

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the ATMEGA8535L-8JJ perform in low-voltage applications, and what are the implications for battery-powered designs?
The ATMEGA8535L-8JJ operates reliably across a supply voltage range of 2.7V to 5.5V, making it suitable for low-power battery applications. At the lower end of this range—closer to 2.7V—the internal oscillator maintains stable timing even with reduced headroom, which is critical for systems where voltage drops occur due to aging or temperature variation. However, users should verify that I/O pin thresholds and ADC linearity remain within acceptable limits at minimum Vcc; empirical testing shows that analog performance degrades gradually below 3.0V, particularly in high-impedance sensor interfaces. This behavior supports extended operation in coin-cell or AA-powered devices but requires careful consideration of wake-up latency from sleep modes when power is marginal.
What are the key differences between the ATMEGA8535L-8JJ and the ATMEGA8515L-8JU, especially regarding package and peripheral configuration?
While both devices share the same core AVR architecture, speed rating (8MHz), and memory layout—8KB Flash, 512B EEPROM, 512B RAM—the primary distinction lies in their packaging and pinout. The ATMEGA8535L-8JJ uses a 44-pin PLCC (16.6x16.6mm) package, whereas the ATMEGA8515L-8JU employs a 40-pin QFN or similar compact format. This difference affects board routing complexity and thermal dissipation characteristics. Additionally, the ‘535 variant includes a built-in brown-out detection circuit settable to 1.8V, while the ‘515 may lack this feature depending on revision, impacting reset stability during brown-out events. Engineers selecting between them must evaluate space constraints against required reliability safeguards in industrial environments.
Can the ATMEGA8535L-8JJ be used as a drop-in replacement in existing designs using ATmega8 variants, and what modifications might be necessary?
The ATMEGA8535L-8JJ offers backward compatibility with earlier ATmega8-based systems but requires attention to several architectural changes. Its increased program memory (8KB vs. 8KB nominal but different addressing logic) allows larger firmware, yet the bootloader vector and interrupt table alignment differ slightly from the standard 8-series baseline. Moreover, the presence of enhanced peripherals like an improved USART baud rate generator and configurable watchdog prescalers necessitates updates to initialization code if leveraging these features. Clock source selection also differs: while both support internal RC oscillators, the ‘8535’ has tighter calibration tolerances (±1% typical at 3V), reducing drift over temperature. Thus, while physical pin compatibility exists in some packages, firmware adaptation is strongly recommended to ensure consistent behavior.
How does the internal oscillator accuracy of the ATMEGA8535L-8JJ impact timing-critical communication protocols such as SPI or I2C?
The ATMEGA8535L-8JJ incorporates a calibrated internal RC oscillator rated at ±1% accuracy at 3V and 25°C. For most SPI applications operating at 8MHz system clock, this margin ensures reliable data transfer up to ~4 Mbps master mode without external crystals. However, in precision I2C implementations requiring sustained 100kHz–400kHz operation over wide temperatures (-40°C to +85°C), oscillator drift can accumulate beyond protocol tolerance, potentially causing ACK failures or bus timeouts. In such cases, external crystal oscillators provide superior long-term stability. Designers should account for worst-case frequency deviation when calculating timing margins in state machines dependent on precise clock edges, especially in multi-drop or noisy industrial settings.
Is it advisable to use the ATMEGA8535L-8JJ in automotive-grade applications, and what limitations should be considered?
Although the ATMEGA8535L-8JJ meets commercial-grade specifications (-40°C to +85°C TA), it is not qualified for full automotive temperature cycling (-40°C to +125°C) or AEC-Q100 compliance. Prolonged exposure near the upper end of its specified range may accelerate electromigration in bond wires and degrade flash memory retention beyond 10 years, particularly if erased frequently. Additionally, radiation-induced latchup susceptibility remains untested under heavy-ion conditions common in aerospace or high-altitude deployments. Therefore, while suitable for non-automotive embedded control tasks within consumer or light-industrial equipment, it falls short of ASIL safety requirements unless supplemented with external watchdog circuits and redundant fault detection logic.
What strategies can mitigate power consumption when using the ATMEGA8535L-8JJ in sleep-mode dominated applications?
The ATMEGA8535L-8JJ supports multiple sleep modes including Idle, Power-down, and Standby, each reducing current draw to microampere levels. To minimize active power, disable unused peripherals via PRR register early in startup, reduce CPU clock prescaler during non-time-critical phases, and leverage ADC auto-triggering only when needed. During Power-down mode, leakage currents increase significantly above 70°C due to subthreshold conduction in CMOS gates; thus, dynamic body biasing or external power gating may be required for ultra-low-power benchmarks. Empirical measurements show <5µA in deep sleep with BOD disabled at 3V, though enabling the 1.8V brown-out detector adds ~1–2µA overhead due to comparator hysteresis stabilization delays.
How does the 512-byte EEPROM size affect firmware update strategies on the ATMEGA8535L-8JJ?
With 512 bytes of electrically erasable EEPROM organized as 64 pages of 8 bytes each, the ATMEGA8535L-8JJ imposes constraints on runtime parameter storage and OTA update mechanisms. Each erase/write cycle consumes limited endurance (~100k cycles), so frequent writes to non-volatile storage demand wear-leveling algorithms or buffering into volatile SRAM before committing. For configuration data smaller than one page, byte-wise writes are possible but inefficient; grouping parameters into aligned blocks reduces overhead. Larger datasets exceeding available capacity must reside entirely in Flash, increasing flash wear during updates. Developers should therefore implement delta encoding or compression where feasible, and avoid storing transient states permanently unless absolutely necessary.
What precautions are essential when soldering the ATMEGA8535L-8JJ in a PLCC package during high-volume production?
The 44-PLCC (16.6x16.6mm) package presents challenges in reflow soldering due to its J-lead design and moderate thermal mass. Solder paste voiding and tombstoning risks escalate if pad geometries deviate from IPC-7351 guidelines, particularly for leads with aspect ratios exceeding 2:1. Preheating to 150–200°C for 60–90 seconds minimizes thermal shock, while peak reflow temperatures should stay below 240°C to prevent delamination of internal die attach. Post-assembly inspection via X-ray or automated optical inspection (AOI) is recommended to detect insufficient wetting or cold joints. Additionally, conformal coating application post-soldering must avoid bridging adjacent leads, which could create parasitic paths affecting I/O integrity during operation.
How reliable is the internal watchdog timer implementation in the ATMEGA8535L-8JJ under noisy industrial environments?
The ATMEGA8535L-8JJ features a programmable watchdog timer (WDT) with selectable timeout periods ranging from 16ms to 8s, using the internal RC oscillator as reference. While robust against software hangs, noise coupling into the reset line or incorrect WDT enable/disable sequences can cause spurious resets. Field data indicates occasional false triggers during high-frequency switching transients (>1MHz) unless proper decoupling capacitors (100nF ceramic + 10µF tantalum) are placed near Vcc pins. To enhance resilience, designers often combine the WDT with a hardware supervisor IC monitoring Vcc independently. Software best practices include clearing the WDT flag promptly within ISRs and avoiding nested interrupts that delay servicing.
What are the trade-offs between using the internal ADC versus an external precision ADC when interfacing sensors with the ATMEGA8535L-8JJ?
The ATMEGA8535L-8JJ integrates an 8-channel, 10-bit successive approximation ADC with a maximum sampling rate of 15 kSPS at full resolution. This suffices for slow-changing analog inputs like temperature or voltage monitoring, where quantization noise dominates over drift. However, for high-resolution applications requiring >12-bit ENOB or fast settling (<1ms), external ADCs such as the MCP3208 offer superior linearity (±1 LSB INL typical) and lower offset errors (<0.5mV). Internal ADC performance degrades at supply voltages below 3.0V due to reference instability, and channel-to-channel crosstalk increases when multiple sensors share the same input path without proper mux guarding. Choosing internally depends on cost, PCB real estate, and required effective bits (ENOB); otherwise, discrete solutions deliver better SNR despite added component count.
How does flash memory programming voltage behave in the ATMEGA8535L-8JJ, and what risks exist during ISP programming?
The ATMEGA8535L-8JJ uses a standard 5V programming interface compatible with most AVR ISP programmers, but its flash programming algorithm demands stable Vcc within 2.7–5.5V. Attempting to program below 2.7V risks incomplete charge pumping in floating-gate transistors, leading to bit flips or total write failure. Conversely, exceeding 5.5V during parallel programming may puncture gate oxides, resulting in latent defects manifesting as random memory corruption later. Programmers must ensure clean power delivery—ripple <50mVpp—and avoid hot-plugging programming cables, which can generate ESD spikes damaging I/O pads. Batch reprogramming success rates improve dramatically when using regulated 5.0V supplies with bulk capacitance (>10µF) localized to the target board.
What considerations apply when cascading multiple ATMEGA8535L-8JJ devices in a distributed control system using UART?
When linking multiple ATMEGA8535L-8JJ nodes via UART, baud rate matching becomes critical due to the internal oscillator’s ±1% tolerance. Mismatched divisors between transmitters and receivers can accumulate phase errors, causing framing or parity errors beyond 2400 bps in asynchronous mode. Implementing hardware flow control (RTS/CTS) mitigates buffer overflows, but requires GPIO pin allocation and careful handshake timing. Additionally, ground loops introduce common-mode noise that corrupts UART signals unless isolated via optocouplers or differential transceivers. For deterministic response, consider using SPI instead, as its synchronous nature eliminates baud-rate dependency and enables daisy-chaining through shift registers, reducing inter-node latency variability.
How does the absence of a built-in CAN controller affect system integration when using the ATMEGA8535L-8JJ in automotive networks?
Since the ATMEGA8535L-8JJ lacks native CAN transceiver support, implementing Controller Area Network functionality necessitates external transceivers like MCP2551 paired with bit-banging or software-based CAN stacks. This approach introduces significant CPU overhead, limiting achievable bit rates to <125 kbps reliably, well below automotive-grade requirements of 500 kbps. Timing jitter from polling loops also violates ISO 11898 timing budgets, risking arbitration loss or error frames. Furthermore, absence of dedicated message buffers means developers must manage FIFO queues in software, increasing vulnerability to buffer overruns during burst traffic. Consequently, real-time vehicle diagnostics or engine management tasks typically reserve higher-end MCUs with integrated CAN FD cores, relegating the ATMEGA8535L-8JJ to non-networked actuator control roles.
What role does the Brown-Out Detect (BOD) circuit play in protecting firmware during power-up sequencing with the ATMEGA8535L-8JJ?
The ATMEGA8535L-8JJ’s Brown-Out Detection circuitry monitors Vcc and triggers a controlled reset if voltage drops below a programmable threshold—typically 1.8V, 2.7V, or 4.3V depending on fuse settings. This prevents erratic operation during unstable startup, such as when capacitors take time to charge or inductive loads induce back EMF. Without BOD enabled, undervoltage conditions may leave the MCU in an undefined state, corrupting stack pointers or leaving peripherals in intermediate states. Enabling BOD adds minimal quiescent current (~1µA) but significantly improves system robustness in battery-backed or solar-powered systems where voltage sag precedes brown-out. However, aggressive BOD thresholds (<2.0V) can conflict with legitimate low-power operation windows, requiring careful tuning based on actual load profiles.
How does the 44-PLCC package influence thermal management in densely populated PCBs using multiple ATMEGA8535L-8JJ devices?
The 44-PLCC package has limited exposed thermal surface area compared to SOIC or QFN alternatives, resulting in higher junction-to-ambient thermal resistance (θJA ≈ 60°C/W typical). In dense layouts with adjacent high-current traces or nearby power regulators, localized heating can push internal temperatures beyond 70°C even at moderate ambient conditions. This accelerates electromigration in aluminum interconnects and softens flash retention characteristics, potentially shortening product lifespan. Mitigation strategies include placing copper pours beneath the package connected to Vss, adding vias to inner ground planes, and maintaining minimum spacing (>3mm) between PLCC footprints to allow convective cooling. Where space permits, transitioning to surface-mount alternatives improves heat sinking and reduces risk of solder joint fatigue under thermal cycling.
Are there known issues with clock skew when using the internal oscillator across multiple ATMEGA8535L-8JJ devices in parallel processing arrays?
Yes, because the ATMEGA8535L-8JJ relies on a shared internal RC oscillator rather than a global clock source, inter-device synchronization suffers from inherent frequency mismatch—often ±3–5% between units at room temperature. This causes progressive desynchronization in master-slave configurations, especially problematic in DMA-driven sensor fusion or motor control arrays requiring phase alignment. Even with PLLs locked to the same source, process variations in the RC network mean no two chips run identically. For applications demanding nanosecond-level coordination, external synchronized clocks or FPGA masters are preferable. Otherwise, software-based compensation using timestamp counters (TCCs) and periodic recalibration can partially mitigate drift, albeit at increased computational cost.
What steps ensure long-term data integrity when storing critical calibration values in the ATMEGA8535L-8JJ’s EEPROM?
To preserve EEPROM data beyond typical 10-year retention specs, the ATMEGA8535L-8JJ should operate below 55°C ambient and avoid frequent erasures. Storing values in multiple redundant locations (e.g., three mirrored pages) with checksum validation enhances fault tolerance. Before writing, ensure Vcc exceeds 2.7V throughout the operation; partial writes due to power loss corrupt adjacent bits. Implement wear-leveling by rotating storage addresses after each power cycle, extending usable lifespan beyond manufacturer ratings. Periodic read-back verification detects early degradation, allowing proactive migration to backup Flash sectors if needed. Avoid storing floating-point numbers directly; convert to fixed-point integers scaled appropriately to minimize rounding errors during retrieval.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology ATMEGA8535L-8JJ

Product Attribute ATMEGA8535L-8MJ ATMEGA8535L-8JI ATMEGA8535L-8AJ ATMEGA8535L-8JI
Part Number ATMEGA8535L-8MJ ATMEGA8535L-8JI ATMEGA8535L-8AJ ATMEGA8535L-8JI
Manufacturer Microchip Technology Microchip Technology Microchip Technology Atmel
Program Memory Type - - - -
Speed - - - -
RAM Size - - - -
Data Converters - - - -
Number of I/O - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
EEPROM Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Peripherals - - - -
Oscillator Type - - - -
Core Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Connectivity - - - -
Program Memory Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Processor - - - -

ATMEGA8535L-8JJ Datasheet PDF

Download ATMEGA8535L-8JJ pdf datasheets and Microchip Technology documentation for ATMEGA8535L-8JJ - Microchip Technology.

Datasheets
ATMEGA8535(L) Complete.pdf
HTML Datasheet
Cylindrical Battery Holders.pdf
PCN Packaging
Transfer to Microchip/Label/Pkg 5/Sep/2016.pdf MBB/Label Chgs 16/Nov/2018.pdf

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Microchip Technology

ATMEGA8535L-8JJ

Microchip Technology
98D-ATMEGA8535L-8JJ

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