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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersPIC16F689T-I/ML
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PIC16F689T-I/ML - Microchip Technology

Manufacturer Part Number
PIC16F689T-I/ML
Manufacturer
Microchip Technology
Allelco Part Number
32D-PIC16F689T-I/ML
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
12,147 pcs available, New & Original
Parts Description
IC MCU 8BIT 7KB FLASH 20QFN
Package
20-QFN (4x4)
Data sheet
PIC16F689T-I/ML.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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In stock: 12147

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Specifications

PIC16F689T-I/ML Tech Specifications
Microchip Technology - PIC16F689T-I/ML technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - PIC16F689T-I/ML

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 2V ~ 5.5V
Supplier Device Package 20-QFN (4x4)
Speed 20MHz
Series PIC® 16F
RAM Size 256 x 8
Program Memory Type FLASH
Program Memory Size 7KB (4K x 14)
Peripherals Brown-out Detect/Reset, POR, WDT
Package / Case 20-VFQFN Exposed Pad
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 18
Mounting Type Surface Mount
EEPROM Size 256 x 8
Data Converters A/D 12x10b
Core Size 8-Bit
Core Processor PIC
Connectivity I²C, SPI, UART/USART
Base Product Number PIC16F689

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

PIC16F689T-I/ML Image
PIC16F689T-I/ML (1)

Manufacturer Part Number

PIC16F689T-I/ML

Manufacturer

Microchip Technology

Introduction

The PIC16F689T-I/ML is an 8-bit microcontroller from Microchip Technology's PIC® 16F series, designed for embedded system applications.

Product Features and Performance

Core Processor: PIC

Core Size: 8-Bit

Operating Speed: 20MHz

High connectivity with I2C, SPI, and UART/USART interfaces

Enhanced peripherals including Brown-out Detect/Reset, Power-on Reset (POR), and Watchdog Timer (WDT)

18 programmable I/O pins

Flash Program Memory: 7KB (4K x 14)

EEPROM: 256 x 8 bits

RAM: 256 x 8 bits

Internal Oscillator for reliable operation

Analog-to-Digital Converter: 12 channels of 10 bits

Product Advantages

Versatile power supply options from 2V to 5.5V catering to low-power and variable power application needs

Broad operating temperature range from -40°C to 85°C suitable for harsh environments

Significant program memory and data storage capacity for complex applications

Key Technical Parameters

Speed: 20MHz

Program Memory Size: 7KB

RAM Size: 256 bytes

Data Converters: 12x10-bit A/D

Voltage Supply Range: 2V to 5.5V

Quality and Safety Features

Brown-out Detect/Reset for voltage monitoring

Power-on Reset (POR) ensures reliable startup

Watchdog Timer (WDT) prevents system failure

Compatibility

Surface Mount technology compatible

20-QFN Package for space-efficient designs

Application Areas

Industrial automation

Consumer electronics

Automotive systems

Internet of Things (IoT)

Product Lifecycle

Active product status with ongoing manufacturer support

Not nearing discontinuation, with long-term availability forecasted

Several Key Reasons to Choose This Product

Microchip Technology's reputation for reliable and durable microcontrollers

Extensive connectivity options to interface with various peripherals and modules

The balance between processing power and power consumption optimized for efficiency

Provision for future upgrades and compatibility with a wide range of applications

Comprehensive technical support and documentation from the manufacturer

Frequently Asked Questions(FAQ)

How does the PIC16F689T-I/ML's power supply range of 2V to 5.5V influence its use in battery-powered embedded systems, and what considerations apply when operating near the lower end of this voltage?
The PIC16F689T-I/ML supports a broad supply range from 2V to 5.5V, enabling deployment in both low-power and standard-voltage systems. However, at voltages approaching 2V, internal oscillator accuracy may degrade due to reduced signal integrity, potentially affecting timing-critical operations. Designers should verify clock stability across process, temperature, and voltage variations, especially when relying on internal oscillators for timing functions. Additionally, analog peripherals like the 12-channel 10-bit ADC may exhibit reduced resolution or increased noise at the minimum supply, requiring calibration or filtering in precision applications.
What are the implications of the PIC16F689T-I/ML’s internal oscillator running at up to 20MHz for real-time control applications, and how does this compare to external crystal configurations?
With an internal oscillator capable of 20MHz, the PIC16F689T-I/ML supports fast instruction execution without external components, reducing PCB complexity and cost. However, the internal RC oscillator typically has ±2% to ±5% frequency tolerance under varying conditions, which may be insufficient for precise timing in communication protocols or motor control. In such cases, an external crystal can achieve better than ±30 ppm stability, improving UART baud rate accuracy and I2C timing margins. Designers must weigh integration benefits against timing precision requirements.
Can the PIC16F689T-I/ML reliably support multiple communication interfaces like SPI, I2C, and USART simultaneously in a single design, and what resource conflicts should be anticipated?
Yes, the PIC16F689T-I/ML includes hardware support for SPI, I2C, and UART/USART peripherals, allowing concurrent use in multi-device systems. However, each peripheral shares interrupt vectors and GPIO pins, requiring careful pin assignment to avoid contention. For example, the same port pins may serve different functions depending on register configuration, and incorrect setup can lead to bus conflicts. Additionally, software must manage shared interrupt priorities to prevent data loss during simultaneous transmissions.
How does the 256 x 8 EEPROM memory size in the PIC16F689T-I/ML impact firmware update strategies, and what write endurance considerations exist?
The 256-byte EEPROM provides limited non-volatile storage suitable for storing calibration data, configuration settings, or small lookup tables. While convenient for field updates, the typical 1 million write cycles limit necessitate wear-leveling techniques for frequent modifications. Designers should avoid using EEPROM as a primary log buffer; instead, it should store infrequently changing parameters. Data should also be read-modify-written to minimize cycle count, and checksums should validate integrity after updates.
What trade-offs exist between using the internal oscillator versus an external clock source in the PIC16F689T-I/ML, particularly regarding startup time and power consumption?
The internal oscillator offers faster startup (microseconds) and lower quiescent current compared to external crystals, making it ideal for sleep-wake cycling in battery applications. However, it consumes slightly more power than a disabled external resonator. External clocks provide superior stability but require additional components and consume negligible active power. For low-power designs with infrequent wake-ups, the internal oscillator is often preferable despite its coarser accuracy, while mission-critical timing systems benefit from external sources.
How does the PIC16F689T-I/ML’s operating temperature range of -40°C to 85°C affect component selection for industrial versus consumer environments?
The full industrial temperature range (-40°C to 85°C) ensures reliable operation in automotive, instrumentation, and outdoor equipment where thermal extremes occur. Consumer-grade devices typically only guarantee 0°C to 70°C, so the PIC16F689T-I/ML’s extended range enables use in harsher environments without derating. However, designers must still account for long-term reliability at upper temperature limits, including potential increases in leakage current and reduced EEPROM retention time.
What precautions should be taken when interfacing the PIC16F689T-I/ML’s 18 digital I/O pins with higher-voltage logic levels outside its 5.5V maximum rating?
Since the PIC16F689T-I/ML operates at a maximum of 5.5V, any input exceeding this voltage risks damaging the device. Level-shifting circuits such as open-drain buffers with pull-up resistors or dedicated level translators must isolate higher-voltage signals. Alternatively, MOSFET-based bidirectional shifters can maintain signal integrity across voltage domains. Direct connection to 12V or 3.3V systems without protection is not recommended and may violate absolute maximum ratings.
How does the 20-QFN package size (4x4 mm) influence thermal performance and layout density for space-constrained designs?
The compact 20-QFN (4x4 mm) package allows high component density but presents thermal challenges due to minimal exposed pad area. Without proper copper pour and vias on the bottom pad, junction-to-ambient thermal resistance can exceed 40°C/W, leading to elevated temperatures during continuous operation. Designers should implement thermal relief patterns, multiple ground vias, and adequate copper on adjacent layers to dissipate heat effectively, especially when driving loads or running at full speed.
What role does the watchdog timer (WDT) play in ensuring system robustness when using the PIC16F689T-I/ML in unattended applications?
The WDT provides hardware-level fault detection by resetting the microcontroller if software execution stalls. Configurable prescaler settings allow matching the WDT timeout to application requirements, balancing responsiveness against false triggers from temporary delays. Proper implementation includes periodically clearing the WDT within the timeout window, preventing unintended resets during normal operation while recovering from hangs caused by interrupts or infinite loops.
How does the 12-channel 10-bit ADC in the PIC16F689T-I/ML perform when sampling multiple sensors simultaneously, and what factors affect conversion accuracy?
The ADC supports sequential sampling across 12 channels with configurable scan modes, but only one channel is active at a time, requiring multiplexed acquisition. Conversion accuracy depends on reference voltage stability, settling time between switches, and input impedance matching. For best results, inputs should settle fully before conversion, and software should disable unused peripherals to minimize noise coupling. The effective number of bits (ENOB) may drop below 9.5 in noisy environments, necessitating oversampling or filtering for critical measurements.
What are the key differences between the PIC16F689T-I/ML and other members of the PIC16F689 series in terms of package availability and pin compatibility?
While the PIC16F689T-I/ML uses a 20-QFN (4x4) package, other variants may come in PDIP, SOIC, or TSSOP formats, altering pinout and form factor. Crucially, all PIC16F689 series devices share the same core architecture, memory map, and peripheral set, ensuring software portability. However, physical layout constraints differ—for instance, pin accessibility in DIP packages versus surface-mount QFN—so hardware designs cannot be interchanged without redesign. Always confirm package-specific pin assignments before substitution.
How does the PIC16F689T-I/ML handle brown-out reset (BOR) functionality, and what thresholds apply during operation?
The device includes a programmable brown-out detect circuit that resets the MCU if VDD drops below a set threshold—typically around 2.0V or 2.7V depending on configuration fuses. This prevents erratic behavior during power-up or brownout events. During normal operation, BOR remains inactive unless explicitly enabled. Designers can choose between four BOR voltage levels via configuration bits, balancing sensitivity to supply dips against immunity to transient noise.
What considerations apply when programming the PIC16F689T-I/ML using in-circuit serial programming (ICSP), and how does the 20-QFN package affect debug access?
ICSP requires dedicated programming pins (PGD/PGC) accessible regardless of package type, including the 20-QFN. However, in tightly packed layouts, routing these signals away from noisy digital lines improves programming reliability. The small footprint also makes probing difficult during development, suggesting use of test points or header footprints. Ensure adequate decoupling near the VDD pin during programming to prevent voltage droop that could corrupt flash writes.
How does the PIC16F689T-I/ML’s RoHS compliance status impact global market entry, particularly in regions with strict environmental regulations?
As a ROHS3 compliant device, the PIC16F689T-I/ML meets the European Union’s latest restrictions on hazardous substances, including lead, mercury, and cadmium. This compliance simplifies certification for consumer, medical, and industrial electronics sold in regulated markets. It also future-proofs designs against evolving environmental standards, avoiding redesign costs if regulatory requirements tighten further.
What are the limitations of using the PIC16F689T-I/ML’s internal voltage regulator for generating stable references, and when should an external LDO be preferred?
The internal regulator provides a basic reference for analog circuits but lacks precision and stability over temperature. Its output may drift by several hundred millivolts across the operating range, making it unsuitable for high-accuracy ADC measurements. An external low-dropout (LDO) regulator with better PSRR and temperature coefficient offers superior performance for sensitive analog paths, though it increases component count and power overhead. Use internal references for general-purpose analog tasks, external regulators for precision sensing.
How does the Moisture Sensitivity Level (MSL) of 1 for the PIC16F689T-I/ML influence handling and storage prior to assembly?
MSL 1 indicates unlimited shelf life under proper storage conditions (dry environment), simplifying inventory management and reducing pre-assembly baking requirements. This contrasts with higher MSL parts that risk delamination if moisture accumulates, necessitating humidity-controlled packaging and bake cycles before reflow. The PIC16F689T-I/ML’s MSL 1 status supports just-in-time procurement and flexible manufacturing workflows without special handling protocols.
What design strategies mitigate electromagnetic interference (EMI) from switching digital outputs on the PIC16F689T-I/ML in densely populated PCBs?
Fast-switching digital signals generate broadband noise that can couple into analog circuits or radiate through traces. Mitigation includes minimizing trace lengths, using series termination resistors (e.g., 22–100 ohms), and placing decoupling capacitors (100nF ceramic) close to VDD pins. Ground planes under high-speed paths reduce loop area, and avoiding parallel routing of digital and analog lines prevents crosstalk. These practices are especially important given the PIC16F689T-I/ML’s compact footprint and mixed-signal capabilities.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology PIC16F689T-I/ML

Product Attribute PIC16F689T-I/SS PIC16F689-E/ML PIC16F689-I/P PIC16F689-I/SO
Part Number PIC16F689T-I/SS PIC16F689-E/ML PIC16F689-I/P PIC16F689-I/SO
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Peripherals - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Connectivity - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Processor - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Data Converters - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Program Memory Type - - - -
EEPROM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Speed - - - -
RAM Size - - - -
Program Memory Size - - - -
Core Size - - - -
Oscillator Type - - - -

PIC16F689T-I/ML Datasheet PDF

Download PIC16F689T-I/ML pdf datasheets and Microchip Technology documentation for PIC16F689T-I/ML - Microchip Technology.

Datasheets
PIC16F631, 68x, 690 Datasheet.pdf PIC16F6xx Product Brief.pdf
PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf Packing Changes 10/Oct/2016.pdf
PCN Assembly/Origin
2.73KHz.pdf
HTML Datasheet
PIC12F6xx,PIC16F6xx Programming Spec.pdf Tips N Tricks Guide.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
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  • GB/T 27922-2011
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  • IPC
  • ESD
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PIC16F689T-I/ML Image

PIC16F689T-I/ML

Microchip Technology
32D-PIC16F689T-I/ML

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