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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersR5F100FCAFP#10
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R5F100FCAFP#10 - Renesas Electronics America Inc

Manufacturer Part Number
R5F100FCAFP#10
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
32D-R5F100FCAFP#10
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
45,753 pcs available, New & Original
Parts Description
IC MCU 16BIT 32KB FLASH 44LQFP
Package
44-LQFP (10x10)
Data sheet
R5F100FCAFP#10.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 45753
  • Unit Price: $0.547
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.547 $0.55
10+ $0.45 $4.50
30+ $0.401 $12.03
100+ $0.353 $35.30
500+ $0.324 $162.00
1000+ $0.309 $309.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

R5F100FCAFP#10 Tech Specifications
Renesas Electronics America Inc - R5F100FCAFP#10 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - R5F100FCAFP#10

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Supplier Device Package 44-LQFP (10x10)
Speed 32MHz
Series RL78/G13
RAM Size 2K x 8
Program Memory Type FLASH
Program Memory Size 32KB (32K x 8)
Peripherals DMA, LVD, POR, PWM, WDT
Package / Case 44-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 31
Mounting Type Surface Mount
EEPROM Size 4K x 8
Data Converters A/D 10x8/10b
Core Size 16-Bit
Core Processor RL78
Connectivity CSI, I²C, LINbus, UART/USART
Base Product Number R5F100

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

R5F100FCAFP#10 Image
R5F100FCAFP#10 (1)

Manufacturer Part Number

R5F100FCAFP#10

Manufacturer

Renesas Electronics America

Introduction

The R5F100FCAFP#10 is a versatile 16-bit microcontroller from the RL78/G13 series designed for embedded systems.

Product Features and Performance

Core Processor: RL78

Core Size: 16-Bit

Speed: 32MHz

Connectivity: CSI, I2C, LINbus, UART/USART

Peripherals: DMA, LVD, POR, PWM, WDT

I/O Count: 31

Program Memory: 32KB Flash

EEPROM: 4KB

RAM: 2KB

Voltage Supply Range: 1.6V to 5.5V

Data Converters: 10-channel A/D converter, 8/10-bit resolution

Internal Oscillator

Operating Temperature Range: -40°C to 85°C

Product Advantages

Energy-efficient operation across a wide voltage range

High integration to save space and reduce external components

On-chip debug function facilitates development

Key Technical Parameters

Program Memory Size: 32KB (32K x 8)

EEPROM Size: 4K x 8

RAM Size: 2K x 8

Number of I/O: 31

Data Converters: A/D 10x8/10b

Speed: 32MHz

Quality and Safety Features

Low Voltage Detection (LVD)

Power-On Reset (POR)

Watchdog Timer (WDT)

Compatibility

Compatible with a wide range of supply voltages

Standard 44-LQFP (10x10) surface mount package for PCB design flexibility

Application Areas

Consumer Electronics

Industrial Automation

Automotive Systems

IoT Devices

Product Lifecycle

Status: Active

This product is not indicated to be nearing discontinuation; replacements or upgrades should be available if necessary.

Several Key Reasons to Choose This Product

High CPU speed of 32MHz increases system performance

Extensive connectivity options for versatile use in various applications

Integrated safety features ensure stable and reliable operation

Low power consumption makes it ideal for battery-powered applications

Wide operating temperature range suitable for harsh environments

Large amount of on-chip peripherals reduce total system cost

Available in standard package for easy surface mount assembly

Long-term product lifecycle reduces risks of obsolescence

Frequently Asked Questions(FAQ)

How does the R5F100FCAFP#10 handle power consumption in battery-operated applications, and what design considerations should be made for low-power operation?
The R5F100FCAFP#10 features a wide supply voltage range of 1.6V to 5.5V, which enables efficient operation in low-voltage environments typical of battery-powered systems. Its RL78 core architecture includes multiple low-power modes such as Sleep and Deep-Sleep modes, which can reduce current consumption to under 1 µA when inactive. For optimal energy efficiency, designers should leverage the built-in watchdog timer and low-voltage detection (LVD) peripherals to manage wake-up events and prevent unintended power drain. Given its 32KB flash memory and 2KB RAM, code density must be optimized to minimize active runtime, thereby extending battery life. Careful attention to clock configuration—using the internal high-speed oscillator at 32MHz only when necessary—further reduces average current draw.
In what scenarios would the R5F100FCAFP#10 be preferred over higher-pin-count microcontrollers with similar flash capacity, and how does its pinout affect layout complexity?
The R5F100FCAFP#10 is well-suited for space-constrained or cost-sensitive designs where moderate I/O requirements are met by its 31 general-purpose I/Os. Compared to larger packages like QFN64 or TQFP64 with equivalent memory, the 44-LQFP (10x10) offers a balanced footprint that simplifies PCB routing while providing sufficient signal integrity margins. Its pin distribution supports compact layouts for industrial sensors or handheld devices where board area is limited. However, when more than 31 GPIOs are needed, alternative models such as the R5F100MAAFP may be required, though they increase package size and cost. The LQFP package also facilitates automated optical inspection (AOI), improving manufacturing yield.
What are the key differences between using the internal oscillator versus an external crystal with the R5F100FCAFP#10, and how do these choices impact system timing accuracy and reliability?
The R5F100FCAFP#10 integrates a precision internal oscillator capable of 32MHz operation with ±2% frequency tolerance across temperature and voltage variations. While convenient for reducing component count, this may not meet strict timing requirements in communication protocols like UART at high baud rates or in time-critical control loops. An external crystal provides better stability (±30 ppm or better) and is recommended for applications requiring accurate clocking, such as LINbus networks or motor control feedback loops. Using an external resonator increases BOM cost and PCB real estate but improves long-term reliability and synchronization accuracy. Designers should consider the trade-off between system simplicity and performance needs when selecting the clock source.
Can the R5F100FCAFP#10 support real-time data acquisition from multiple analog sensors simultaneously, and what hardware limitations exist in this regard?
Yes, the R5F100FCAFP#10 includes ten 8-bit or 10-bit successive approximation ADC channels, enabling multiplexed sampling of up to ten analog inputs without additional external components. With a maximum conversion rate of approximately 50 ksps per channel, it supports moderate-resolution sensor arrays such as temperature, pressure, or current transducers. However, simultaneous sampling of all channels is not supported; sequential conversion introduces slight latency, which may affect phase accuracy in tightly synchronized multi-sensor systems. To mitigate this, users can configure DMA transfers triggered by ADC completion, minimizing CPU overhead and ensuring timely data availability. Careful firmware scheduling is required to maintain deterministic response times during peak acquisition periods.
How does the R5F100FCAFP#10 compare to other RL78 family members like the R5F100MAAFP in terms of program memory, package type, and peripheral integration?
The R5F100FCAFP#10 contains 32KB of embedded flash memory and is housed in a 44-pin LQFP package, whereas the R5F100MAAFP offers a higher pin count (typically 64 pins) and often doubles memory capacity to 64KB, supporting larger firmware images. Both share the same core processor, speed, and most peripherals, including UART, I²C, and PWM modules. However, the MAAFP variant typically includes additional communication interfaces and more GPIOs, making it preferable for complex node-based networks. The FCAFP remains ideal for applications where moderate functionality and compact packaging suffice, offering a lower-cost entry point without sacrificing essential RL78/G13 features. Selection depends on future-proofing needs versus immediate resource constraints.
What precautions must be taken when programming the flash memory of the R5F100FCAFP#10 to ensure reliable firmware updates and avoid corruption?
The R5F100FCAFP#10 uses flash memory that requires erase-before-write cycles, meaning individual sectors must be erased before new data can be written. To ensure reliability, firmware updates should implement sector-level management with wear leveling logic if flash endurance is a concern. Additionally, power must remain stable during write operations—any brownout or interruption can leave sectors in an indeterminate state, potentially rendering the device unresponsive. Implementing a bootloader with rollback capability using dual-bank flash or external storage enhances update robustness. Renesas recommends verifying checksums after each write and utilizing the built-in programming interface via SCI or SWD if available. Always follow the manufacturer’s guidelines for minimum erase/write cycle counts to preserve longevity.
Is it possible to use the R5F100FCAFP#10 in automotive-grade environments, and what derating factors should be applied given its commercial temperature rating?
The R5F100FCAFP#10 is rated for -40°C to +85°C, which exceeds standard industrial temperature ranges but falls short of AEC-Q100 Grade 1 (-40°C to +125°C). Therefore, it is not qualified for full automotive operation unless used in non-critical infotainment or body electronics where environmental stress is moderate. In such cases, designers must apply derating for voltage and clock frequency to compensate for reduced semiconductor reliability at elevated temperatures. For instance, operating near 80°C may require limiting VDD to 4.5V and avoiding sustained full-speed execution to prevent thermal runaway. If automotive compliance is required, selecting an AEC-Q100 certified variant like the R5F100FAJFP would be advisable despite potential increased cost and longer lead times.
How does the R5F100FCAFP#10 support secure firmware deployment, and are there hardware-based security features available to prevent unauthorized access?
The R5F100FCAFP#10 includes basic security mechanisms such as read protection via flash memory locking and configurable memory areas protected from readback through internal fuse-like settings accessible via the ICSP interface. While it lacks advanced cryptographic accelerators found in higher-end MCUs, it supports symmetric algorithms like AES-128 in software, suitable for encrypting communication payloads in constrained environments. Secure boot is not natively supported, so implementation requires external memory or careful partitioning of trusted and untrusted code sections. For sensitive applications, pairing the MCU with a dedicated security chip adds another layer of protection. Overall, while adequate for many embedded applications, it is not designed for high-assurance environments requiring hardware root-of-trust functionality.
What impact does operating voltage have on the maximum achievable speed of the R5F100FCAFP#10, and how should clock scaling be managed across the 1.6V–5.5V range?
The R5F100FCAFP#10’s 32MHz internal oscillator performance degrades with decreasing supply voltage. At 1.6V, stable operation at full speed may not be guaranteed due to threshold voltage limitations in CMOS logic, potentially causing timing violations in critical paths. Renesas specifications typically define guaranteed operation down to 2.7V at 32MHz; below this, the device may still function but with reduced margin. Designers should consult the datasheet’s electrical characteristics table for valid combinations of VDD and fMAIN. In low-voltage applications, dynamic clock scaling—reducing frequency as voltage drops—can maintain functional integrity, though this introduces latency trade-offs. Alternatively, using a lower-speed mode with wake-on-event triggers optimizes both power and timing consistency across the operating range.
How does the R5F100FCAFP#10 facilitate inter-device communication in distributed systems, and which serial protocols does it fully support?
The R5F100FCAFP#10 supports multiple serial interfaces including UART/USART, I²C, CSI (Clock Synchronous Interface), and LINbus, enabling flexible connectivity in mesh or star topologies. Its UART module operates with programmable baud rates up to 1 Mbps, suitable for RS-232 or USB-UART bridging. The I²C block supports standard and fast modes (up to 400 kbps), ideal for connecting sensors or EEPROMs without additional controllers. Notably, the integrated LIN transceiver eliminates the need for external transceivers in automotive sub-networks, reducing bill-of-materials cost. Each peripheral can be assigned to specific pins via port remapping, allowing adaptive wiring based on mechanical constraints. Proper termination and slew-rate control are essential for signal integrity in longer traces.
What role does the watchdog timer play in robust system design with the R5F100FCAFP#10, and how can it be configured to balance responsiveness with false-trigger prevention?
The R5F100FCAFP#10 includes a dedicated independent watchdog timer (IWDT) that resets the system if software hangs or enters an infinite loop. It runs from an ultra-low-power internal oscillator (~32 kHz), consuming minimal active power even when the main CPU is off. To prevent false resets, firmware must periodically clear the IWDT counter within a defined window—ideally aligned with periodic tasks rather than arbitrary delays. Configuring a timeout slightly longer than worst-case task execution ensures recovery without unnecessary interruptions. For mission-critical systems, combining IWDT with software health monitors (e.g., stack pointer checks) creates a layered fault-tolerance strategy. Misconfiguration risks include missed clears due to interrupt overload, so interrupt priorities must be carefully managed.
How does the R5F100FCAFP#10 compare to ARM Cortex-M0+ alternatives in terms of code density, power profile, and development toolchain maturity?
The R5F100FCAFP#10 delivers competitive code density thanks to its CISC-like instruction set, often yielding smaller binaries than equivalent Cortex-M0+ devices running Thumb-2 code. However, ARM ecosystems offer broader compiler optimization, middleware libraries, and debug support, accelerating development. In terms of power, the RL78 core typically consumes less static current in sleep modes (<1 µA), making it advantageous for always-on sensors. That said, Cortex-M0+ parts like the EFM32 or SAMD21 provide higher peak performance (up to 48 MHz) and integrated radio options (Bluetooth LE), which may justify their use in connected devices. The choice hinges on existing IP reuse, certification requirements, and long-term roadmap alignment rather than raw performance metrics alone.
What considerations apply when cascading multiple R5F100FCAFP#10 units in a master-slave configuration using SPI or I²C, and how can bus contention be avoided?
When using I²C, each R5F100FCAFP#10 requires a unique 7-bit address, which must be hardcoded via hardware strapping (e.g., pull-up/pull-down on dedicated pins) since the MCU does not support dynamic addressing. For SPI, chip-select lines must be individually managed, preferably with open-drain outputs to avoid conflicts. Bus arbitration in I²C is handled automatically, but slaves cannot initiate communication unless designed to do so. To prevent contention, ensure no two devices drive the SDA/SCL lines simultaneously by disabling unused peripherals. Adding series resistors (22Ω–100Ω) on SDA/SCL can dampen ringing in long traces. Master firmware must poll slaves sequentially or use interrupts sparingly to avoid timing mismatches.
How does the R5F100FCAFP#10 handle electromagnetic interference (EMI) in industrial settings, and what layout practices enhance its noise immunity?
As a CMOS-based microcontroller, the R5F100FCAFP#10 is susceptible to conducted and radiated EMI, particularly during flash writes or high-speed switching of GPIOs. To improve robustness, decoupling capacitors (100nF ceramic near VDD/GND pins) must be placed close to the package, and analog supplies should be separated from digital ones. Ground planes under the 44-LQFP enhance heat dissipation and reduce ground bounce. Routing clock lines as differential pairs or keeping them short minimizes loop antennas. Ferrite beads on power rails suppress high-frequency noise, especially when driving motors or relays. Shielding enclosures and filtering input signals further mitigate external interference. Compliance with EN 61000-4-2 and -4-3 standards may necessitate additional measures beyond MCU-level design.
What are the implications of the R5F100FCAFP#10’s Moisture Sensitivity Level (MSL) 3 classification for reflow soldering processes, and how should storage conditions be managed?
With an MSL 3 rating, the R5F100FCAFP#10 must be assembled within 168 hours of exposure to ambient humidity after opening the moisture-barrier bag. Exceeding this window risks delamination during lead-free reflow (>245°C peak), compromising solder joint reliability. Manufacturers typically recommend baking the tray at 125°C for 24 hours before assembly if shelf life has been exceeded. Storage should occur in dry cabinets (<10% RH) with silica gel packs. Documentation such as IPC/JEDEC J-STD-033 must be followed for handling procedures. Proper labeling of resealed bags with date codes and bake cycles ensures traceability. Neglecting MSL protocols increases field failure rates, particularly in humid climates or high-temperature applications.
Can the R5F100FCAFP#10 interface directly with capacitive touch sensors, and what hardware modifications are required to enable reliable user input?
The R5F100FCAFP#10 does not include dedicated capacitive touch peripherals, but its GPIOs can drive external charge-transfer circuits or use the ADC to measure self-capacitance via simple RC timing methods. Implementing software-based mutual capacitance sensing requires precise timing control and noise filtering, which can strain CPU load. Alternatively, integrating a dedicated touch IC (e.g., CAP1203) offloads processing and improves sensitivity. For basic button emulation, firmware can sample GPIO states with debounce algorithms and hysteresis thresholds. Electrostatic discharge (ESD) protection diodes must be included on touch pads to prevent damage from human contact. While feasible, pure MCU-based touch solutions are best suited for low-channel-count applications due to limited resolution and susceptibility to environmental drift.
How does the R5F100FCAFP#10 support overvoltage protection on I/O lines, and what external components are needed to safeguard against transient spikes?
The R5F100FCAFP#10’s GPIOs tolerate voltages up to VDD + 0.3V and down to -0.3V, but sustained overvoltage conditions can degrade oxide layers. To protect against surges (e.g., from inductive loads), bidirectional TVS diodes clamped to GND and VDD are recommended on sensitive lines. Series resistors (10Ω–100Ω) limit inrush current during transients and isolate parasitic inductance. Zener diodes with breakdown voltages slightly above VDD provide secondary clamping. For CAN or LINbus interfaces, dedicated transceivers with integrated protection (e.g., TJA1050) are preferable. Always verify that protection devices do not interfere with signal rise/fall times or introduce excessive leakage. Without external safeguards, the MCU may fail prematurely under harsh electrical environments.
What development tools and IDEs are officially supported for the R5F100FCAFP#10, and how do they influence debugging efficiency and code portability?
Renesas provides the e² studio IDE with integrated support for the E1/E2-on-chip debugger, enabling flash programming, breakpoints, and register monitoring tailored to the RL78 architecture. Third-party options like IAR Embedded Workbench and GCC-based toolchains (e.g., Renesas RX/RL78 SDK) offer alternative workflows, though with varying levels of optimization for the RL78 instruction set. Debug efficiency benefits from hardware-assisted watchpoints and trace capabilities, though the R5F100FCAFP#10 lacks advanced trace ports like SWO. Code portability between RL78 variants is generally good due to shared HAL libraries, but peripheral register mappings differ slightly across models. Choosing the right toolchain impacts time-to-market and team familiarity, making initial setup a strategic decision beyond raw performance.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc R5F100FCAFP#10

Product Attribute R5F100FCAFP#50 R5F100FCAFP#X0 R5F100FCAFP#30 R5F100FAGFP#10
Part Number R5F100FCAFP#50 R5F100FCAFP#X0 R5F100FCAFP#30 R5F100FAGFP#10
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Program Memory Type - - - -
RAM Size - - - -
Speed - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Connectivity - - - -
Core Processor - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Program Memory Size - - - -
Core Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Peripherals - - - -
Data Converters - - - -
Oscillator Type - - - -
Voltage - Supply (Vcc/Vdd) - - - -
EEPROM Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

R5F100FCAFP#10 Datasheet PDF

Download R5F100FCAFP#10 pdf datasheets and Renesas Electronics America Inc documentation for R5F100FCAFP#10 - Renesas Electronics America Inc.

PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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R5F100FCAFP#10 Image

R5F100FCAFP#10

Renesas Electronics America Inc
32D-R5F100FCAFP#10

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