About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersR5F100LEAFA#50
R5F100LEAFA#50 Image
R5F100LEAFA#50 Image - 1
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

R5F100LEAFA#50 - Renesas Electronics America Inc

Manufacturer Part Number
R5F100LEAFA#50
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-R5F100LEAFA#50
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,239 pcs available, New & Original
Parts Description
IC MCU 16BIT 64KB FLASH 64LQFP
Package
64-LQFP (12x12)
Data sheet
R5F100LEAFA#50.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 36239
  • Unit Price: $3.19
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $3.19 $3.19
10+ $2.79 $27.90
30+ $2.545 $76.35
100+ $2.341 $234.10
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

R5F100LEAFA#50 Tech Specifications
Renesas Electronics America Inc - R5F100LEAFA#50 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - R5F100LEAFA#50

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Supplier Device Package 64-LQFP (12x12)
Speed 32MHz
Series RL78/G13
RAM Size 4K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals DMA, LVD, POR, PWM, WDT
Package / Case 64-LQFP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Mounting Type Surface Mount
EEPROM Size 4K x 8
Data Converters A/D 12x8/10b
Core Size 16-Bit
Core Processor RL78
Connectivity CSI, I²C, LINbus, UART/USART
Base Product Number R5F100

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the R5F100LEAFA#50 handle power consumption in low-voltage battery-operated applications, and what design considerations are necessary for maintaining stability across its operating voltage range of 1.6V to 5.5V?
The R5F100LEAFA#50 is optimized for low-power operation, which makes it suitable for battery-powered devices such as remote sensors or portable instrumentation. At full clock speed (32MHz), typical active current consumption ranges from 200µA/MHz at 3V down to approximately 120µA/MHz at 1.8V, depending on peripheral usage. When entering software-controlled sleep modes with core shutdown but RAM retention, current can drop below 1µA. Designers must ensure bypass capacitors are placed close to the Vcc pins to suppress transient droop during wake-up transitions, especially when switching between 1.6V and higher supply rails. Additionally, internal voltage regulators may be disabled in certain power-saving modes, requiring external LDOs or DC-DC converters if sub-1.8V operation is needed beyond the minimum 1.6V threshold.
In what scenarios would a designer choose the R5F100LEAFA#50 over other RL78 family variants, particularly regarding program memory size and real-time performance?
The R5F100LEAFA#50 offers 64KB of flash memory and 4KB of RAM, making it ideal for moderately complex embedded systems that require more code storage than smaller RL78 variants like the G1L or G1A series. Compared to the R5F100LAFA#30 (which has identical pinout but lower clock speed), this device runs at 32MHz versus 24MHz, enabling faster interrupt response times—critical in motor control or communication protocols requiring deterministic latency. For applications needing both sufficient memory headroom and real-time responsiveness under tight timing constraints, this model strikes a balance not always available in lower-capacity alternatives.
What are the key differences between using the internal oscillator versus an external crystal with the R5F100LEAFA#50, and how do these choices impact system reliability and development time?
The R5F100LEAFA#50 includes a calibrated internal high-speed oscillator (HSI) capable of 32MHz operation with ±1% accuracy over temperature, eliminating the need for external crystals in non-critical timing applications. However, for UART baud rate generation or I2C master mode where precise timing is essential, an external 8MHz or 16MHz crystal provides better stability (±20ppm typical). Using the internal oscillator reduces BOM cost and PCB area but may introduce slight deviations in communication timing over wide temperature swings. External crystals demand additional components (load caps, routing attention) but yield more reliable data integrity in industrial environments—this trade-off must be weighed based on application requirements.
Can the R5F100LEAFA#50 support multiple communication interfaces simultaneously without bus contention or arbitration issues, and what hardware precautions should be taken?
Yes, the R5F100LEAFA#50 supports concurrent use of CSI, I2C, LINbus, and UART/USART peripherals through its 48 general-purpose I/O pins, provided proper pin multiplexing configuration is applied via the Port Control Unit (PCU). However, care must be taken to avoid electrical conflicts—for example, ensuring that only one driver enables output at any given time on shared pins. Hardware pull-ups on open-drain lines (I2C, LIN) should match the target bus voltage (1.8V–5.5V), and signal integrity on longer traces must consider rise/fall times relative to the maximum slew rates supported by each interface. Isolating critical buses with buffer ICs or optocouplers may be necessary in noisy environments.
How does the analog-to-digital converter (ADC) on the R5F100LEAFA#50 perform in terms of effective resolution and sampling efficiency when measuring slow-changing sensor signals?
The integrated ADC offers 8-bit or 10-bit resolution across 12 channels, with conversion times typically ranging from 1µs per channel at highest speed to 10µs at lower noise settings. For slow-varying signals such as temperature or pressure sensors, averaging multiple samples significantly improves effective resolution—up to 12–14 bits equivalent when combining 16–64 conversions. The ADC operates from 2.7V to Vdd, so reference voltage stability directly affects measurement accuracy. To minimize noise pickup, analog inputs should be routed away from digital lines, and ground planes should provide clean return paths. Auto-scan functionality allows sequential channel measurement without CPU intervention, enhancing efficiency in multi-sensor designs.
What factors influence the maximum achievable PWM frequency using the R5F100LEAFA#50, and how do they compare to alternative timer configurations?
The maximum PWM frequency depends on clock source, prescaler setting, and counter reload value. With a 32MHz main clock and no division, a 16-bit timer can generate frequencies up to ~1MHz (e.g., 32MHz / 2^16 = 488Hz with full period; but using modulo mode with shorter cycles reaches closer to 1MHz). Lower frequencies (<1kHz) allow finer duty granularity but consume more processing overhead. Compared to dedicated motor-control MCUs with enhanced PWM modules, the standard timers in the R5F100LEAFA#50 lack dead-time insertion or complementary outputs, limiting suitability for H-bridge drives without external logic. For LED dimming or fan control, however, these limitations are often acceptable given the part’s low quiescent current and small footprint.
Why might a developer select the 64-LQFP package for the R5F100LEAFA#50 instead of a QFN variant, and what layout challenges arise?
The 64-LQFP (12x12mm) provides larger pad size and better thermal dissipation compared to smaller QFN packages, simplifying PCB assembly and reducing risk of solder joint cracking under thermal cycling. It also offers more accessible pin access for probing during debug. However, routing dense signals near the edge requires careful clearance around the body to avoid shorts. Power and ground planes should extend beneath the entire package for improved decoupling, and via stitching around the perimeter enhances heat spreading. While slightly less compact than QFN, the LQFP form factor aligns well with standard pick-and-place equipment and reflow profiles common in mass production.
How does the watchdog timer (WDT) implementation in the R5F100LEAFA#50 help mitigate software failures, and what are best practices for configuring it safely?
The WDT generates a reset after a programmable timeout window (from 256μs to 2^18 × Tosc), protecting against hangs caused by infinite loops or stack overflows. It runs independently of the main clock, using either the internal RC oscillator or a separate low-power source, ensuring continued monitoring even during CPU sleep. Best practice includes initializing the WDT early in startup, periodically feeding it within the safe window, and avoiding disabling it unless absolutely necessary—especially in safety-critical firmware. Debugging tools must account for WDT behavior to prevent accidental resets during development cycles.
What considerations apply when migrating existing RL78 designs to the R5F100LEAFA#50, particularly around pin compatibility and peripheral register mapping?
The R5F100LEAFA#50 shares the same base product number (R5F100) as other RL78/G13 devices, meaning most pin functions map identically across 64-pin variants. However, slight differences in alternate function assignments or clock tree configurations may necessitate minor code adjustments. Register-level compatibility is generally preserved, but developers should verify oscillator defaults, interrupt vector tables, and DMA channel mappings in the latest datasheet. Tools like Renesas’ e² studio and CA78K0R assembler support migration paths with minimal rework, provided hardware abstraction layers isolate peripheral dependencies.
How does operating temperature affect clock accuracy and peripheral behavior in the R5F100LEAFA#50, and what mitigations exist for automotive or industrial edge cases?
Within the specified -40°C to +85°C range, the internal oscillator maintains ±2% accuracy, while external crystals typically achieve ±20ppm over the same span. At extreme temperatures, ADC linearity and I/O leakage currents may degrade slightly, though still within functional limits. For harsh environments, designers should derate timing margins, avoid rapid voltage transitions near temperature extremes, and validate boot sequences at both cold and hot corners. If higher precision is required, external TCXOs or oven-controlled oscillators paired with clock conditioners offer robustness beyond the MCU’s native capabilities.
What distinguishes the R5F100LEAFA#50 from similar 16-bit MCUs like those in the MSP430 or PIC24 families in terms of real-time execution and memory architecture?
Unlike Harvard-architecture MCUs such as PIC24, the RL78 uses a modified von Neumann bus structure with unified instruction/data access, enabling simpler code models but potentially higher memory contention under heavy peripheral loads. Compared to MSP430’s ultra-low-power focus, the R5F100LEAFA#50 trades some sleep current for higher active throughput (32MHz vs. typical 25MHz max in MSP430x5xx), making it preferable where moderate performance outweighs absolute power savings. Its 64KB flash and 4KB RAM also provide denser program storage than many ultra-low-power competitors, supporting richer firmware stacks without external memory.
How does the presence of DMA improve system responsiveness in R5F100LEAFA#50-based designs, and what types of data transfers benefit most?
The integrated DMA controller offloads repetitive tasks like ADC result buffering, UART FIFO filling, or memory copying from the CPU, reducing interrupt frequency and freeing cycles for application logic. It supports single-shot and block transfer modes across peripherals including SPI, I2C, and timers, with configurable burst sizes up to 256 bytes. Applications such as continuous sensor logging, packet reception in network nodes, or waveform generation benefit greatly from DMA, minimizing jitter and CPU load—especially important in multitasking environments or when meeting strict real-time deadlines.
What precautions should be taken when programming the flash memory of the R5F100LEAFA#50, and why is sector-based erase necessary?
Flash programming requires careful handling due to erase/write cycles being limited (~10k cycles per sector) and needing specific voltage conditions (typically 3.3V for reliable writes). The R5F100LEAFA#50 organizes flash into sectors (usually 1KB or 4KB blocks), so partial updates necessitate erasing entire sectors first. Developers must disable interrupts during erase/write operations, ensure stable power, and avoid mid-cycle disruptions—failure to do so risks corrupting adjacent code or data. Bootloader designs often implement wear leveling or journaling to extend longevity, particularly in field-upgradable products.
How does the low-voltage detection (LVD) feature enhance system reliability in the R5F100LEAFA#50, and what actions can be configured upon triggering?
The LVD monitors Vdd and triggers an interrupt or reset if voltage drops below a user-defined threshold (configurable in 50mV steps from ~1.8V to ~4.5V). This prevents erratic behavior during brown-out conditions, allowing graceful shutdown or safe state preservation before power fails. Typical applications include battery-powered devices where sudden voltage sag could corrupt flash or cause lockups. Configurable hysteresis and delayed response prevent false triggers from brief transients, while integration with the WDT creates a layered defense against power-related instability.
What are the implications of the Moisture Sensitivity Level (MSL) rating of 3 for the R5F100LEAFA#50 in manufacturing and storage, and how should inventory be managed accordingly?
As an MSL 3 device (168-hour exposure limit after dry pack removal), the R5F100LEAFA#50 absorbs moisture during storage, posing delamination or popcorning risk if soldered without baking. Manufacturers must adhere to IPC/JEDEC J-STD-033 guidelines: components stored beyond 168 hours at >60% RH require bake-out at 125°C for 24+ hours before reflow. Inventory turnover should prioritize FIFO (first-in-first-out) principles, and sealed dry packaging with desiccant remains mandatory until just prior to placement. Failure to follow these protocols increases failure rates in high-reliability assemblies.
How does RoHS3 compliance of the R5F100LEAFA#50 impact global market distribution, and what documentation is typically required for regulatory submissions?
RoHS3 compliance ensures absence of restricted substances like lead, mercury, and cadmium above mandated thresholds, facilitating entry into markets such as the EU, China, and California. The device meets Directive 2015/863 amendments, covering four additional phthalates (DEHP, BBP, DBP, DIBP) not covered in earlier versions. Suppliers usually provide Certificates of Conformity and SVHC declarations; end-product manufacturers must integrate these into their own technical files for CE marking or similar certifications. Proper traceability records linking batch numbers to test reports are essential during audits.
What role does the Power-on Reset (POR) circuit play in the initialization sequence of the R5F100LEAFA#50, and how does it interact with brown-out protection?
Upon power-up, the POR circuit holds the MCU in reset until Vdd stabilizes above ~1.8V, preventing spurious instruction execution during unstable ramp-up. Once released, the core begins fetching from address 0x0000, executing a reset vector handler. Concurrently, the LVD monitors for dips below operational levels, triggering independent recovery mechanisms. Together, POR and LVD create a two-tiered safeguard: POR handles initial inrush, while LVD manages sustained undervoltage events, ensuring predictable startup and runtime resilience.
How does the combination of internal peripherals and I/O count in the R5F100LEAFA#50 influence board real estate and signal integrity in space-constrained designs?
With 48 usable GPIOs distributed across 64 pins, the R5F100LEAFA#50 supports moderate connectivity without requiring external multiplexers. However, high-frequency signals (e.g., high-speed UART, I2C at 400kHz+) demand controlled impedance routing, adequate decoupling near each pin, and avoidance of stubs or vias in signal paths. Grouping related functions (power, reset, clock) together simplifies layout and reduces EMI. While the 12x12mm package fits many compact boards, thermal crowding near dense I/O clusters may necessitate strategic silkscreen labeling and airflow considerations in enclosure designs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc R5F100LEAFA#50

Product Attribute R5F100LEAFA#V0 R5F100LEAFA#30 R5F100LEAFB#50 R5F100LEAFA#10
Part Number R5F100LEAFA#V0 R5F100LEAFA#30 R5F100LEAFB#50 R5F100LEAFA#10
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Peripherals - - - -
Number of I/O - - - -
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Program Memory Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Supply (Vcc/Vdd) - - - -
Core Size - - - -
Speed - - - -
Data Converters - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Connectivity - - - -
Core Processor - - - -
EEPROM Size - - - -
Oscillator Type - - - -
RAM Size - - - -
Program Memory Type - - - -

R5F100LEAFA#50 Datasheet PDF

Download R5F100LEAFA#50 pdf datasheets and Renesas Electronics America Inc documentation for R5F100LEAFA#50 - Renesas Electronics America Inc.

PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
R5F100LEAFA#50 Image

R5F100LEAFA#50

Renesas Electronics America Inc
98D-R5F100LEAFA#50

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB