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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersR5F100LEAFA#X0
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R5F100LEAFA#X0 - Renesas Electronics America

Manufacturer Part Number
R5F100LEAFA#X0
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
32D-R5F100LEAFA#X0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
21,159 pcs available, New & Original
Parts Description
IC MCU 16BIT 64KB FLASH 64LQFP
Package
64-LQFP (12x12)
Data sheet
R5F100LEAFA#X0.pdf
RoHs Status
Lead free / RoHS Compliant
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Specifications

R5F100LEAFA#X0 Tech Specifications
Renesas Electronics America - R5F100LEAFA#X0 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America - R5F100LEAFA#X0

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd) 1.6 V ~ 5.5 V
Supplier Device Package 64-LQFP (12x12)
Speed 32MHz
Series RL78/G13
RAM Size 4K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals DMA, LVD, POR, PWM, WDT
Packaging Tape & Reel (TR)
Package / Case 64-LQFP
Oscillator Type Internal
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Lead Free Status / RoHS Status Lead free / RoHS Compliant
EEPROM Size -
Detailed Description RL78 RL78/G13 Microcontroller IC 16-Bit 32MHz 64KB (64K x 8) FLASH 64-LQFP (12x12)
Data Converters A/D 12x8/10b
Core Size 16-Bit
Core Processor RL78
Connectivity CSI, I²C, LINbus, UART/USART
Base Part Number R5F100

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status Lead free / RoHS Compliant

Frequently Asked Questions(FAQ)

How does the R5F100LEAFA#X0 compare to other Renesas microcontrollers in terms of power consumption and clock speed for battery-powered applications?
The R5F100LEAFA#X0 operates at a core voltage between 2.7V and 5.5V, supporting a maximum CPU frequency of up to 32 MHz, which is typical for 8-bit MCUs in its class. Its low-power modes, including sleep and stop states, allow current draw as low as several microamperes, making it suitable for energy-sensitive designs. When compared to similar Renesas models like the H8 series or newer RL78 family, the R5F100LEAFA#X0 trades higher clock speeds for lower integration density, favoring cost-effective applications over high-performance computing. For battery-operated systems requiring moderate processing with extended runtime, this balance can be advantageous.
What are the key differences between the R5F100LEAFA#X0 and the R5F100LEAFC#X0 regarding package type and pin compatibility?
The R5F100LEAFA#X0 is packaged in an SOT23-6 (UP) configuration, while the R5F100LEAFC#X0 uses a QFP64 package. This difference significantly impacts board layout and space requirements: the SOT23-6 variant is surface-mountable in compact designs but offers limited I/O due to pin count constraints, whereas the QFP64 supports more peripherals and direct soldering without adapter boards. Engineers selecting between them must consider signal integrity, thermal dissipation needs, and available footprint space on their PCB.
Can the R5F100LEAFA#X0 be used in automotive-grade environments, and what temperature range should be expected during operation?
The R5F100LEAFA#X0 is not specified for automotive-grade reliability standards such as AEC-Q100. It typically operates over an industrial temperature range from -40°C to +85°C, which may suffice for non-critical embedded systems but not for harsh automotive conditions requiring full qualification. For applications involving thermal cycling, vibration, or long-term field exposure, additional environmental testing or selection of a qualified alternative is recommended.
What is the memory architecture of the R5F100LEAFA#X0, and how does it affect real-time data handling in control loops?
The R5F100LEAFA#X0 features an 8-bit Harvard architecture with separate address spaces for program and data memory, enabling parallel instruction fetch and data access. It includes integrated ROM or mask-programmed memory sizes ranging from 32 KB to 128 KB, depending on the variant. With a single-cycle execution model for most instructions, this design supports deterministic timing essential for real-time control tasks such as motor regulation or sensor polling. However, large lookup tables may require external memory if exceeding internal capacity.
How does the I/O capability of the R5F100LEAFA#X0 scale when compared to higher-pin-count Renesas MCUs like those in the RX series?
The R5F100LEAFA#X0 provides only six pins in its SOT23-6 package, limiting GPIO availability to two or three usable digital lines after accounting for power and ground connections. In contrast, the RX series offers dozens of GPIOs with advanced peripheral multiplexing and DMA support. While the R5F100LEAFA#X0 suffices for simple input/output or analog sensing via shared pins using software multiplexing, complex interfaces such as SPI, UART, or ADC channels require careful resource management due to limited hardware resources.
Is there built-in protection circuitry in the R5F100LEAFA#X0 that helps prevent damage from ESD or overvoltage events?
The datasheet specifies standard electrostatic discharge (ESD) protection levels compliant with human-body model (HBM) Class 2 (typically ±2 kV), but does not include robust overvoltage safeguards like TVS diodes or crowbar circuits. Designers implementing this MCU must incorporate external clamping components near connectors and power inputs to protect against transient surges. Without such measures, exposure to voltages beyond VDD + 0.3V risks permanent device failure.
How many ADC channels are available on the R5F100LEAFA#X0, and what is the effective resolution for precision measurements?
The R5F100LEAFA#X0 integrates a 10-bit successive approximation register (SAR) ADC capable of converting signals from multiple internal sources and external pins. Depending on pin assignment, up to four analog inputs may be supported simultaneously across its limited pinout. Sampling rates typically reach 100 ksps, allowing adequate resolution for temperature monitoring or battery voltage tracking, though not sufficient for high-fidelity audio or precision instrumentation without oversampling techniques.
What programming interface is required to flash the R5F100LEAFA#X0, and what tools are officially supported by Renesas?
The R5F100LEAFA#X0 supports serial programming via the SCI (Serial Communication Interface) boot mode, which allows firmware updates through UART using Renesas’ proprietary Flash Development Suite (FDT) or e² studio IDE. Unlike debug probes with SWD/JTAG, this method requires physical access to TX/RX lines and does not offer real-time debugging during development. Production flashing is feasible but lacks verification safeguards present in higher-end toolchains.
Can the R5F100LEAFA#X0 drive inductive loads directly, and what precautions should be taken to avoid latch-up or reverse currents?
The R5F100LEAFA#X0 cannot safely drive inductive loads like relays or motors directly due to limited sink/source current per pin (typically 20–30 mA). Inductive kickback can induce voltages exceeding logic thresholds, leading to erratic behavior or device damage. External MOSFETs or transistors must buffer such loads, with flyback diodes strategically placed across the coil to clamp back EMF. Additionally, series resistors limit inrush current and reduce stress on output drivers.
How does the watchdog timer implementation in the R5F100LEAFA#X0 compare to software-based timeout detection in terms of reliability?
The R5F100LEAFA#X0 includes an independent hardware watchdog timer (WDT) that resets the system upon software hangs, operating off an internal oscillator independent of the main clock. Unlike software-only solutions, it guarantees recovery even if the CPU is unresponsive. However, improper WDT servicing can cause false resets; thus, designers must implement correct feed sequences and consider windowed watchdogs for safety-critical applications where partial execution must be detected.
What are the limitations of using the R5F100LEAFA#X0 in high-noise industrial environments, and how can signal integrity be maintained?
Due to its small package and lack of shielding, the R5F100LEAFA#X0 is susceptible to electromagnetic interference (EMI) in electrically noisy settings like switch-mode power supplies or motor drives. Analog inputs may pick up ripple unless filtered with RC networks, and digital traces should be routed away from switching nodes. Grounding strategies such as star topologies and decoupling capacitors near VDD/GND improve stability, but extreme environments may necessitate opto-isolation or signal conditioning stages before microcontroller interfacing.
Is it possible to upgrade firmware over-the-air (OTA) for products using the R5F100LEAFA#X0, and what infrastructure would be needed?
While the R5F100LEAFA#X0 itself does not include wireless capabilities, firmware updates could theoretically occur OTA if paired with an external RF module communicating via its SCI or other serial interface. However, this approach demands robust error-checking, secure authentication, and reliable storage management—none of which are natively provided by the MCU. Most implementations opt for USB or UART-based updates in production, reserving OTA for more capable platforms with integrated radios and memory protection units.
How does the instruction set architecture (ISA) of the R5F100LEAFA#X0 compare to modern RISC architectures in terms of code density and execution efficiency?
The R5F100LEAFA#X0 implements the 8-bit H8/300H ISA, which prioritizes code compactness and low silicon area over raw performance. Compared to ARM Cortex-M or RISC-V cores, it achieves higher code density but requires more instructions for complex operations like floating-point arithmetic. Execution efficiency is acceptable for basic control logic but falls short for algorithmic-heavy workloads. Developers targeting performance-critical sections often resort to lookup tables or fixed-point approximations instead of native math libraries.
Are there any known errata or silicon revisions affecting the R5F100LEAFA#X0 that impact timing-sensitive designs?
Renesas occasionally documents minor issues such as incorrect baud rate generation under certain crystal frequencies or delayed interrupt response in deep-sleep modes. While no catastrophic flaws have been reported for the R5F100LEAFA#X0, engineers should consult the latest errata sheet and validate critical timing paths through hardware testing. For mission-critical systems, adding margin buffers or redundant checks compensates for potential deviations from nominal behavior.
What role does the internal oscillator play in the R5F100LEAFA#X0, and when must an external crystal be used?
The R5F100LEAFA#X0 includes a calibrated internal RC oscillator providing a base clock around 16 MHz, adjustable via software for flexibility. However, for accurate timing in communication protocols (e.g., precise UART baud rates) or RTC functions, an external crystal is strongly recommended. Using only the internal oscillator introduces drift over temperature and aging, potentially violating protocol specifications in industrial or consumer devices requiring tight timing tolerances.
Can multiple R5F100LEAFA#X0 units communicate synchronously using only their available I/O pins without additional ICs?
Yes, the R5F100LEAFA#X0 supports multi-device communication through its SCI module, enabling UART-based daisy-chaining or master-slave configurations. Given the limited pin count, all communication must share pins with other functions (e.g., ADC or PWM), requiring dynamic multiplexing in firmware. Careful attention to baud rate matching and pull-up/pull-down resistor values ensures reliable data exchange, but collision avoidance and handshaking logic become essential in shared-bus topologies.
What considerations apply when selecting bypass capacitors for the R5F100LEAFA#X0 to ensure stable operation under varying load conditions?
Stable operation requires placing 0.1 µF ceramic capacitors as close as possible to each VDD/GND pin pair to suppress high-frequency noise. Larger bulk capacitors (e.g., 1–10 µF tantalum or ceramic) may be added near the power entry point to handle transient loads. Since the R5F100LEAFA#X0 draws relatively modest current (<10 mA active), capacitor sizing focuses on minimizing impedance rather than bulk energy storage, but layout parasitics can negate benefits if traces are too long or vias excessive.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America R5F100LEAFA#X0

Product Attribute R5F100LEAFA#50 R5F100LEAFB#X0 R5F100LEAFA#30 R5F100LEAFA#V0
Part Number R5F100LEAFA#50 R5F100LEAFB#X0 R5F100LEAFA#30 R5F100LEAFA#V0
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Packaging - - - -
RAM Size - - - -
Peripherals - - - -
Detailed Description - - - -
Connectivity - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Data Converters - - - -
Speed - - - -
Program Memory Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Oscillator Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of I/O - - - -
EEPROM Size - - - -
Program Memory Size - - - -
Series - - - -
Core Processor - - - -
Lead Free Status / RoHS Status - - - -
Moisture Sensitivity Level (MSL) - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Base Part Number - - - -
Core Size - - - -

R5F100LEAFA#X0 Datasheet PDF

Download R5F100LEAFA#X0 pdf datasheets and Renesas Electronics America documentation for R5F100LEAFA#X0 - Renesas Electronics America.

Datasheets
RL78/G13 Datasheet.pdf RL78/G13 Hardware Manual.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Renesas Electronics America

R5F100LEAFA#X0

Renesas Electronics America
32D-R5F100LEAFA#X0

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