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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersR5F100LEDFB#30
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R5F100LEDFB#30 - Renesas Electronics America Inc

Manufacturer Part Number
R5F100LEDFB#30
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-R5F100LEDFB#30
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,851 pcs available, New & Original
Parts Description
IC MCU 16BIT 64KB FLASH 64LQFP
Package
64-LFQFP (10x10)
Data sheet
R5F100LEDFB#30.pdf
RoHs Status
ROHS3 Compliant
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Specifications

R5F100LEDFB#30 Tech Specifications
Renesas Electronics America Inc - R5F100LEDFB#30 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - R5F100LEDFB#30

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Supplier Device Package 64-LFQFP (10x10)
Speed 32MHz
Series RL78/G13
RAM Size 4K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals DMA, LVD, POR, PWM, WDT
Package / Case 64-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Mounting Type Surface Mount
EEPROM Size 4K x 8
Data Converters A/D 12x8/10b
Core Size 16-Bit
Core Processor RL78
Connectivity CSI, I²C, LINbus, UART/USART
Base Product Number R5F100

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the R5F100LEDFB#30 compare to other RL78/G13 series microcontrollers in terms of power consumption and operating voltage range, and what design considerations should be made when selecting it for battery-powered embedded applications?
The R5F100LEDFB#32 operates across a wide supply voltage range from 1.6V to 5.5V, which provides flexibility in system design, especially when interfacing with various sensors or communication modules that may have different logic levels. Its low-voltage capability down to 1.6V is particularly advantageous for battery-operated devices such as remote sensors or portable instruments, where minimizing energy consumption during sleep modes is critical. When compared to higher-voltage variants in the RL78/G13 family, this device enables longer operational life by supporting lower-power operation without requiring external voltage regulation in many cases. However, designers must ensure that all peripheral components are compatible with the minimum 1.6V threshold to avoid signal integrity issues during startup or under transient conditions.
What are the key differences between the R5F100LEDFB#30 and its substitute models like R5F100LEAFB#30 or R5F100LEAFA#30, particularly regarding package type, speed grade, and availability for prototyping versus production?
While the R5F100LEDFB#30 features a 64-LQFP (10x10) package and a 32MHz maximum operating frequency, the substitute models differ primarily in their speed grades and packaging options. For example, R5F100LEAFA#30 typically comes in a 48-pin LQFP variant and may be limited to a lower clock speed (e.g., 16MHz), making it less suitable for high-performance timing-critical tasks. In contrast, R5F100LEAFB#30 maintains the same 64-pin configuration but may offer extended temperature ranges or enhanced ESD protection. From a procurement standpoint, availability can vary significantly—substitute parts often appear on secondary markets or in older production lots, so verifying long-term availability (LTA) and checking with authorized distributors is essential before final selection.
Can the R5F100LEDFB#30 be used in automotive-grade applications, and if not, what environmental and reliability constraints might prevent its adoption in safety-related systems?
The R5F100LEDFB#30 is rated for industrial temperature range (-40°C to +85°C), which exceeds consumer electronics standards but falls short of AEC-Q100 qualification required for most automotive applications. Automotive environments demand stricter thermal cycling, humidity resistance, electromagnetic compatibility (EMC), and functional safety compliance (e.g., ISO 26262). Although the part includes built-in protections like power-on reset (POR) and low-voltage detection (LVD), these alone do not satisfy automotive fault tolerance requirements. Therefore, while it could potentially serve in non-safety automotive subsystems such as infotainment peripherals, engineers should avoid using it in critical control loops or safety-relevant functions without additional redundancy and qualification testing.
What is the significance of the Moisture Sensitivity Level (MSL) rating of 3 for the R5F100LEDFB#30, and how does this impact PCB assembly process planning and storage conditions?
With an MSL of 3 and a floor life of 168 hours, the R5F100LEDFB#30 requires careful handling after moisture exposure during PCB manufacturing. After opening the humidified packaging, the component must be assembled within seven days under controlled ambient conditions (<60% RH) or baked prior to soldering to prevent popcorning during reflow. This necessitates coordination between procurement, inventory management, and production scheduling to minimize risk. Facilities using lead-free reflow profiles must also monitor peak temperatures to avoid exceeding the junction temperature limit, especially given the small form factor of the 64-LQFP package.
How much program memory and RAM does the R5F100LEDFB#30 provide, and how might these resources influence firmware architecture decisions for real-time control applications?
The R5F100LEDFB#30 integrates 64KB of flash memory and 4KB of SRAM, along with an additional 4KB of EEPROM for data retention. For real-time motor control or sensor fusion algorithms, the 64KB flash may constrain complex state machines or large lookup tables unless optimized with code compression techniques or modular firmware design. The 4KB RAM limits stack depth and interrupt latency buffers, requiring careful management of local variables and avoidance of deep recursion. Developers often partition code into interrupt service routines (ISRs) and main loop tasks to preserve memory, leveraging DMA channels for peripheral data transfers to reduce CPU overhead.
What communication interfaces does the R5F100LEDFB#30 support, and how do they enable integration with common industrial protocols such as I2C, LINbus, and UART/USART in distributed sensor networks?
This microcontroller includes CSI (Clocked Serial Interface), I2C, LINbus-compatible UART, and standard USART peripherals, enabling flexible connectivity across automotive and industrial ecosystems. The I2C interface allows daisy-chaining of multiple sensors at 100kHz or 400kHz speeds, ideal for temperature or pressure monitoring arrays. LINbus support facilitates cost-effective communication over single-wire links in body control modules, while UART/USART enables asynchronous serial connections to GPS modules, RF transceivers, or host microcontrollers. Designers can assign dedicated timers or DMA channels to each interface to maintain deterministic response times even under moderate baud rate loads up to 1Mbps.
How does the internal oscillator configuration of the R5F100LEDFB#30 affect system stability and timing accuracy, and what trade-offs exist between using internal versus external crystal oscillators?
The R5F100LEDFB#30 relies on an internal RC oscillator calibrated to ±2% accuracy across temperature and voltage variations, offering simplicity and reduced BOM cost. However, this level of precision may be insufficient for applications requiring precise PWM generation or accurate time-stamping (e.g., data loggers or metering systems). Switching to an external 32.768kHz crystal improves clock stability for real-time clocks (RTC), while a higher-frequency crystal (e.g., 16MHz) enhances performance at the expense of board space and cost. Engineers must evaluate whether the ±2% internal oscillator meets their application’s jitter and phase noise requirements or if tighter tolerances justify adding external components.
What role does the Watchdog Timer (WDT) play in enhancing system robustness when using the R5F100LEDFB#30, and how should it be configured to balance responsiveness with false-trigger prevention?
The integrated WDT provides hardware-based recovery from software hangs or infinite loops, a critical safeguard in unattended embedded deployments. Configurable timeout periods allow tuning based on task complexity—shorter intervals detect rapid failures quickly, while longer durations accommodate background processing delays. To avoid nuisance resets, developers should periodically feed the dog (clear the timer) only after confirming normal execution paths, rather than relying solely on interrupt-driven updates. Additionally, pairing the WDT with a Power-On Reset (POR) circuit ensures clean initialization after brownout events, improving overall system reliability in noisy industrial environments.
How does the ADC resolution and channel count of the R5F100LEDFB#30 support analog sensor integration, and what sampling strategies are recommended to achieve accurate measurements in dynamic environments?
Featuring twelve 8- or 10-bit successive approximation ADCs, the R5F100LEDFB#30 supports simultaneous sampling of multiple analog inputs such as thermistors, accelerometers, or current shunts. With conversion times typically around 5–10µs per channel depending on resolution, designers can multiplex signals efficiently using internal switches or external analog multiplexers. For improved accuracy, oversampling and averaging techniques are advised when measuring slowly varying signals, while triggering conversions via timers ensures consistent sampling intervals independent of CPU load. Proper grounding and decoupling near the ADC pins remain essential to maintain effective ENOB (Effective Number of Bits).
What are the typical applications where the R5F100LEDFB#30 excels, and why might it be preferred over ARM Cortex-M0+ alternatives in certain embedded designs?
Ideal use cases include smart meters, industrial sensors, and battery-powered IoT endpoints due to its ultra-low active and sleep currents, compact footprint, and rich peripheral set tailored for RL78’s efficient instruction set architecture. Compared to ARM Cortex-M0+, the RL78 core offers simpler development workflows, smaller flash footprints for basic control logic, and better integration with Renesas’ proprietary toolchains (e.g., e² studio). While ARM-based solutions scale better for complex OS-driven applications, the R5F100LEDFB#30 delivers predictable timing and lower gate counts for deterministic, resource-constrained tasks where real-time performance outweighs computational throughput.
How should the R5F100LEDFB#30 be programmed initially, and what debugging capabilities are available to validate firmware behavior during early-stage development?
Initial programming is typically done using Renesas’ proprietary flash programmer (e.g., Flash Development Toolkit) connected via JTAG or SWD interface, though bootloader options may allow UART-based flashing in production units. During development, the integrated breakpoints, trace functionality, and real-time variable monitoring in e² studio help identify race conditions or memory leaks. Given the limited RAM (4KB), developers often use static allocation and disable unused peripherals to conserve resources. Logging critical states via UART output or LED toggling remains a practical fallback when advanced debugging tools are unavailable.
What precautions should be taken during layout and PCB routing when implementing circuits with the R5F100LEDFB#30 to ensure signal integrity and minimize electromagnetic interference (EMI)?
Due to its dense 64-pin 10x10mm QFP package, careful attention must be paid to power plane segmentation, decoupling capacitor placement (ideally within 2mm of VDD/VSS pins), and minimizing trace lengths for high-speed signals like I2C or UART. Ground planes should be solid beneath the IC to reduce impedance, and sensitive analog traces (especially ADC inputs) must be isolated from noisy digital nets. Clock lines should avoid parallel runs with data buses to prevent crosstalk. Thermal vias under the exposed pad (if present) aid heat dissipation but require solder mask relief to prevent shorts.
Is it feasible to upgrade firmware in the field using the R5F100LEDFB#30, and what security considerations apply to over-the-air (OTA) updates in deployed systems?
Yes, the R5F100LEDFB#30 supports in-system programming (ISP) via UART or I2C, enabling OTA firmware updates in end devices. However, implementing secure bootloaders requires hashing new images and validating digital signatures to prevent unauthorized modifications. Without hardware crypto accelerators, signature verification consumes significant CPU cycles and flash space—trade-offs that must be weighed against the need for remote maintenance. Designers should also reserve sufficient flash margin beyond the 64KB capacity for bootloader and versioning metadata.
How does the R5F100LEDFB#30 handle brownout conditions, and what combination of POR, LVD, and WDT ensures safe operation during voltage sags?
The device includes a Power-On Reset (POR) circuit that initializes the MCU upon power-up or when Vdd drops below ~1.6V. Coupled with Low-Voltage Detection (LVD) thresholds configurable between 1.8V and 4.5V, the IC can trigger interrupts or resets before undervoltage causes erratic behavior. Paired with the WDT, this triad ensures graceful degradation during transient dips—for instance, the LVD might disable non-critical peripherals before the WDT forces a controlled restart once voltage stabilizes above threshold.
What are the implications of using the R5F100LEDFB#30 in multi-board systems, and how should inter-chip communication be managed to avoid contention or timing mismatches?
In multi-board setups, shared busses (e.g., I2C) require pull-up resistors matched to line capacitance and termination strategies to prevent signal reflections. Address conflicts must be avoided through careful assignment, and bus arbitration logic should be implemented in software. Timing margins become tighter with longer traces, so baud rates may need reduction or use of RS-485 transceivers for differential signaling. Isolating ground domains between boards using ferrite beads or optocouplers prevents ground loops that could corrupt communication with the R5F100LEDFB#30.
How does the choice between internal and external memory expansion affect system cost and performance when deploying the R5F100LEDFB#30 in data-intensive applications?
Expanding beyond the 64KB internal flash requires external SPI or parallel flash chips, increasing bill-of-materials (BOM) cost and PCB complexity. External memory introduces access latency and potential wear-out mechanisms in flash sectors, whereas internal flash offers faster execution and no external dependencies. For applications needing >64KB code space—such as advanced diagnostic firmware—engineers might consider upgrading to larger RL78 variants like the G14 series. Otherwise, code optimization, compression, or modular loading strategies can stretch the available 64KB effectively.
What are the expected lifecycle and obsolescence risks associated with the R5F100LEDFB#30, and how can procurement teams mitigate supply chain disruptions?
As a general-purpose industrial MCU, the R5F100LEDFB#30 benefits from stable long-term availability through Renesas’ product longevity programs, but substitution risks exist due to competing product launches. Procurement teams should engage with authorized distributors early, request LTAs for key customers, and evaluate substitutes (like R5F100LEAFB#30) for pin compatibility and functional equivalence. Maintaining dual sourcing or keeping minimal safety stock helps buffer against unexpected changes in demand or production shifts.
How does the RoHS compliance status of the R5F100LEDFB#30 influence material selection in global markets, and what documentation is required for regulatory submission?
Fully RoHS3 compliant, this device eliminates lead, mercury, cadmium, and other restricted substances, ensuring admissibility in EU, North American, and emerging market regulations. Manufacturers must retain Certificates of Compliance (CoC) and Material Declarations (DoC) listing all components in the system, including passive elements. Though the part itself poses no restriction, full product compliance depends on complete assembly adherence to local directives—particularly concerning halogenated flame retardants in PCBs and solder alloys.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc R5F100LEDFB#30

Product Attribute R5F100LEDFB#50 R5F100LEDFA#30 R5F100LEDFB#X0 R5F100LEDFB#V0
Part Number R5F100LEDFB#50 R5F100LEDFA#30 R5F100LEDFB#X0 R5F100LEDFB#V0
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of I/O - - - -
Core Processor - - - -
Connectivity - - - -
Speed - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
RAM Size - - - -
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Data Converters - - - -
EEPROM Size - - - -
Peripherals - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply (Vcc/Vdd) - - - -
Program Memory Type - - - -
Oscillator Type - - - -
Program Memory Size - - - -
Core Size - - - -

R5F100LEDFB#30 Datasheet PDF

Download R5F100LEDFB#30 pdf datasheets and Renesas Electronics America Inc documentation for R5F100LEDFB#30 - Renesas Electronics America Inc.

PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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R5F100LEDFB#30 Image

R5F100LEDFB#30

Renesas Electronics America Inc
98D-R5F100LEDFB#30

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