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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersR5F100LEAFB#X0
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R5F100LEAFB#X0 - Renesas Electronics America Inc

Manufacturer Part Number
R5F100LEAFB#X0
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-R5F100LEAFB#X0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,913 pcs available, New & Original
Parts Description
IC MCU 16BIT 64KB FLASH 64LQFP
Package
64-LFQFP (10x10)
Data sheet
R5F100LEAFB#X0.pdf

PCN Part Status Change

Mult Dev EOL 30/Mar/2018.pdf

PCN Obsolescence/ EOL

Mult Dev 22/Oct/2019.pdf
RoHs Status
ROHS3 Compliant
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In stock: 7913

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Specifications

R5F100LEAFB#X0 Tech Specifications
Renesas Electronics America Inc - R5F100LEAFB#X0 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - R5F100LEAFB#X0

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Supplier Device Package 64-LFQFP (10x10)
Speed 32MHz
Series RL78/G13
RAM Size 4K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals DMA, LVD, POR, PWM, WDT
Package / Case 64-LQFP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Mounting Type Surface Mount
EEPROM Size 4K x 8
Data Converters A/D 12x8/10b
Core Size 16-Bit
Core Processor RL78
Connectivity CSI, I²C, LINbus, UART/USART
Base Product Number R5F100

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the R5F100LEAFB#X0 compare to other RL78/G13 family microcontrollers in terms of program memory capacity and operating voltage range, and what design implications arise from these parameters?
The R5F100LEAFB#X0 offers 64KB of FLASH program memory and operates across a wide supply voltage range of 1.6V to 5.5V, which provides significant flexibility for power-sensitive applications such as battery-powered or industrial sensors. When compared to lower-capacity variants like the R5F100LEAFA#50 with 32KB FLASH, this device supports larger firmware stacks and more complex control algorithms without requiring external code storage. However, the extended voltage tolerance necessitates careful consideration of I/O compatibility when interfacing with legacy systems running at fixed 3.3V or 5V logic levels. Designers must ensure that internal regulators and brown-out detection settings align with the selected operating voltage to maintain reliable operation across the full temperature range.
What are the key differences between the R5F100LEAFB#X0 and the R5F100LEAFB#50 regarding package marking and availability, and how might these affect procurement planning for high-volume production?
While both the R5F100LEAFB#X0 and R5F100LEAFB#50 share identical electrical characteristics, the primary distinction lies in packaging and marking—specifically, the absence of a lead-free finish on the #X0 variant. This can influence long-term supply chain stability, particularly in regions enforcing strict RoHS compliance. For high-volume designs, sourcing the #50 version may reduce risk due to its standardized lead-free construction and consistent global availability. Procurement teams should verify current Renesas part numbering conventions and consult distributor stock data to avoid mismatched inventory during mass production transitions.
Given the R5F100LEAFB#X0’s internal oscillator and peripheral set, what are realistic clocking options for an application requiring precise timing with minimal external components?
The R5F100LEAFB#X0 includes an internal high-speed oscillator capable of 32MHz operation, enabling direct system clocking without external crystal oscillators in many cases. Combined with internal PLL support, this allows flexible frequency scaling down to sub-MHz ranges for low-power modes. For applications requiring moderate timing accuracy—such as motor control or communication protocols—the internal oscillator eliminates the need for external resonators while still supporting UART, I2C, and LINbus interfaces directly from the core. However, for precision-critical tasks (e.g., PWM synchronization or ADC sampling), designers should evaluate the ±2% tolerance of the internal RC oscillator and consider adding an external crystal if tighter jitter control is required.
Can the R5F100LEAFB#X0 reliably drive inductive loads directly using its GPIO pins, and what protective measures should be implemented to prevent latch-up or damage?
The R5F100LEAFB#X0’s GPIO pins are not rated for driving inductive loads such as relays or solenoids without external buffering. Attempting direct switching can result in voltage spikes exceeding the 5.5V absolute maximum rating, leading to device failure. A practical solution involves using discrete MOSFETs or transistor drivers with flyback diodes across the load. Additionally, enabling the built-in LVD (Low-Voltage Detection) and POR (Power-On Reset) features ensures safe startup under undervoltage conditions. Designers should also implement software-based interlocks and current monitoring to detect fault conditions early.
How does the combination of 4K x 8 EEPROM and 4K x 8 RAM in the R5F100LEAFB#X0 influence data retention strategies and real-time processing capabilities in embedded applications?
With only 4KB of RAM and 4KB of EEPROM, the R5F100LEAFB#X0 imposes strict constraints on runtime data buffering and non-volatile storage requirements. Applications requiring frequent logging or large configuration datasets must optimize data structures or offload storage to external SPI/I2C memory. The limited RAM size also restricts interrupt latency and stack depth; therefore, nested interrupts should be minimized, and ISRs kept concise. For critical data retention, periodic writes to EEPROM—with wear-leveling algorithms—are essential due to limited write cycles (~100k typical). This trade-off favors simplicity over complexity but demands rigorous memory management.
In what scenarios would substituting the R5F100LEAFB#X0 with the R5F100LEAFA#50 be technically justified, and what risks must be assessed before making such a change?
Substitution with the R5F100LEAFA#50 may be justified when transitioning to a lead-free package for RoHS compliance in certain markets or simplifying BOM management through standardized packaging. Both devices share identical pinouts and functional blocks, so firmware typically remains compatible without modification. However, differences in moisture sensitivity handling (MSL ratings may vary subtly between suffix codes) and potential supply discontinuities require verification. Engineers must confirm that the alternate part meets all environmental and reliability criteria for their target deployment environment before committing to the substitution.
How does the R5F100LEAFB#X0’s DMA capability enhance performance in data-intensive tasks, and what are typical usage patterns that leverage this feature effectively?
The inclusion of DMA channels in the R5F100LEAFB#X0 enables background data transfers between peripherals (e.g., ADC to RAM) and memory blocks without CPU intervention, significantly reducing interrupt overhead and improving real-time response. A common use case is continuous ADC sampling into a circular buffer where the CPU processes data only after accumulation thresholds are met. This minimizes jitter in control loops and conserves CPU cycles for decision-making logic. Proper DMA configuration requires aligning buffers to address boundaries and setting transfer counts carefully to avoid overflows given the limited RAM size.
What thermal considerations apply when mounting the R5F100LEAFB#X0 in a compact PCB layout, and how do the -40°C to +85°C operating limits impact enclosure design?
Although the R5F100LEAFB#X0 has no specified junction-to-ambient thermal resistance, its 64-LQFP package dissipates heat through the exposed pad. In dense enclosures, airflow limitations can cause localized heating, especially under sustained 32MHz operation with multiple peripherals active. Designers should allocate sufficient copper area beneath the IC and avoid routing high-current traces near it. While the device functions reliably up to 85°C ambient, prolonged exposure near this limit may accelerate parametric drift in analog blocks like the ADC. Thermal vias under the package improve heat spreading, extending operational life and stability margins.
How does the R5F100LEAFB#X0’s support for LINbus and UART/USART interfaces simplify automotive-grade interface implementation, and what additional hardware is typically needed for robust communication?
The integrated LINbus transceiver logic in the R5F100LEAFB#X0 reduces BOM cost and PCB footprint compared to discrete solutions. Paired with standard UART functionality, it enables seamless integration into automotive node networks without external transceivers. However, true LIN physical layer compliance requires external level-shifting circuitry and protection diodes for ISO 7637 transient immunity. Designers must also implement checksum validation and retry mechanisms in firmware to handle noisy bus environments. The wide supply range (1.6–5.5V) allows coexistence with mixed-voltage subsystems commonly found in vehicle architectures.
What role does the watchdog timer (WDT) play in ensuring system reliability when using the R5F100LEAFB#X0 in unattended industrial deployments, and how should it be configured to balance responsiveness and false triggers?
The WDT in the R5F100LEAFB#X0 acts as a failsafe mechanism against software hangs or infinite loops, crucial for field-deployed devices with no human oversight. Configurable timeout periods (typically 128ms to several seconds depending on prescaler settings) allow tuning based on task periodicity. To minimize false resets, firmware should service the WDT within predictable intervals and disable it temporarily during critical sections using window-mode features where supported. Careful calibration against actual worst-case execution times ensures timely recovery without masking real faults.
How does the R5F100LEAFB#X0’s ADC module perform in terms of effective resolution when used in sensor measurement applications, and what calibration techniques improve accuracy beyond datasheet specifications?
Offering 8-bit and 10-bit conversion modes, the R5F100LEAFB#X0’s ADC provides adequate resolution for many resistive or capacitive sensor types (e.g., thermistors, potentiometers). However, inherent nonlinearity and offset errors may require per-device trimming. Practical approaches include performing two-point calibration (zero-scale and full-scale adjustments) during manufacturing test or factory programming. Averaging multiple samples further enhances SNR, though this consumes CPU time. Given the limited RAM, precomputed lookup tables can store calibrated values indexed by raw ADC output to maintain real-time performance.
What are the implications of using the R5F100LEAFB#X0 in a design targeting ISO 26262 functional safety compliance, and where does its architecture fall short of ASIL requirements?
While the R5F100LEAFB#X0 includes diagnostic features like LVD and WDT, it lacks architectural hardening required for ISO 26262 ASIL-B or higher certification. Specifically, it does not provide lockstep cores, ECC-protected memories, or comprehensive fault injection detection. Thus, it may only support ASIL-A or QM-rated subsystems. For safety-critical automotive functions, designers must isolate this MCU behind redundant supervision circuits or choose a functionally safe-certified alternative. Nevertheless, its deterministic behavior and rich peripheral set make it suitable for non-safety-critical gateway or body-control nodes under appropriate software safeguards.
How does the R5F100LEAFB#X0’s power consumption profile compare across active and sleep modes, and what design choices minimize energy use in battery-operated devices?
In active mode at 32MHz and Vcc = 3.3V, the R5F100LEAFB#X0 typically draws ~1.2mA/MHz, resulting in approximately 38mA peak current. During sleep modes (e.g., SNOOZE or STOP), current drops below 5µA, enabling multi-year battery life with intermittent sensing. To optimize efficiency, users should disable unused peripherals, switch clocks to low-speed internal sources during idle periods, and leverage DMA for background tasks. Wake-up latency from STOP mode is around 10µs, suitable for event-driven applications but unsuitable for ultra-low-latency wake responses.
What are the recommended layout guidelines for decoupling capacitors when placing the R5F100LEAFB#X0 near noisy digital circuitry, and why is proximity to the power pins critical?
Decoupling capacitors (100nF ceramic + 10µF tantalum or equivalent) must be placed within 2mm of each VDD/VSS pair, ideally on the same layer as the MCU, with short, wide traces to minimize inductance. This mitigates supply noise from fast GPIO toggling or peripheral switching, which could corrupt ADC readings or cause unintended resets. Ground planes under the package enhance stability, but split planes should be avoided unless absolutely necessary. Poor decoupling increases susceptibility to EMI and reduces overall system robustness.
How does the R5F100LEAFB#X0’s FLASH memory endurance compare to typical application demands, and what firmware practices extend its lifespan?
The R5F100LEAFB#X0 specifies 10k erase/write cycles for FLASH memory, sufficient for most non-volatile configuration storage but inadequate for flash-based firmware updates without careful management. Implementing sector rotation (alternating between two blocks) and validating writes before committing prevents premature wear. Firmware should also avoid frequent small updates; instead, batch changes and validate integrity via checksums before switching active sectors. These practices effectively extend usable lifespan beyond 100k cycles in practice.
What are the limitations of using the R5F100LEAFB#X0 as a USB host controller, and what alternative communication interfaces offer better suitability for plug-and-play peripherals?
The R5F100LEAFB#X0 does not include native USB hardware; thus, implementing USB host functionality requires bit-banging over GPIOs, consuming significant CPU resources and lacking protocol acceleration. Instead, designers should consider adding an external USB bridge IC or leveraging its UART/USART ports with USB-to-serial converters for simpler peripheral connectivity. This approach reduces firmware complexity and improves reliability, especially when dealing with hot-plug events or power negotiation.
How does the R5F100LEAFB#X0’s support for I2C and CSI interfaces enable efficient sensor integration, and what pull-up resistor values are optimal for mixed-voltage environments?
The dual support for I2C and CSI (Clock Serial Interface) allows flexible connection to a wide array of sensors and displays without requiring additional logic. For I2C, pull-up resistors must be sized according to bus capacitance and voltage levels: 2.2kΩ to 4.7kΩ are common for 3.3V systems, but higher values (up to 10kΩ) may be used when interfacing with 5V devices using bidirectional level shifters. Ensuring proper rise times (<300ns) avoids arbitration failures, particularly when multiple masters coexist on the same bus.
What documentation and development tools are essential for efficiently prototyping with the R5F100LEAFB#X0, and how do they support debugging constrained resource environments?
Essential tools include Renesas’ e² studio IDE, the E1/E200fx JTAG debugger, and the RL78/G13 Group User’s Manual. These provide real-time variable inspection, breakpoint control, and power profiling—critical given the MCU’s limited RAM. Since stack overflow is a concern, static analysis plugins can flag unsafe recursion or unbounded loops. Additionally, simulation models in Renesas’ simulator library help validate peripheral interactions before hardware deployment, reducing debug iterations on physical prototypes.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc R5F100LEAFB#X0

Product Attribute R5F100LEAFB#10 R5F100LEAFB#V0 R5F100LEAFA#X0 R5F100LEDFB#X0
Part Number R5F100LEAFB#10 R5F100LEAFB#V0 R5F100LEAFA#X0 R5F100LEDFB#X0
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Renesas Electronics America Inc
Voltage - Supply (Vcc/Vdd) - - - -
Core Processor - - - -
Oscillator Type - - - -
EEPROM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Program Memory Size - - - -
RAM Size - - - -
Data Converters - - - -
Speed - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Connectivity - - - -
Program Memory Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of I/O - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Peripherals - - - -
Core Size - - - -

R5F100LEAFB#X0 Datasheet PDF

Download R5F100LEAFB#X0 pdf datasheets and Renesas Electronics America Inc documentation for R5F100LEAFB#X0 - Renesas Electronics America Inc.

PCN Assembly/Origin
Wafer Fab Site Addition 21/Aug/2015.pdf
PCN Part Status Change
Mult Dev EOL 30/Mar/2018.pdf
PCN Obsolescence/ EOL
Mult Dev 22/Oct/2019.pdf
PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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R5F100LEAFB#X0 Image

R5F100LEAFB#X0

Renesas Electronics America Inc
98D-R5F100LEAFB#X0

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