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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersR5F100LEDFA#30
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R5F100LEDFA#30 - Renesas Electronics America Inc

Manufacturer Part Number
R5F100LEDFA#30
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-R5F100LEDFA#30
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,110 pcs available, New & Original
Parts Description
IC MCU 16BIT 64KB FLASH 64LQFP
Package
64-LQFP (12x12)
Data sheet
R5F100LEDFA#30.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 17110

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Specifications

R5F100LEDFA#30 Tech Specifications
Renesas Electronics America Inc - R5F100LEDFA#30 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - R5F100LEDFA#30

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Supplier Device Package 64-LQFP (12x12)
Speed 32MHz
Series RL78/G13
RAM Size 4K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals DMA, LVD, POR, PWM, WDT
Package / Case 64-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Mounting Type Surface Mount
EEPROM Size 4K x 8
Data Converters A/D 12x8/10b
Core Size 16-Bit
Core Processor RL78
Connectivity CSI, I²C, LINbus, UART/USART
Base Product Number R5F100

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

What are the key electrical and performance characteristics of the R5F100LEDFA#30 microcontroller that make it suitable for low-power embedded applications?
The R5F100LEDFA#30 operates across a supply voltage range of 1.6V to 5.5V, enabling compatibility with both battery-powered and standard industrial power systems. Its RL78 core delivers up to 32MHz operation while maintaining low active current consumption, which is critical for energy-efficient designs. With 4KB of RAM and 4KB of EEPROM, it supports efficient data logging and configuration storage without requiring external non-volatile memory. The device includes 12-channel A/D converters with 8- or 10-bit resolution, allowing direct sensing from analog sensors such as temperature or pressure transducers. These features collectively support reliable operation in space-constrained, power-sensitive environments typical in IoT endpoints and portable instrumentation.
How does the R5F100LEDFA#30 compare to other members of the RL78/G13 family in terms of memory capacity and I/O availability when selecting for a motor control application?
While the R5F100LEDFA#30 offers 64KB of flash memory and 48 GPIOs, some variants like the R5F100LEAFA#30 provide identical core specs but may differ in package pin count or peripheral integration. For motor control applications requiring PWM outputs and feedback sensing, the presence of dedicated PWM modules and ADC channels makes the R5F100LEDFA#30 competitive. However, designers should verify whether additional timers or communication interfaces are needed, as higher-end G13 devices may offer enhanced peripherals at minimal cost increase. The fixed 64KB flash limits complex algorithm execution, so code optimization or external program memory may be necessary for advanced control loops.
What design considerations arise when integrating the R5F100LEDFA#30 into a system using internal oscillators, given potential clock accuracy requirements?
The R5F100LEDFA#30 relies on an internal oscillator capable of 32MHz operation, but its frequency tolerance can vary by ±2% over temperature and voltage. This variation impacts timing-critical protocols like UART baud rate generation or I2C communication. In precision timing applications, an external crystal should be used with clock calibration routines. Alternatively, software-based baud rate compensation or use of lower-speed internal RC modes may mitigate errors. Designers must account for worst-case drift when synchronizing with external clocks or real-time constraints.
Can the R5F100LEDFA#30 reliably support wireless connectivity protocols such as BLE or Zigbee in a standalone configuration?
The R5F100LEDFA#30 lacks integrated radio transceivers, making direct implementation of Bluetooth Low Energy (BLE) or Zigbee impractical without an external co-processor or companion IC. While its UART interface allows communication with such modules, the MCU’s 64KB flash and 4KB RAM impose strict limitations on protocol stack footprint. Developers must evaluate memory usage carefully; even lightweight stacks consume several KB of code space and heap. External SPI or UART-connected radios are viable only if total system memory budget permits, often necessitating trade-offs between functionality and feature richness.
How does the operating temperature range of the R5F100LEDFA#30 influence its selection for automotive or industrial edge devices?
The specified operating range of -40°C to 85°C aligns with many industrial standards but falls short of full AEC-Q100 qualification required for automotive-grade components. While acceptable for factory automation or outdoor monitoring systems, harsh environments with thermal cycling or extended exposure above 85°C demand external protection or alternative parts. The internal voltage detector (LVD) and power-on reset (POR) help maintain stability during brownout conditions common in unstable power supplies, adding robustness in field deployments. Still, long-term reliability under extreme thermal stress remains a concern without additional hardware safeguards.
What are the implications of using the R5F100LEDFA#30 in a multi-device LINbus network regarding signal integrity and node addressing?
As a LINbus-capable device, the R5F100LEDFA#30 can function as a slave node in automotive or industrial networks. Its UART/USART module supports LIN protocol via software bit-banging or hardware assist, depending on variant configuration. Node identification relies on unique identifiers programmed into firmware since no hardware ID registers exist. Signal integrity depends on bus termination, stub lengths, and slew rate control—parameters not directly managed by the MCU. Designers must ensure compliance with LIN specification timing tolerances, especially when cascading multiple nodes, to avoid arbitration failures or corrupted frames.
Is it feasible to upgrade firmware on the R5F100LEDFA#30 using in-system programming, and what precautions apply during production updates?
Yes, the R5F100LEDFA#30 supports in-system programming via serial interfaces (e.g., SCI), enabling field updates or batch reprogramming in production. FLASH memory allows byte-level erasure and write operations, though sectors must be erased before rewriting. To prevent corruption during power loss, bootloader implementations typically include checksum validation and rollback mechanisms. However, the lack of dual-bank flash complicates safe update strategies compared to more advanced MCUs. Production lines should employ stable Vdd regulation and anti-tamper measures to protect intellectual property during mass programming.
What are the packaging-related thermal and mechanical considerations when mounting the R5F100LEDFA#30 in a high-density PCB design?
The 64-LQFP (12x12mm) package features a exposed pad underside that enhances heat dissipation when properly soldered to a ground plane. Thermal vias under the package can improve junction-to-board thermal resistance, aiding longevity in continuous-operation scenarios. Mechanical stress from coefficient-of-expansion mismatches between PCB and package may lead to solder joint fatigue over time. Mounting orientation should minimize bending moments, and conformal coating must not impede heat transfer from the exposed pad. Pad layout per Renesas recommendations ensures reliable solder joints during reflow profiling.
How do substitute part numbers like R5F100LEAFB#30 affect component sourcing strategy and long-term availability planning involving the R5F100LEDFA#30?
Substitutes such as R5F100LEAFB#30 typically share the same core architecture but may differ in package type (e.g., TQFP vs LQFP), speed grade, or minor peripheral configurations. While functionally interchangeable in most cases, verifying pin compatibility and electrical specifications is essential before substitution. Lead times and pricing volatility across distributors can shift based on regional inventory, affecting supply chain resilience. Designers should lock down the exact model number early in development to avoid costly redesigns due to unforeseen obsolescence or parametric drift in alternate variants.
What role does the watchdog timer (WDT) play in ensuring system reliability when using the R5F100LEDFA#30 in unattended applications?
The integrated WDT provides hardware-based recovery from software hangs or infinite loops by triggering a reset after a programmable timeout period. Configurable window modes allow stricter timing enforcement than simple periodic resets, reducing accidental triggers during legitimate long-running tasks. Since software bugs or interrupt latency spikes can disable normal WDT servicing, robust firmware must periodically "kick" the timer within defined bounds. Combined with POR and LVD circuits, the WDT forms a foundational layer of fail-safe operation in remote sensor nodes or control panels where manual intervention isn’t feasible.
How does the DMA capability of the R5F100LEDFA#30 benefit data-intensive peripheral interactions without CPU overhead?
The presence of DMA channels enables direct memory transfers between peripherals (e.g., ADC results or UART buffers) and system RAM, offloading the CPU during repetitive data movements. For instance, capturing ADC samples at high rates without stalling main logic improves responsiveness in real-time feedback systems. However, the limited RAM size (4KB) restricts buffer depth, requiring careful management of transfer sizes and double-buffering techniques. DMA also reduces context-switching overhead in multitasking-like scenarios implemented via cooperative scheduling, enhancing overall throughput in event-driven architectures.
Are there known limitations in cryptographic security when using the R5F100LEDFA#30 for protected firmware or secure boot applications?
The R5F100LEDFA#30 lacks dedicated cryptographic accelerators (e.g., AES, SHA engines), meaning all encryption/decryption must be handled in software. This approach consumes significant CPU cycles and increases susceptibility to side-channel attacks such as timing analysis or power consumption leakage. Without secure key storage mechanisms (like tamper-resistant registers), sensitive keys stored in flash are vulnerable to extraction via physical probing or debug interfaces enabled in production. Therefore, this MCU is generally unsuitable for high-assurance security applications unless paired with an external secure element.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc R5F100LEDFA#30

Product Attribute R5F100LEDFB#30 R5F100LEDFB#50 R5F100LEAFB#30 R5F100LEGFA#10
Part Number R5F100LEDFB#30 R5F100LEDFB#50 R5F100LEAFB#30 R5F100LEGFA#10
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Oscillator Type - - - -
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Program Memory Size - - - -
Speed - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Core Processor - - - -
Data Converters - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Program Memory Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
RAM Size - - - -
Number of I/O - - - -
EEPROM Size - - - -
Peripherals - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Core Size - - - -
Connectivity - - - -

R5F100LEDFA#30 Datasheet PDF

Download R5F100LEDFA#30 pdf datasheets and Renesas Electronics America Inc documentation for R5F100LEDFA#30 - Renesas Electronics America Inc.

PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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R5F100LEDFA#30 Image

R5F100LEDFA#30

Renesas Electronics America Inc
98D-R5F100LEDFA#30

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