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HomeProductsUncategorizedUnclassifiedCY7C199-12ZC
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CY7C199-12ZC - Rochester Electronics, LLC

Manufacturer Part Number
CY7C199-12ZC
Manufacturer
Rochester Electronics
Allelco Part Number
32D-CY7C199-12ZC
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
4,680 pcs available, New & Original
Parts Description
CY7C199 - 32K X 8 STATIC RAM
Package
Bulk
Data sheet
-
RoHs Status
 
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Our certification
In stock: 4680

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Specifications

CY7C199-12ZC Tech Specifications
Rochester Electronics, LLC - CY7C199-12ZC technical specifications, attributes, parameters and parts with similar specifications to Rochester Electronics, LLC - CY7C199-12ZC

Product Attribute Attribute Value
Manufacturer Rochester Electronics
Series *
Product Attribute Attribute Value
Package Bulk

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
REACH Status Vendor Undefined

Frequently Asked Questions(FAQ)

How does the access time of the CY7C199-12ZC compare to other low-power SRAMs in TSSOP packaging, and what design implications does this have for real-time systems?
The CY7C199-12ZC offers a 12 ns access time, which is typical for mid-range asynchronous SRAMs. In comparison to faster devices like the CY62168 with 8 ns access, it introduces slightly higher latency, potentially requiring longer wait states in synchronous interfaces. However, it outperforms slower alternatives such as the AS6C62256 (15–20 ns), making it suitable for applications where moderate speed and lower power consumption are prioritized over ultra-low latency. For real-time systems, this trade-off may necessitate careful timing analysis in interrupt service routines or data acquisition loops.
What are the key considerations when selecting the CY7C199-12ZC for battery-powered embedded systems, particularly regarding power consumption and voltage scaling?
The CY7C199-12ZC operates at 3.3V with a typical standby current of 1 µA, making it well-suited for low-power designs. When compared to older 5V SRAMs, it reduces power dissipation significantly, especially during inactive periods. However, unlike some modern low-voltage SRAMs that support dynamic voltage scaling, the CY7C199-12ZC maintains fixed 3.3V operation, limiting flexibility in mixed-voltage environments. Designers should ensure their system logic can tolerate 3.3V I/O levels and account for the device’s relatively high active current (~30 mA) during write cycles.
Can the CY7C199-12ZC be used interchangeably with the CY7C199-15ZC in existing PCB layouts, and what are the performance differences between the -12 and -15 variants?
While both variants use the same TSSOP-28 package and pinout, the CY7C199-12ZC (-12) has a faster access time of 12 ns compared to the -15 variant’s 15 ns. This makes the -12 version preferable for applications requiring faster read cycles. However, due to potential timing mismatches, substituting one for the other without revising timing budgets could lead to race conditions or missed data reads. Signal integrity and propagation delays on the PCB must be reevaluated if downgrading from -12 to -15, especially in tight timing loops.
What external components are required to interface the CY7C199-12ZC with a microcontroller, and how does its asynchronous architecture simplify or complicate system design?
The CY7C199-12ZC uses a standard asynchronous SRAM interface, requiring only pull-up resistors on the address and data lines if open-drain configurations are used. No external memory controllers or refresh circuitry are needed, simplifying design compared to DRAMs. However, the lack of built-in arbitration or burst modes means the microcontroller must manage timing directly. This increases software overhead but offers greater flexibility in addressing schemes, making it ideal for prototyping or custom memory-mapped peripherals.
How reliable is the CY7C199-12ZC under thermal stress, and what derating practices should engineers follow in high-temperature industrial applications?
Operating at temperatures up to 85°C, the CY7C199-12ZC meets standard industrial grade requirements. However, prolonged exposure near the upper limit can degrade retention characteristics and increase leakage current. In high-ambient environments, designers should maintain a margin of at least 10–15°C below maximum rated temperature. Derating the number of active accesses per second and ensuring adequate airflow or heatsinking near the component can extend reliability. Additionally, consider using error-correcting codes or backup strategies if data integrity is critical.
What is the impact of supply noise on the CY7C199-12ZC’s data retention, and how should decoupling be implemented on the PCB?
The CY7C199-12ZC has a noise immunity specification of ±0.4 V for VCC, but excessive supply ripple above 50 mV peak-to-peak can corrupt writes or cause unexpected resets. A typical decoupling strategy includes a 0.1 µF ceramic capacitor placed within 5 mm of the VCC and GND pins, supplemented by a 10 µF bulk capacitor near the board’s power entry point. In noisy environments, adding ferrite beads or LC filters may further stabilize operation, especially when sharing a power rail with switching regulators.
How does the write cycle duration of the CY7C199-12ZC affect system throughput, and what happens if a write is interrupted by an early WE# deassertion?
The CY7C199-12ZC requires a minimum write pulse width of 12 ns, with the entire write cycle completing within 20 ns from address valid to WE# inactive. If WE# is deasserted before tWP (write pulse minimum), the write operation aborts silently—no error flag exists. This can lead to data corruption if the host assumes successful completion. Designers must ensure strict adherence to timing diagrams and avoid pipeline optimizations that assume atomic writes unless verified through simulation or empirical testing.
What are the long-term availability concerns associated with the CY7C199-12ZC, and how can procurement risk be mitigated in production designs?
As a legacy Infineon/Cypress part, the CY7C199-12ZC may face obsolescence risks due to shifting semiconductor priorities. While still available through major distributors, lifecycle statements should be reviewed regularly. Mitigation strategies include qualifying alternative parts like the IS61WV6416DBLL-10TLI or IS66WV51216DALL-12TLI, which offer similar performance in comparable packages. Maintaining a BOM with multiple sourcing paths and negotiating long-term agreements can reduce supply disruption risk.

Parts with Similar Specifications

The three parts on the right have similar specifications to Rochester Electronics, LLC CY7C199-12ZC

Product Attribute CY7C199-12ZC CY7C198-55PC CY7C199-15PC CY7C199-15VI
Part Number CY7C199-12ZC CY7C198-55PC CY7C199-15PC CY7C199-15VI
Manufacturer Rochester Electronics, LLC Cypress Semiconductor Infineon Technologies CY
Package Bulk - Tube -
Series * - - -

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
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Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
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  • Western-Union
  • VISA
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Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA

CY7C199-12ZC

Rochester Electronics, LLC
32D-CY7C199-12ZC

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