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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32F101C8U6TR
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STM32F101C8U6TR - STMicroelectronics

Manufacturer Part Number
STM32F101C8U6TR
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM32F101C8U6TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
47,246 pcs available, New & Original
Parts Description
IC MCU 32BIT 64KB FLASH 48UFQFPN
Package
48-UFQFPN (7x7)
Data sheet
STM32F101C8U6TR.pdf

PCN Packaging

2.73KHz.pdf

PCN Assembly/Origin

STM8/STM32 10/Mar/2020.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 47246
  • Unit Price: $3.213
  • Subtotal: $0.00

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1+ $3.213 $3.21
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM32F101C8U6TR Tech Specifications
STMicroelectronics - STM32F101C8U6TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32F101C8U6TR

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V
Supplier Device Package 48-UFQFPN (7x7)
Speed 36MHz
Series STM32F1
RAM Size 10K x 8
Program Memory Type FLASH
Program Memory Size 64KB (64K x 8)
Peripherals DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Package / Case 48-VFQFN Exposed Pad
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 37
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 10x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M3
Connectivity I²C, IrDA, LINbus, SPI, UART/USART
Base Product Number STM32F101

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the STM32F101C8U6TR compare to other STM32F101 variants in terms of memory capacity and peripheral integration for low-power embedded applications?
The STM32F101C8U6TR offers 64KB of FLASH program memory and 10KB of RAM, which positions it as a mid-range option within the STM32F101 series. Compared to lower-density variants like the STM32F101RBT6 (128KB FLASH), it provides sufficient code space for complex control logic while maintaining a compact footprint suitable for cost-sensitive designs. Its peripheral set—including I2C, SPI, UART/USART, DMA, and an integrated temperature sensor—supports robust connectivity without requiring external interface chips. This balance makes it particularly effective in space-constrained or thermally sensitive environments where moderate computational load and real-time responsiveness are required.
What design considerations should be made when integrating the STM32F101C8U6TR into a system with strict power budget constraints?
Given its voltage operating range of 2V to 3.6V and support for multiple low-power modes via the ARM Cortex-M3 architecture, the STM32F101C8U6TR can function effectively in battery-powered systems. However, designers must leverage features such as the PDR (Power-Down Reset) and PVD (Programmable Voltage Detector) to ensure stable operation during supply fluctuations. Additionally, minimizing dynamic switching activity and utilizing the internal oscillator instead of an external crystal reduces current draw. With typical active-mode consumption around 25 mA at 3.3V and 36 MHz, careful attention to clock gating, peripheral disablement when unused, and sleep/wake timing optimization is essential to meet long-term energy targets.
Can the STM32F101C8U6TR reliably drive multiple high-current loads directly from its GPIO pins without additional buffering?
No, the STM32F101C8U6TR’s GPIO pins are designed for standard logic-level driving and typically source or sink up to 25 mA per pin under normal conditions, with total bank current limits applying across all pins. Driving inductive loads, LEDs without series resistors, or motors directly may exceed these ratings and risk damaging the microcontroller or causing erratic behavior. For applications involving higher currents—such as relay coils or LED arrays—external drivers like MOSFETs or optocouplers should be employed. Proper PCB layout, decoupling capacitors near VDD, and adherence to STMicroelectronics’ recommended thermal design practices further enhance reliability under load.
Is the internal oscillator of the STM32F101C8U6TR sufficiently accurate for applications requiring precise timing over industrial temperature ranges?
The internal 8 MHz RC oscillator has a typical accuracy of ±1% at room temperature but degrades to approximately ±2%–3% across the full operating range of -40°C to 85°C. While adequate for non-critical timing functions like baud rate generation or basic delays, this level of drift may introduce unacceptable error in time-sensitive protocols such as CAN bus communication or precision PWM generation. In such cases, an external crystal oscillator providing ±10 ppm stability is strongly recommended. Alternatively, software calibration routines can improve short-term accuracy, though they do not eliminate long-term drift due to component aging and temperature variation.
How does the number of available I/O pins in the 48-UFQFPN package compare between the STM32F101C8U6TR and similar-footprint microcontrollers from competing families?
The STM32F101C8U6TR provides 37 general-purpose I/O pins in its 48-pin UFQFPN package, which is relatively generous compared to many 32-bit MCUs in similar packages. For example, certain PIC32MX devices in 48-pin configurations offer fewer usable pins due to mandatory peripheral multiplexing or reserved pins for debugging interfaces. This gives the STM32F101C8U6TR an advantage in designs requiring extensive sensor interfacing or modular expansion without sacrificing pin count. However, users must still manage pin allocation carefully since some peripherals share pins—for instance, SPI1 and USART2 cannot operate simultaneously on overlapping pin sets.
What impact does flash write/erase cycling have on the longevity of the STM32F101C8U6TR in data logging applications?
The STM32F101C8U6TR features a FLASH memory endurance of typically 10,000 cycles per page, with each sector supporting up to 100,000 cycles. In continuous data logging scenarios where new entries overwrite older ones frequently, this limit could become a constraint over extended deployment. To mitigate wear, implement wear-leveling algorithms that distribute writes across multiple logical blocks mapped to different physical sectors. Additionally, consider using an external FRAM or EEPROM for high-frequency updates if latency permits. Logging critical metadata to FLASH only when necessary also preserves longevity while maintaining system resilience.
Does the STM32F101C8U6TR include built-in protection features that help prevent damage from transient events in automotive or industrial environments?
Yes, the device incorporates several hardware-based protections: a Power-on Reset (POR), Power-down Reset (PDR), and Programmable Voltage Detector (PVD). These ensure the MCU resets safely during brownout conditions and prevents erroneous execution below minimum supply thresholds. While these features improve robustness, they do not replace external transient suppression components such as TVS diodes or clamping circuits needed to handle ESD, EFT, or surge events commonly encountered in harsh environments. Designers should still follow EMC best practices including proper grounding, shielding, and filtering to fully leverage the MCU’s internal safeguards.
How does the presence of an internal temperature sensor affect measurement resolution and accuracy in thermal monitoring applications using the STM32F101C8U6TR?
The integrated 12-bit ADC allows conversion of the internal bandgap reference tied to the temperature sensor, yielding a nominal resolution of about 0.24°C per LSB at 3.3V. However, factory calibration data is not provided in standard datasheets, so actual offset and gain errors may vary by part-to-part. Users must perform empirical calibration using known reference temperatures (e.g., ambient and heated conditions) to achieve reliable readings. Despite this limitation, the convenience of eliminating external sensors makes the STM32F101C8U6TR attractive for basic thermal feedback loops in enclosure-monitoring or thermal throttling applications.
What role does the DMA controller play in optimizing performance when using the STM32F101C8U6TR for high-throughput data acquisition?
The STM32F101C8U6TR includes a 7-channel DMA controller capable of offloading data transfers between peripherals and memory without CPU intervention. When sampling from the 10-channel 12-bit ADC or moving large blocks of data via SPI/I2C, DMA significantly reduces interrupt overhead and ensures consistent sample rates even under moderate CPU load. For instance, acquiring 1000 samples per second from the ADC can be handled entirely by DMA, freeing the Cortex-M3 core to process results or execute application logic. This capability is essential for real-time signal processing or multi-sensor fusion tasks where deterministic timing is critical.
Are there any limitations in using the LINbus protocol with the STM32F101C8U6TR that developers should be aware of during system integration?
The STM32F101C8U6TR supports LINbus via its USART module configured for LIN mode, but compliance is limited to the physical layer (LIN 2.1 specification). Developers must implement LIN break detection, synchronization, and checksum validation in firmware since advanced LIN features like automatic wake-up or fault recovery are not hardware-automated. Additionally, baud rate accuracy depends on the chosen clock source; using the internal RC oscillator may result in deviations beyond the LIN specification tolerance, potentially causing communication failures with compliant nodes. Therefore, an external crystal is advised for reliable LIN network operation.
How does the choice between internal versus external clock sources affect boot time and system startup reliability in the STM32F101C8U6TR?
Using the internal HSI (High-Speed Internal) oscillator (~8 MHz) allows faster boot times because no external components are required for initial clock stabilization. However, switching to HSE (High-Speed External) with an external crystal adds a few milliseconds during startup due to PLL locking and oscillator stabilization delays. From a reliability standpoint, HSE provides more predictable timing jitter and better noise immunity, which benefits communication protocols sensitive to clock skew. Designers should weigh startup speed against long-term stability requirements—especially in safety-critical systems where deterministic initialization sequences are mandated.
What precautions should be taken when programming the STM32F101C8U6TR via SWD to avoid accidentally corrupting the system bootloader or user memory?
Always verify erase/write operations before committing them, especially when flashing over SWD with tools like ST-Link or JTAG debuggers. Ensure the target power supply is stable and within 2V–3.6V during programming to prevent partial writes or lockup. Avoid interrupting the programming sequence once initiated. Additionally, confirm that the Option Bytes are correctly configured—particularly the nBOOT0 setting—to ensure the desired boot source (internal FLASH or system memory) is selected post-programming. Incorrect Option Byte changes can render the device unresponsive until reflashed using a recovery method such as DFU (Device Firmware Upgrade).

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32F101C8U6TR

Product Attribute STM32F101CBU6TR STM32F101C6T6ATR STM32F101CBT6TR STM32F101R6T6ATR
Part Number STM32F101CBU6TR STM32F101C6T6ATR STM32F101CBT6TR STM32F101R6T6ATR
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Connectivity - - - -
Speed - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Core Processor - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Program Memory Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Core Size - - - -
Number of I/O - - - -
Peripherals - - - -
EEPROM Size - - - -
RAM Size - - - -
Program Memory Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Oscillator Type - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Data Converters - - - -

STM32F101C8U6TR Datasheet PDF

Download STM32F101C8U6TR pdf datasheets and STMicroelectronics documentation for STM32F101C8U6TR - STMicroelectronics.

HTML Datasheet
STM32F101x8, STM32F101xB.pdf
PCN Packaging
2.73KHz.pdf
PCN Assembly/Origin
STM8/STM32 10/Mar/2020.pdf

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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STM32F101C8U6TR Image

STM32F101C8U6TR

STMicroelectronics
98D-STM32F101C8U6TR

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