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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~STM32L051R8H6TR~~

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STM32L051R8H6TR - STMicroelectronics

Name: STMicroelectronics STM32L051R8H6TR
Brand: STMicroelectronics
SKU: STM32L051R8H6TR
Price: 2.727 USD
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: STM32L051R8H6TR

Manufacturer: STMicroelectronics

Allelco Part Number: 98D-STM32L051R8H6TR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 39,716 pcs available, New & Original

Parts Description: IC MCU 32BIT 64KB FLASH 64TFBGA

Package: 64-TFBGA (5x5)

Data sheet: STM32L051R8H6TR.pdf

Datasheets
STM32L051x6, STM32L051x8.pdf

PCN Packaging
Material Barrier Bag 17/Dec/2020.pdf

PCN Assembly/Origin
TFBGA5 A/T Site Add 1/Feb/2022.pdf

RoHs Status: ROHS3 Compliant

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Specifications

STM32L051R8H6TR Tech Specifications
STMicroelectronics - STM32L051R8H6TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32L051R8H6TR

Product Attribute	Attribute Value
Manufacturer	STMicroelectronics
Voltage - Supply (Vcc/Vdd)	1.65V ~ 3.6V
Supplier Device Package	64-TFBGA (5x5)
Speed	32MHz
Series	STM32L0
RAM Size	8K x 8
Program Memory Type	FLASH
Program Memory Size	64KB (64K x 8)
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Package / Case	64-TFBGA
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	50
Mounting Type	Surface Mount
EEPROM Size	2K x 8
Data Converters	A/D 15x12b
Core Size	32-Bit Single-Core
Core Processor	ARM® Cortex®-M0+
Connectivity	I²C, IrDA, SPI, UART/USART
Base Product Number	STM32L051

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
HTSUS	0000.00.0000

Frequently Asked Questions(FAQ)

How does the STM32L051R8H6TR compare to other STM32L0 series microcontrollers in terms of power consumption during active operation and sleep modes, particularly for battery-powered applications?: The STM32L051R8H6TR achieves a typical current consumption of 170 µA/MHz in Run mode at 2.0 V, which is lower than many general-purpose MCUs in its class. In Stop mode with the RTC running, it draws approximately 1.2 µA, and in Standby mode with the Ultra-Low-Power (ULP) mode enabled, this can drop below 1.0 µA. These figures are competitive when compared to similar Cortex-M0+ devices from other manufacturers, especially considering its 64 KB Flash and 8 KB RAM configuration. However, models like the STM32L071 or L081 offer slightly higher memory capacity and more advanced peripherals, often at a modest increase in quiescent current. For ultra-low-power designs, the choice between the L051 and higher-density variants depends on whether the additional features justify the marginal rise in power draw.

What is the significance of the 64-TFBGA (5x5) package for the STM32L051R8H6TR, and how does it impact thermal performance, routing complexity, and PCB real estate compared to alternative packages such as LQFP-64?: The 64-TFBGA package used by the STM32L051R8H6TR offers a significantly smaller footprint—just 25 mm²—compared to the LQFP-64’s 100 mm², enabling miniaturization in compact designs. Its fine-pitch ball grid array structure allows for higher pin density and improved signal integrity due to shorter trace lengths and reduced parasitic inductance. However, BGA packages require more sophisticated PCB layout techniques, including proper solder joint inspection and controlled impedance routing, increasing design complexity. Thermal resistance is marginally higher than LQFP due to smaller exposed area, but adequate heat dissipation is generally achievable through solid ground planes. For high-volume, space-constrained applications, the trade-off favors BGA despite the steeper learning curve.

Can the STM32L051R8H6TR reliably operate from a 1.8 V supply, and what implications does this have for interfacing with 3.3 V logic peripherals such as sensors or communication modules?: Yes, the STM32L051R8H6TR supports an operating voltage range of 1.65 V to 3.6 V, so 1.8 V operation is fully supported. However, when running at 1.8 V, the GPIOs and internal logic levels are referenced to that supply. While the MCU can tolerate up to 3.6 V on input pins (with some limitations), directly connecting 3.3 V signals without level shifting may not be safe unless verified within absolute maximum ratings. To ensure reliable 5 V tolerance on inputs while operating at 1.8 V, external Schottky diodes or dedicated level translators are recommended. This precaution prevents latch-up or damage, especially during hot-plug scenarios common in industrial environments.

How does the internal oscillator configuration of the STM32L051R8H6TR affect system reliability and timing accuracy across the full operating temperature range (-40°C to 85°C), and what backup options exist for time-critical applications?: The STM32L051R8H6TR includes a calibrated 16 MHz internal high-speed RC oscillator and a low-power 32 kHz internal oscillator, both of which exhibit drift over temperature and voltage. Typical frequency accuracy is ±1% at 25°C but can degrade to ±3% or worse under extreme conditions. For applications requiring precise timing, such as real-time clock functions, this may necessitate external crystal oscillators. Alternatively, the device supports HSI16 trimming via factory calibration, and software-based compensation algorithms can partially correct drift. For critical timing, pairing the internal 32 kHz oscillator with an external crystal improves long-term stability and reduces wake-up latency in low-power modes.

In what ways does the DMA controller integrated into the STM32L051R8H6TR enhance data handling efficiency, and how should it be configured to minimize CPU overhead during ADC sampling or UART transfers?: The STM32L051R8H6TR features a flexible DMA controller capable of offloading data movement between peripherals and memory without CPU intervention. This is particularly beneficial for continuous ADC conversions—such as the 15-channel, 12-bit SAR ADC—where DMA can buffer samples directly into RAM, eliminating polling and reducing interrupt frequency. Similarly, DMA-driven UART/USART transmissions allow seamless serial communication without blocking code execution. Proper configuration involves setting up DMA channels with circular buffers for periodic data capture, aligning transfer sizes with peripheral burst capabilities, and using double-buffering where latency must be minimized. Misconfiguration can lead to missed samples or buffer overflows, especially at 32 MHz core speed.

What considerations apply when selecting decoupling capacitors for the STM32L051R8H6TR in a high-noise industrial environment, and how do the 1.65 V to 3.6 V supply range and package characteristics influence layout decisions?: Due to the STM32L051R8H6TR’s wide supply range and surface-mount TFBGA packaging, robust decoupling is essential. A combination of 100 nF ceramic capacitors placed as close as possible to each power pin (VDD/VSS pairs) and one 10 µF tantalum or ceramic capacitor near the main supply entry helps suppress high-frequency and bulk noise. The tight pitch of the TFBGA requires careful attention to via placement and ground plane stitching to ensure low-impedance return paths. Additionally, because the device can operate down to 1.65 V, transient response during mode transitions (e.g., from Stop to Run) becomes critical; therefore, capacitor values should account for fast current demands during startup. Poor decoupling may cause brownout resets or erratic behavior in noisy environments.

How does the flash memory programming algorithm of the STM32L051R8H6TR handle erase/write cycles, and what endurance expectations should designers assume for firmware update applications?: The STM32L051R8H6TR uses a sector-based flash architecture with a minimum write endurance of 10,000 cycles per sector. Firmware updates typically target unused sectors or implement wear-leveling logic to distribute writes evenly. At a conservative estimate of 100 firmware updates per day, this yields over 27 years of reliable operation assuming uniform wear. However, if partial-page writes are performed frequently without proper buffering and sector management, localized wear could reduce effective lifespan. Designers should allocate dedicated update partitions and avoid modifying active code sections. The 64 KB total flash size also constrains the amount of data that can be dynamically written, making delta updates or compressed firmware images preferable.

What role does the Brown-out Reset (BOR) feature play in protecting the STM32L051R8H6TR from undervoltage conditions, and how can users customize its threshold based on application requirements?: The integrated BOR circuitry monitors the VDD supply and triggers a system reset if voltage drops below a programmable threshold, preventing erratic operation during brownouts. The STM32L051R8H6TR supports multiple BOR levels ranging from ~1.95 V to ~2.7 V, allowing alignment with system stability needs. Lower thresholds increase sensitivity to dips but may trigger unnecessarily in marginal supplies, while higher thresholds risk undefined behavior if logic levels become unstable. Customization is done via option bytes in the flash memory, and verification requires testing under actual load conditions. For battery-powered systems draining toward end-of-life, combining BOR with POR (Power-on Reset) ensures clean startups even after deep discharges.

How does the presence of IrDA support in the STM32L051R8H6TR benefit wireless-capable designs, and what are the practical limitations compared to dedicated RF transceivers?: The IrDA (Infrared Data Association) peripheral enables short-range optical communication up to 115.2 kbps over line-of-sight, useful in medical devices, remote controls, or legacy industrial interfaces where radio emissions must be avoided. Unlike Bluetooth or Wi-Fi modules, IrDA operates passively without spectrum licensing and consumes minimal power—critical for the STM32L051R8H6TR’s energy profile. However, it lacks range and penetrates obstacles poorly compared to RF solutions. Integration is straightforward through USART remapping, but software must manage pulse-width modulation for IR encoding. This makes IrDA ideal only for niche applications requiring EMI immunity and simplicity, not general wireless connectivity.

When designing with the STM32L051R8H6TR in automotive or extended-temperature environments, what additional validation steps beyond standard datasheet specifications are recommended to ensure long-term reliability?: Although rated for -40°C to 85°C, real-world deployment in harsh environments demands accelerated life testing. Recommended practices include thermal cycling between -40°C and +85°C, humidity exposure (e.g., 85/85 test), and electrical stress testing at elevated temperatures. Particular attention should be paid to solder joint fatigue in the TFBGA package, which may require conformal coating or underfill for mechanical reinforcement. Additionally, verifying flash retention after 10 years at 85°C (per JEDEC JESD22-A103) ensures firmware integrity. Since the STM32L051R8H6TR is not AEC-Q100 qualified, it is better suited for industrial rather than automotive-grade designs unless further qualification is performed.

What is the impact of enabling the watchdog timer (WDT) on power consumption in the STM32L051R8H6TR, and how should it be configured to balance system safety with energy efficiency?: The Independent Watchdog Timer (IWDG) in the STM32L051R8H6TR runs from an independent 40 kHz RC oscillator and consumes approximately 2 µA in Stop mode. While this adds minimal overhead, frequent servicing or misconfiguration can cause unnecessary resets. For best results, set the IWDG timeout longer than the longest expected task loop, and use windowed watchdogs where predictable timing is available. During deep sleep states, disabling non-essential peripherals and minimizing WDT refresh intervals helps maintain low overall current. The key is avoiding false triggers while ensuring fail-safe recovery—especially important in unattended battery-operated systems.

How does the EEPROM emulation capability in the STM32L051R8H6TR work, and what are the performance trade-offs versus using external EEPROM chips?: The STM32L051R8H6TR emulates 2 KB of EEPROM using flash memory, allowing non-volatile storage of configuration data without external components. Emulated writes take several milliseconds (typically 2–5 ms) due to flash erase/write cycles, much slower than true EEPROM but acceptable for infrequent updates (e.g., user settings). Compared to external EEPROMs like the 24LCxx series, this approach saves board space, reduces component count, and eliminates I²C bus contention risks. However, write endurance remains limited to ~10,000 cycles, and access latency is higher than SRAM. For logging-heavy applications, a hybrid approach—using internal RAM for buffering and periodic flash writes—optimizes both speed and longevity.

Can the STM32L051R8H6TR drive LED arrays directly, and what precautions are necessary to protect the GPIO pins given its 1.65 V to 3.6 V operating range?: The STM32L051R8H6TR’s GPIOs can source up to 25 mA per pin and 125 mA total across all pins, sufficient for small LED indicators. However, driving higher-current arrays requires external transistors or MOSFETs to avoid exceeding absolute maximum ratings. Since logic high output voltage drops below 3.3 V at 1.8 V supply, LED forward voltages must be compatible—e.g., red LEDs (~1.8 V) are suitable, but white LEDs (~3.0–3.6 V) may not light properly at low VDD. Current-limiting resistors must be sized according to actual supply voltage and desired brightness. In all cases, reverse-biased protection diodes or TVS elements should be added if exposed to ESD events.

What factors influence the choice between using the internal ADC versus external precision ADCs when interfacing with analog sensors in a system built around the STM32L051R8H6TR?: The integrated 12-bit SAR ADC offers 15 channels, 1 µs conversion time, and excellent linearity (±1 LSB DNL), making it adequate for many temperature, voltage, or resistive sensor applications. However, for high-accuracy (>14 bits), low-noise, or fast-dynamic-range sensing, external ADCs like the ADS1115 provide superior resolution and SNR. Internal ADC performance degrades with temperature drift (~1 mV/°C offset) and requires careful reference selection (internal vs. external). If sensor excitation is needed or multiplexing exceeds 15 inputs, external solutions are preferable. Trade-offs involve cost, PCB area, and power—the STM32L051R8H6TR’s low-power ADC enables efficient duty-cycled sampling in energy-sensitive designs.

How does the I²S peripheral in the STM32L051R8H6TR support audio applications, and what clocking constraints must be observed to achieve stable data transmission?: The I²S interface supports standard protocols for digital audio transmission, synchronized via a master clock (SCK) and word select (WS). The STM32L051R8H6TR generates these clocks internally using its PLL derived from HSI or HSE, but timing jitter affects audio quality. To minimize distortion, ensure the master clock frequency matches the expected sample rate (e.g., 12.288 MHz for 48 kHz stereo). Clock polarity and phase must align with slave device expectations. Because the core runs at 32 MHz, DMA-assisted transfers prevent buffer underflows. However, shared buses with I²C or SPI require careful arbitration or separate lines to avoid interference—especially critical in multi-device environments.

What are the key differences between the STM32L051R8H6TR and the STM32L052R8T6 (same density but different package), and how might these affect migration paths in existing designs?: Both share identical core specifications: 64 KB Flash, 8 KB RAM, 32 MHz Cortex-M0+, and same peripheral set. The primary difference lies in packaging—STM32L051R8H6TR uses 64-TFBGA (5x5), while STM32L052R8T6 uses 32-pin LQFP. This impacts routing density, thermal dissipation, and assembly cost. Migrating from BGA to LQFP simplifies PCB layout and rework but increases board size. Conversely, moving to BGA saves space but requires advanced manufacturing capabilities. Electrical performance is equivalent, so signal integrity concerns shift based on trace length and impedance control. Designers should evaluate whether the form factor change justifies retooling or certification delays.

How does the DMA channel allocation in the STM32L051R8H6TR limit simultaneous peripheral operations, and what strategies exist to prioritize critical tasks like ADC acquisition over background UART traffic?: The STM32L051R8H6TR provides up to 8 DMA channels shared among ADC, UART, SPI, I²C, and timers. Contention occurs when multiple peripherals request transfers simultaneously. To prioritize ADC, assign a dedicated channel and configure higher priority in the DMA controller. Use circular buffers for ADC to avoid missing samples, and defer less time-sensitive tasks to lower-priority channels. Alternatively, implement ping-pong buffering with interrupts to decouple processing from acquisition. If UART baud rates exceed 921600 bps, ensure sufficient FIFO usage and avoid blocking operations. Careful channel planning maximizes throughput while maintaining deterministic behavior.

What steps are necessary to ensure secure firmware deployment using the STM32L051R8H6TR, given its lack of hardware cryptographic engines compared to higher-end STM32 families?: Without AES or TRNG modules, security relies on software implementations and proper bootloader protection. Enable read-out protection (RDP Level 1) in option bytes to prevent flash readout, though this can be bypassed with debuggers. For encryption, implement AES-128 in software using lookup tables or bit-slicing, accepting increased CPU load and power consumption. Secure boot requires signing firmware with SHA-256 and storing public keys in OTP-like option bytes. Given the STM32L051R8H6TR’s modest 32 MHz core, complex cryptographic routines should be optimized or offloaded if feasible. This approach suits low-risk applications where physical access is controlled, not high-security environments.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32L051R8H6TR

Product Attribute
Part Number	STM32L051R8T6TR	STM32L051T8Y6TR	STM32L051K8U6DTR	STM32L051T8Y6DTR
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Core Size	-	-	-	-
Program Memory Type	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
EEPROM Size	-	-	-	-
Number of I/O	-	-	-	-
Speed	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Oscillator Type	-	-	-	-
RAM Size	-	-	-	-
Peripherals	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Data Converters	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Program Memory Size	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Connectivity	-	-	-	-
Series	-	-	-	-
Core Processor	-	-	-	-

STM32L051R8H6TR Datasheet PDF

Download STM32L051R8H6TR pdf datasheets and STMicroelectronics documentation for STM32L051R8H6TR - STMicroelectronics.

Datasheets: STM32L051x6, STM32L051x8.pdf
PCN Packaging: Material Barrier Bag 17/Dec/2020.pdf
PCN Assembly/Origin: TFBGA5 A/T Site Add 1/Feb/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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