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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM8AF52A8TDX
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STM8AF52A8TDX - STMicroelectronics

Manufacturer Part Number
STM8AF52A8TDX
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM8AF52A8TDX
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
44,969 pcs available, New & Original
Parts Description
IC MCU 8BIT 128KB FLASH 48LQFP
Package
48-LQFP (7x7)
Data sheet
STM8AF52A8TDX.pdf

PCN Obsolescence/ EOL

Mult Dev EOL 29/Oct/2021.pdf

PCN Design/Specification

Mult Dev 28/Nov/2022.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 44969
  • Unit Price: $4.248
  • Subtotal: $0.00

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1+ $4.248 $4.25
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM8AF52A8TDX Tech Specifications
STMicroelectronics - STM8AF52A8TDX technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM8AF52A8TDX

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Supplier Device Package 48-LQFP (7x7)
Speed 24MHz
Series Automotive, AEC-Q100, STM8A
RAM Size 6K x 8
Program Memory Type FLASH
Program Memory Size 128KB (128K x 8)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 48-LQFP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 150°C (TA)
Number of I/O 38
Mounting Type Surface Mount
EEPROM Size 2K x 8
Data Converters A/D 10x10b
Core Size 8-Bit
Core Processor STM8A
Connectivity CANbus, I²C, LINbus, SPI, UART/USART
Base Product Number STM8

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the STM8AF52A8TDX handle voltage regulation during brown-out conditions in automotive applications?
The STM8AF52A8TDX integrates a built-in brown-out reset (BOR) circuit that monitors the supply voltage and triggers a system reset when Vdd drops below a predefined threshold, typically around 2.7V to 3.0V depending on configuration. This feature is critical in automotive environments where voltage transients can occur due to load dump or cold crank events. By ensuring a clean reset under low-voltage conditions, the microcontroller maintains reliable operation without unintended resets or data corruption.
What are the key differences between the STM8AF52A8TDX and the standard STM8AF52A6T in terms of memory architecture and peripheral support?
While both devices belong to the STM8AF series and share a similar core and pinout, the STM8AF52A8TDX features 128KB of embedded Flash memory and 2KB of EEPROM, compared to 64KB Flash in the STM8AF52A6T. Additionally, the A8 variant includes enhanced CANbus support and a higher-resolution ADC with 10 channels of 10-bit resolution, making it better suited for advanced automotive sensor interfacing. The A8 also supports extended operating temperatures up to 150°C, aligning with high-temperature automotive requirements.
Can the STM8AF52A8TDX be used in safety-critical automotive systems requiring functional safety certification?
The STM8AF52A8TDX itself is not certified under ISO 26262 or any formal functional safety standard, but its AEC-Q100 Grade 1 qualification (-40°C to +125°C) makes it suitable for use in automotive systems where reliability is essential. Engineers implementing safety mechanisms such as watchdog timers, clock monitoring, and memory protection must design additional layers of fault tolerance. The device’s robust peripherals, including independent watchdogs and power-on reset circuits, support such designs when combined with appropriate software safeguards.
How does the internal oscillator stability of the STM8AF52A8TDX affect timing accuracy in high-temperature automotive environments?
The STM8AF52A8TDX utilizes an internal RC oscillator calibrated to ±2% at room temperature, but frequency drift increases with temperature. In a 150°C environment, typical deviation may reach ±5–7%, which could impact UART baud rate accuracy or PWM timing. For time-sensitive applications, external crystal oscillators are recommended. Alternatively, the device supports clock calibration routines that can compensate for drift using internal timers and reference signals, improving precision in extreme conditions.
What considerations should be made when selecting between the STM8AF52A8TDX and an ARM-based alternative like the NXP S32K144 for entry-level automotive body control modules?
The STM8AF52A8TDX offers lower power consumption, simpler development tools, and proven cost efficiency for basic control tasks, while the NXP S32K144 provides higher processing bandwidth, more advanced peripherals, and better scalability. For simple door lock or lighting control, the STM8AF52A8TDX suffices and reduces BOM cost. However, if future firmware complexity or integration with Ethernet or CAN FD is anticipated, migrating to a 32-bit MCU may be justified despite increased power and tooling overhead.
Is the STM8AF52A8TDX compatible with legacy LINbus implementations running at 19.2 kbps?
Yes, the STM8AF52A8TDX includes a LINbus-compliant UART peripheral capable of generating and interpreting frames at standard LIN speeds, including 19.2 kbps. The LIN mode automates frame formatting, checksum calculation, and wake-up signaling, simplifying implementation in automotive networks where cost-sensitive nodes communicate with central hubs. Developers must ensure proper termination and signal integrity on the LIN line, especially over long harnesses.
How much current does the STM8AF52A8TDX typically consume during active execution versus sleep modes?
Under normal operation at 24 MHz and Vdd = 5V, the STM8AF52A8TDX draws approximately 8 mA. In Halt mode with clock disabled, consumption drops to about 1 µA, and in Active-Halt mode (clock running, peripherals off), it uses roughly 25 µA. These values depend on code execution patterns and peripheral usage. For battery-powered or energy-efficient automotive subsystems, aggressive clock gating and deep sleep states significantly extend operational life.
What is the maximum allowable junction temperature for the STM8AF52A8TDX, and how does packaging affect thermal performance?
The absolute maximum junction temperature is 150°C, as specified in the datasheet. The 48-LQFP (7x7) package has moderate thermal conductivity, limiting heat dissipation without additional measures such as thermal vias or copper pours. In high-power-density designs, engineers may need to monitor PCB layout to avoid localized hotspots. Derating above 125°C is advised unless validated through thermal simulation or testing.
Does the STM8AF52A8TDX support dual-bank Flash memory for in-system firmware updates?
No, the STM8AF52A8TDX does not implement dual-bank Flash architecture. It supports in-application programming (IAP) via software routines that erase and reprogram sectors sequentially. While this allows field updates, it introduces downtime during refresh cycles. For fail-safe update mechanisms, external non-volatile storage or redundant bootloaders may be required to maintain system availability.
How does the 10-bit ADC in the STM8AF52A8TDX perform in noisy automotive electrical environments?
The integrated 10-bit SAR ADC achieves 8.5 effective bits of resolution under typical conditions with proper filtering. In electrically noisy environments—such as near ignition coils or motors—accuracy degrades unless external shielding, differential inputs, or oversampling techniques are employed. The ADC supports internal sampling capacitors and optional gain stages, enabling measurement of small analog signals like thermistor readings or battery voltage with reasonable noise immunity when layout and filtering are optimized.
What development tools and IDEs are officially supported for programming and debugging the STM8AF52A8TDX?
STMicroelectronics provides free development environments including STM8S-DISCO evaluation boards and the Cosmic C compiler, IAR Embedded Workbench for STM8, and Atollic TrueSTUDIO. Debugging is supported via ST-Link/V2-1 programmer/debugger. Third-party tools like Keil µVision also offer partial compatibility. Full optimization and flash programming require licensed compilers for production code, though open-source options like SDCC suffice for prototyping.
Can the STM8AF52A8TDX interface directly with high-side switches or inductive loads without external drivers?
The STM8AF52A8TDX GPIO pins are not rated for driving inductive loads directly due to limited sink/source current (typically ±25 mA per pin). To control relays, solenoids, or motor drivers, external transistor or MOSFET drivers must be used. However, the device’s PWM module can generate precise duty-cycle signals to control these drivers efficiently, enabling safe switching of loads beyond the MCU’s drive capability.
What role does the window watchdog timer play in preventing runaway code on the STM8AF52A8TDX?
The window watchdog provides stricter timeout control than a standard watchdog by requiring periodic feed commands only within a defined time window. If the application fails to reload the WWDG too early or too late, a system reset occurs. This prevents software loops from bypassing the watchdog entirely. Combined with the independent IWDG, this layered approach enhances robustness in safety-relevant firmware.
How does the Moisture Sensitivity Level (MSL) of 3 for the STM8AF52A8TDX impact manufacturing handling and assembly?
With an MSL of 3, the STM8AF52A8TDX requires dry packing before reflow soldering and must be assembled within 168 hours after opening if stored above 60°C/60% RH. Beyond this period, baking may be necessary to prevent popcorn cracking during thermal cycling. Manufacturers must follow JEDEC J-STD-033 guidelines to ensure reliability, particularly in high-volume automotive production where process control is stringent.
Is there hardware acceleration for cryptographic operations in the STM8AF52A8TDX?
No, the STM8AF52A8TDX lacks dedicated cryptographic accelerators such as AES or SHA engines found in more secure MCUs. Implementing encryption or authentication requires software routines running on the main CPU, consuming significant cycles. For secure key storage or message signing, external secure elements or companion chips are typically added, increasing system complexity and cost.
What is the typical latency between detecting a rising edge on an input pin and triggering an interrupt on the STM8AF52A8TDX?
Interrupt response latency is generally less than 50 ns when the peripheral is enabled and the CPU is not executing a critical ISR. The exact delay depends on instruction pipeline state and clock speed, but worst-case scenarios rarely exceed 200 ns. For real-time event detection—such as encoder pulses or safety sensor inputs—this latency is acceptable, provided interrupt priorities and nesting are managed properly.
How does the STM8AF52A8TDX compare to newer STM32G0 series MCUs in terms of power efficiency and peripheral integration?
While the STM8AF52A8TDX excels in ultra-low power modes (sub-µA range), the STM32G0 series leverages ARM Cortex-M0+ architecture for better performance-per-clock and includes advanced peripherals like LPUART and LP comparators. The G0 achieves similar sleep currents but offers faster wake-up times and richer connectivity. Migration from STM8 to STM32G0 may reduce component count but increases software complexity and licensing costs for commercial tools.
Are there known errata or silicon limitations affecting Flash write endurance in the STM8AF52A8TDX?
STMicroelectronics documents typical Flash endurance at 10,000 write/erase cycles per sector. However, some revisions of the STM8AF52A8TDX exhibit reduced endurance under extreme temperature cycling or frequent partial-sector erasures. Errata sheets recommend avoiding repeated writes to the same addresses without wear leveling. For applications requiring >100k cycles, external FRAM or EEPROM should be considered instead of relying solely on internal Flash.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM8AF52A8TDX

Product Attribute STM8AF52A8TCX STM8AF52A8TDY STM8AF52A8TAY STM8AF528ATCY
Part Number STM8AF52A8TCX STM8AF52A8TDY STM8AF52A8TAY STM8AF528ATCY
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Connectivity - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Core Size - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Core Processor - - - -
Program Memory Type - - - -
Number of I/O - - - -
Peripherals - - - -
Data Converters - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Oscillator Type - - - -
EEPROM Size - - - -
RAM Size - - - -
Program Memory Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Speed - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

STM8AF52A8TDX Datasheet PDF

Download STM8AF52A8TDX pdf datasheets and STMicroelectronics documentation for STM8AF52A8TDX - STMicroelectronics.

HTML Datasheet
STM8AF52xx, STM8AF62xx.pdf
PCN Packaging
Material Barrier Bag 17/Dec/2020.pdf
PCN Assembly/Origin
STM8A Testing Chgs 13/Dec/2021.pdf
PCN Obsolescence/ EOL
Mult Dev EOL 29/Oct/2021.pdf
PCN Design/Specification
Mult Dev 28/Nov/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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STM8AF52A8TDX Image

STM8AF52A8TDX

STMicroelectronics
98D-STM8AF52A8TDX

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