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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM8AF52AATAX
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STM8AF52AATAX - STMicroelectronics

Manufacturer Part Number
STM8AF52AATAX
Manufacturer
STMicroelectronics
Allelco Part Number
98D-STM8AF52AATAX
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,110 pcs available, New & Original
Parts Description
IC MCU 8BIT 128KB FLASH 80LQFP
Package
80-LQFP (14x14)
Data sheet
STM8AF52AATAX.pdf

PCN Packaging

2.73KHz.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 46110
  • Unit Price: $4.434
  • Subtotal: $0.00

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The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM8AF52AATAX Tech Specifications
STMicroelectronics - STM8AF52AATAX technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM8AF52AATAX

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Supplier Device Package 80-LQFP (14x14)
Speed 24MHz
Series STM8A
RAM Size 6K x 8
Program Memory Type FLASH
Program Memory Size 128KB (128K x 8)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 80-LQFP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 68
Mounting Type Surface Mount
EEPROM Size 2K x 8
Data Converters A/D 16x10b
Core Size 8-Bit
Core Processor STM8A
Connectivity CANbus, I²C, LINbus, SPI, UART/USART
Base Product Number STM8

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the STM8AF52AATAX compare to other STM8 series microcontrollers in terms of memory architecture and peripheral integration for industrial sensor node applications?
The STM8AF52AATAX features a 128KB Flash memory and 6KB RAM, providing sufficient program storage and runtime data handling for complex sensor fusion algorithms. Unlike entry-level STM8 variants that typically offer 32-64KB Flash, this device supports larger firmware packages with over-the-air update capabilities. Its integrated CANbus, LINbus, and multiple UART interfaces enable flexible communication topologies common in automotive and industrial sensor networks, while the 16-channel ADC at 10-bit resolution meets precision requirements for analog signal conditioning in temperature, pressure, or current sensing applications.
What are the thermal and electrical constraints when implementing the STM8AF52AATAX in high-reliability embedded systems operating across industrial temperature ranges?
Operating within -40°C to +85°C, the STM8AF52AATAX maintains stable performance through internal oscillator compensation and robust voltage regulation. However, system designers must ensure VDD stays within 3.0V–5.5V even during transient load conditions, as supply droop below 3V can trigger brown-out reset mechanisms. The 80-LQFP package exhibits moderate thermal resistance (~35°C/W junction-to-case), so adequate copper pour on PCB layer 2 or 3 is recommended for sustained full-speed operation under continuous computational load.
Can the STM8AF52AATAX support real-time motor control applications requiring precise PWM timing and fast interrupt response?
Yes, but with architectural considerations. While the STM8AF52AATAX includes PWM peripherals suitable for basic motor speed control, its single-cycle execution model and lack of dedicated motor control timers limit performance in high-frequency field-oriented control (FOC) scenarios compared to ARM-based solutions. For brushed DC motors at lower speeds, the internal clock at 24MHz allows fine PWM resolution using timer prescalers; however, achieving sub-microsecond latency requires careful ISR optimization due to interrupt latency up to 7 cycles on non-maskable events.
How should decoupling capacitors be sized for the STM8AF52AATAX when transitioning from bench testing to production PCB layouts with mixed-signal components?
A minimum of 100nF ceramic capacitor per power pin (VDD/VSSA pairs) near the IC’s 80-pin footprint is essential to suppress high-frequency noise from digital switching. Additionally, a bulk 10µF tantalum or X7R MLCC placed within 5mm of the package reduces low-frequency ripple during current transients. In mixed-signal designs involving the onboard 16x10-bit ADC, separate analog ground planes and localized decoupling help prevent digital noise coupling into sensitive analog inputs—critical for maintaining ADC linearity above ±2 LSB.
What trade-offs exist between Flash endurance and application longevity when using the STM8AF52AATAX for battery-powered IoT edge devices with frequent data logging?
STMicroelectronics specifies 10,000 write cycles to Flash memory for the STM8AF52AATAX, which may be insufficient for direct EEPROM-style logging without wear leveling. Applications writing >100 bytes every few seconds risk premature failure after ~1–2 years under worst-case conditions. Mitigation strategies include buffering data in RAM before block writes, implementing circular buffers, or offloading persistent storage to external FRAM or NOR Flash. This extends operational life significantly beyond the MCU’s native endurance limits while preserving system integrity.
How does the STM8AF52AATAX handle electromagnetic interference (EMI) susceptibility in unshielded environments such as consumer electronics enclosures?
As an 8-bit MCU with internal oscillators only, the STM8AF52AATAX lacks hardened analog frontends or spread-spectrum clocking found in higher-end MCUs. Susceptibility increases with longer trace lengths and shared return paths between digital and analog sections. To mitigate risks, keep clock traces short (<10mm), use guard rings around critical signals like ADC inputs, and avoid routing high-speed SPI or I2C lines parallel to analog paths. External ferrite beads on power rails and TVS diodes on I/O lines further enhance robustness against conducted interference.
Is it feasible to upgrade legacy 8051-based designs to the STM8AF52AATAX without major architectural changes?
Partial compatibility exists through ST’s STM8 software development tools offering C-language abstractions similar to Keil’s 8051 experience. However, instruction set differences mean assembly code porting will require significant rework. The Harvard architecture with separate address spaces for Flash and RAM accelerates execution versus the von Neumann 8051, but memory access patterns must be redesigned for optimal performance. Peripheral register mapping also differs substantially, necessitating complete driver rewrite for components like UART baud rate generators or watchdog timers.
What impact does MSL 3 classification have on long-term storage and shelf-life management for tape-and-reel shipments of STM8AF52AATAX units?
With Moisture Sensitivity Level 3, the STM8AF52AATAX absorbs ambient moisture over time, posing delamination or popcorning risks if exposed to reflow soldering without baking. Shelf life is limited to 168 hours (7 days) once unsealed, though ST recommends baking at 125°C for 24 hours if absorbed moisture exceeds thresholds detected via humidity indicators. Proper ESD-protected storage and handling procedures are mandatory during assembly to prevent latent damage that may manifest later as parametric drift or functional failure.
How do the available package options influence board layout decisions for space-constrained wearable devices using the STM8AF52AATAX?
The standard 80-LQFP (14x14x1.4mm) consumes more surface area than alternatives like TSSOP or QFN packages not offered in this variant. For wearables, minimizing BOM height and lateral footprint is critical. The 0.5mm pitch still demands tight manufacturing tolerances; otherwise, tombstoning or solder bridging becomes probable. Thermal vias under the exposed pad (if applicable) improve heat dissipation but increase complexity in reflow profiles. Alternative packaging would be preferable, but absent here, careful DFM rules and stencil design are essential to ensure yield.
What role does the internal watchdog timer play in ensuring fail-safe operation for safety-critical applications using the STM8AF52AATAX?
The windowed or independent watchdog (IWDG) in the STM8AF52AATAX resets the MCU if software fails to periodically reload it, preventing hangs from infinite loops or corrupted state machines. In medical or automotive contexts where human safety depends on responsiveness, the IWDG provides hardware-enforced recovery. However, it cannot detect logical errors—only absence of software heartbeat. Therefore, it must complement application-level checks like stack overflow detection or critical variable monitors to achieve comprehensive fault containment.
How does the STM8AF52AATAX perform in low-power sleep modes relative to active consumption, and what wake-up latency considerations apply?
Active mode draws approximately 2mA at 24MHz with VDD=5V. In Halt mode with RAM retention, current drops to <1µA, enabling multi-year battery life for periodic sampling tasks. Wake-up from Halt occurs within 5–10µs using external interrupts or RTC alarms, sufficient for most energy-harvesting applications. However, reinitializing peripherals post-wakeup adds overhead; thus, context saving/restoration logic must account for this delay to maintain timing accuracy in time-sensitive operations like sensor fusion windows.
Are there any known errata or silicon limitations affecting reliability when deploying the STM8AF52AATAX in mass-produced consumer products?
While no public advisories currently flag catastrophic failures, historical STM8 family issues include occasional ADC offset drift under rapid temperature cycling (-40°C to +85°C transitions). Designers should validate ADC calibration routines under actual thermal profiles rather than relying solely on datasheet typical values. Additionally, Flash programming voltages must remain stable during erase/write cycles to avoid partial programming states—unrecoverable without external programmer intervention. These behaviors are not unique to the STM8AF52AATAX but reflect broader MCU programming constraints.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM8AF52AATAX

Product Attribute STM8AF52AATAY STM8AF52AATCY STM8AF52A9TAY STM8AF52A9TCY
Part Number STM8AF52AATAY STM8AF52AATCY STM8AF52A9TAY STM8AF52A9TCY
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Supply (Vcc/Vdd) - - - -
Program Memory Type - - - -
RAM Size - - - -
Number of I/O - - - -
Core Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Speed - - - -
Core Processor - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Peripherals - - - -
EEPROM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Data Converters - - - -
Oscillator Type - - - -
Connectivity - - - -
Series - - - -
Program Memory Size - - - -

STM8AF52AATAX Datasheet PDF

Download STM8AF52AATAX pdf datasheets and STMicroelectronics documentation for STM8AF52AATAX - STMicroelectronics.

HTML Datasheet
STM8AF52xx, STM8AF62xx.pdf
PCN Packaging
2.73KHz.pdf
PCN Assembly/Origin
STM8A Testing Chgs 13/Dec/2021.pdf
PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Region Country Logistic Time(Day)
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Brazil 7
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New Zealand 5
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0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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STM8AF52AATAX Image

STM8AF52AATAX

STMicroelectronics
98D-STM8AF52AATAX

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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