HCF4019M013TR Tech Specifications
STMicroelectronics - HCF4019M013TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - HCF4019M013TR

Product Attribute	Attribute Value
Part Number	HCF4019M013TR
Package	DAC91001
Description	DAC91001
Stock Condition	Get 14690 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	STMicroelectronics
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Frequently Asked Questions(FAQ)

How does the HCF4019M013TR compare to other quad 2-input AND gates in terms of propagation delay and power consumption when driving a 50 pF capacitive load at 10 MHz?: The HCF4019M013TR exhibits a typical propagation delay of 70 ns at VDD = 10 V and CL = 50 pF, which is competitive with similar CMOS AND gate implementations. When operating at 10 MHz with a 50 pF load, its dynamic power consumption remains below 1.2 mW due to low quiescent current (max 1 µA at 25°C) and efficient switching characteristics. This makes it suitable for moderate-speed digital designs where both speed and low-power operation are required.

What are the key thermal and electrical derating considerations when using the HCF4019M013TR in high-temperature industrial environments above 85°C?: Operating the HCF4019M013TR above 85°C requires careful attention to supply voltage and output current derating. The maximum junction temperature is 150°C, but CMOS devices exhibit increased leakage current as temperature rises—doubling every 10–15°C above 25°C. At 125°C, leakage can approach 1 µA per gate, potentially impacting static power in high-impedance designs. Additionally, output drive strength degrades slightly with temperature, so fanout should be limited to ≤10 loads above 100°C. Thermal resistance from junction to ambient for the SOP-16 package is approximately 100°C/W, necessitating layout considerations in compact systems.

Can the HCF4019M013TR safely interface directly with TTL logic levels without level-shifting circuitry?: Yes, the HCF4019M013TR accepts input voltages up to 15 V, which comfortably accommodates standard TTL high-level inputs (typically ≥2.4 V). With a VDD of 5 V, its VIH(min) is 3.5 V, ensuring reliable recognition of TTL high signals. However, TTL outputs may not reliably drive CMOS inputs low enough when VDD = 5 V—CMOS VIL(max) is 1.5 V, while TTL LO output may reach only ~0.8 V. Therefore, a pull-down resistor or open-drain configuration may be needed on the TTL side to ensure proper low-level recognition.

How should the enable inputs be managed when not all four AND gates in the HCF4019M013TR are used in a design?: Unused enable pins (G1, G2, G3, G4) must be tied to VDD through a resistor or directly connected to avoid floating inputs, which can cause unpredictable oscillation or increased power consumption due to internal transistor mismatch. For optimal noise immunity and stability, each unused enable should be driven high with a 1 kΩ to 10 kΩ pull-up resistor if VDD is unstable during power-up. This prevents unintended activation and ensures deterministic behavior across process and temperature variations.

What is the recommended decoupling strategy for the HCF4019M013TR in a mixed-signal PCB layout?: A 0.1 µF ceramic capacitor should be placed within 5 mm of the VDD and VSS pins to suppress high-frequency noise. In addition, a bulk capacitor (e.g., 10 µF tantalum or electrolytic) near the power entry point helps stabilize supply rails under transient loads. Care must be taken to minimize loop inductance by placing capacitors close to the IC and using short, wide traces. This is especially important when multiple HCF4019M013TRs are used in parallel, as simultaneous switching can induce significant current transients.

Does the HCF4019M013TR support hot-swapping into a powered system without risking latch-up?: The HCF4019M013TR is not specifically designed for hot-swap applications and lacks built-in ESD protection diodes on inputs beyond basic handling levels. Direct insertion into a live board could expose inputs to voltage transients, potentially triggering parasitic thyristor structures in CMOS technology. To mitigate risk, series resistors (e.g., 100 Ω) on inputs and a TVS diode near the IC can limit surge currents. Alternatively, ensure power sequencing aligns with input signal activity to prevent simultaneous high-voltage conditions.

What is the impact of supply voltage variation on noise margin and switching thresholds in the HCF4019M013TR?: The HCF4019M013TR maintains consistent logic thresholds across its supply range (3 V to 15 V), with VIH ≈ 0.7 × VDD and VIL ≈ 0.3 × VDD. This provides stable noise margins regardless of supply voltage. For example, at 5 V, NMH = 1.5 V and NML = 1.5 V; at 10 V, they increase to 3.5 V and 3.5 V. This scalability simplifies interfacing between different logic families and enhances noise tolerance in noisy environments, though higher VDD increases dynamic power proportionally.

How does the input capacitance of the HCF4019M013TR affect fanout and rise time when driving multiple gates?: Each input of the HCF4019M013TR has a typical input capacitance of 5 pF. Driving 10 loads results in an effective load of 50 pF, increasing propagation delay by approximately 35–50 ns compared to a light load. Rise and fall times can extend to over 100 ns under full fanout, potentially limiting usable clock speeds. To maintain performance, limit fanout to ≤10 or use buffer stages. This behavior is critical in timing-critical paths where cumulative capacitance degrades signal integrity.

Can the outputs of the HCF4019M013TR sink or source sufficient current to drive LEDs directly?: The HCF4019M013TR can source or sink up to 10 mA per output pin, which is adequate for small indicator LEDs. Using a 1 kΩ series resistor with a 5 V supply limits LED current to ~4 mA, well within specifications. However, repeated overdrive reduces reliability. Avoid direct connection to higher-current loads without external drivers, as sustained sourcing above 5 mA per pin may degrade long-term performance. Always verify thermal conditions in continuous operation.

What precautions are necessary when cascading multiple stages of HCF4019M013TR-based logic to avoid skew accumulation?: In cascaded configurations, ensure uniform propagation delays by matching supply voltages and keeping trace lengths equal in clock or data paths. Since each HCF4019M013TR stage adds ~70 ns delay, a 5-stage chain introduces ~350 ns skew, which may exceed setup times in synchronous systems. Use buffering or clock distribution networks to isolate delays. Also, account for temperature gradients across the PCB, as local heating can alter delay characteristics unpredictably.

Is the HCF4019M013TR suitable for use in automotive-grade applications requiring AEC-Q100 qualification?: No, the HCF4019M013TR is not qualified to AEC-Q100 standards. While ST manufactures robust CMOS components, this part is listed as commercial grade. Automotive applications demand extended temperature range, enhanced reliability testing, and failure mode analysis not covered in standard datasheets. Substitution with an automotive-qualified alternative like the STMicroelectronics HCF4019BT or equivalent AEC-Q100-compliant variant would be necessary for such environments.

How does the package parasitics of the SOP-16 affect high-impedance node performance in analog-to-digital control circuits?: The SOP-16 package introduces modest parasitic capacitance (~3–5 pF) between leads and exposed pad, which can interact with high-impedance nodes in precision circuits. In applications where the HCF4019M013TR controls sample-and-hold switches or ADC enable lines, this coupling may introduce glitches during transitions. Minimize exposure by using guard rings or routing sensitive traces away from IC pins. For highest accuracy, consider discrete gate implementations with matched packages.

What is the expected lifetime and degradation profile for the HCF4019M013TR under continuous switching at 50% duty cycle?: Under continuous operation at 50% duty cycle and 5 V supply, the HCF4019M013TR exhibits negligible aging effects typical of CMOS devices. Leakage current increases minimally over decades of operation, and oxide reliability is ensured by process design rules. Field data suggests no significant degradation within 10+ years under normal conditions. However, elevated temperatures accelerate electromigration in bond wires, so sustained currents above 5 mA per pin should be avoided to preserve long-term reliability.

Can the HCF4019M013TR be used in a bidirectional bus configuration with tri-state buffers?: The HCF4019M013TR does not have tristate outputs. Attempting to use it in a shared bus with tri-state devices risks contention if multiple outputs drive the same line simultaneously. Only one active driver should control the bus at any time. If bidirectional logic is required, pair the HCF4019M013TR with dedicated tristate buffers like the ST74HC245T. Proper enable sequencing is essential to prevent shoot-through currents.

How does the HCF4019M013TR behave when one input is left floating while the other is driven high?: Floating inputs on CMOS devices like the HCF4019M013TR can lead to indeterminate states due to internal transistor mismatches. Even with one input driven high, a floating input may oscillate or draw excessive current as charge redistributes across parasitic capacitances. Always tie unused inputs to VDD or VSS via resistors (10 kΩ typical) to fix their state. This ensures predictable operation and avoids increased power dissipation from unintended conduction paths.

What are the storage and soldering requirements for the HCF4019M013TR to prevent moisture-induced failures?: The HCF4019M013TR should be stored in dry ambient conditions (<60% RH) and used within 12 months of manufacture unless sealed. If shipped in moisture-sensitive packaging (MSL 1 or 2), bake prior to reflow if exposure exceeded 168 hours at 30°C/60% RH. Reflow profiles must follow JEDEC J-STD-020, avoiding peak temperatures above 260°C for ≤10 seconds. Non-compliance risks popcorning during assembly due to trapped moisture in the epoxy mold compound.

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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HCF4019M013TR

STMicroelectronics
32D-HCF4019M013TR

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HCF4019M013TR - STMicroelectronics

Specifications

Frequently Asked Questions(FAQ)

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

Solid diode for power rectification. Works well in switching circuits.

Compact FPGA with good performance. Suitable for basic signal processing tasks.

Reliable I/O expander. Works well in embedded control applications.

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.