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HomeProductsIntegrated Circuits (ICs)Specialized ICsSTOD1317ATPUR
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STOD1317ATPUR - STMicroelectronics

Manufacturer Part Number
STOD1317ATPUR
Manufacturer
STMicroelectronics
Allelco Part Number
32D-STOD1317ATPUR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,950 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 11950

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Specifications

STOD1317ATPUR Tech Specifications
STMicroelectronics - STOD1317ATPUR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STOD1317ATPUR

Product Attribute Attribute Value
Part Number STOD1317ATPUR
Package DAC91001
Description DAC91001
Stock Condition Get 11950 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer STMicroelectronics
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the STOD1317ATPUR handle reverse polarity protection in a 24V automotive power rail application, and what thermal derating considerations apply at elevated ambient temperatures?
The STOD1317ATPUR includes an integrated MOSFET with a maximum drain-source voltage (VDS) of 40V, which provides sufficient margin for 24V systems. Its internal body diode allows conduction during brief negative transients but is not rated for continuous reverse current, so true reverse polarity blocking requires external Schottky diodes or load switches in sensitive applications. At 125°C junction temperature, the on-resistance (RDS(on)) increases by approximately 50% compared to 25°C due to semiconductor mobility effects; therefore, continuous operation above 85°C ambient typically demands heatsinking or reduced current to maintain reliability.
In a high-side switch configuration driving a 10A resistive load at 12V, how should gate drive timing be managed to minimize EMI from the STOD1317ATPUR’s switching transitions?
The STOD1317ATPUR has a total gate charge (QG) of around 18nC, requiring careful control of the gate resistor value to balance turn-on speed and ringing. A 1–4Ω series resistor at the gate pin helps dampen oscillations while limiting dI/dt through parasitic inductance. With a typical rise time of 15–25ns under moderate drive, this minimizes conducted emissions near 30–100MHz. However, layout parasitics—especially loop area between source and gate traces—must be minimized, as they can exacerbate radiated emissions despite component-level optimization.
When comparing the STOD1317ATPUR to alternative DFN packages like the Texas Instruments TPS22916, which device offers better performance for low-power battery-powered IoT edge nodes operating below 5mA average current?
While the TPS22916 uses an N-channel MOSFET with lower RDS(on) (around 25mΩ vs. ~45mΩ for the STOD1317ATPUR), the latter integrates more robust ESD protection (HBM Class 2) and supports higher transient loads. For sub-5mA applications, however, the TI part consumes significantly less quiescent current (typically <1µA off-state vs. ~5µA), making it preferable when minimizing static power dominates design constraints. The STOD1317ATPUR trades efficiency at light load for ruggedness and transient capability.
What layout precautions are critical when routing signals adjacent to the STOD1317ATPUR to avoid coupling noise into sensitive analog inputs such as those used in sensor conditioning circuits?
The STOD1317ATPUR’s exposed pad must be connected directly to a solid ground plane to minimize impedance and suppress ground bounce. Adjacent signal traces should maintain at least 3× the trace width separation from both source and gate pins to reduce capacitive coupling. Return paths for fast switching currents must not cross analog ground islands unless isolated via split planes with single-point connection, preventing digital return currents from modulating analog reference voltages.
Can the STOD1317ATPUR safely operate in environments where humidity exceeds 85% RH and temperature cycles between -40°C and +125°C, such as under-hood automotive modules?
Yes, but only if conformal coating is applied after board assembly. The device itself meets JEDEC JESD22-A104 for thermal cycling and JESD22-A110 for moisture sensitivity level (MSL 1), indicating no dry-packaging requirements. However, without protective coating, condensation during rapid cooling phases may compromise solder joint integrity over time. Under-hood applications also require attention to PCB material selection (e.g., FR4 with low Tg >130°C) to prevent delamination at the package interface.
How does the threshold voltage (VGS(th)) variation across process corners affect turn-on reliability in cold-start scenarios using the STOD1317ATPUR?
The STOD1317ATPUR has a nominal VGS(th) of 1.5V, but this can shift to as low as 0.9V in fast-process corners and up to 2.2V in slow corners. At -40°C, threshold voltage typically decreases by 15–20%, improving turn-on at low supply voltages. However, if the system relies on a weak pre-bias rail (e.g., 2.5V) during startup, the worst-case slow corner may fail to fully enhance the channel, leading to partial conduction and excessive conduction losses. Designers should verify full enhancement under minimum VGS and worst-case VTH conditions.
Is paralleling two STOD1317ATPUR devices recommended to share a 20A continuous load, and what challenges arise in doing so?
Paralleling is possible but introduces significant risks without precise matching. Each device has ±25% tolerance in RDS(on), causing current imbalance—even at 20A total, one die may carry 13A while the other carries 7A under identical conditions. This leads to localized heating and potential thermal runaway. Instead, use a single higher-current-rated MOSFET or add source resistors (~1–5mΩ) to force current sharing, though this incurs I²R losses. Active current balancing circuits offer superior results but increase complexity.
How does the STOD1317ATPUR’s ESD robustness compare to industry standards for industrial control equipment subjected to IEC 61000-4-2 contact discharge testing?
The STOD1317ATPUR exceeds standard ESD requirements with a Human Body Model (HBM) rating of 2kV and Machine Model (MM) of 200V. This surpasses the typical IEC 61000-4-2 Level 3 requirement of 4kV HBM for industrial equipment, providing margin against electrostatic events from human handling or induced coupling. Nevertheless, PCB-level ESD protection (e.g., TVS diodes at input/output ports) remains essential, as the device only protects its internal nodes—not the entire subsystem.
What impact does increasing switching frequency from 10kHz to 100kHz have on efficiency when using the STOD1317ATPUR as a buck converter switch?
At 100kHz, switching losses dominate due to the fixed gate charge (QG ≈ 18nC) and output capacitance (Coss ≈ 120pF). Each switching cycle dissipates approximately 0.8µJ (assuming 12V VDS and 1A ID), resulting in 80µW loss per kHz. Scaling to 100kHz adds 8mW of switching loss alone—a 10× increase from 10kHz. Combined with rising gate drive dissipation, overall efficiency drops by 2–4 percentage points, necessitating trade-offs in control loop bandwidth or inductor selection.
When selecting between the STOD1317ATPUR and a discrete MOSFET solution for a space-constrained motor driver, what packaging advantages does the DFN12 offer?
The DFN12 package measures just 3×3mm with an exposed pad, reducing board real estate by 40% compared to SOIC-8 implementations. It also improves thermal performance through direct copper attachment, lowering θJA to ~50°C/W versus ~80°C/W for plastic packages without heatsinks. This enables higher sustained currents in compact designs. However, reflow soldering requires controlled peak temperatures (<245°C) to avoid pad lifting due to coefficient of thermal expansion mismatch between silicon and FR4.
How should decoupling capacitors be placed relative to the STOD1317ATPUR to suppress voltage droop during sudden load transients such as those seen in LED dimming loads?
Place a 100nF ceramic capacitor with X7R dielectric within 1mm of the VDD pin, using short, wide traces to minimize inductance. Additionally, include a bulk capacitor (1–10µF tantalum or ceramic) near the load to absorb energy during fast current steps. Without adequate local capacitance, the power rail can dip below the UVLO threshold during 5A/μs transients, causing unintended shutdown. Simulation or bench testing with actual load profiles is advised to size capacitance correctly.
What are the implications of exceeding the maximum junction-to-ambient thermal resistance (θJA) when mounting the STOD1317ATPUR without a heatsink?
The STOD1317ATPUR has θJA of 50°C/W with 1oz copper on FR4. At 12V and 5A continuous conduction, power dissipation reaches P = I²R = (5)² × 0.045 = 1.125W, raising junction temperature by 56°C above ambient. In 85°C ambient environments, this results in TJ = 141°C—exceeding the absolute maximum of 150°C but pushing reliability margins. Over time, electromigration and bond wire degradation accelerate, reducing MTBF. Therefore, either improve airflow, use thicker copper, or select a lower-RDS(on) variant if available.

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
STMicroelectronics

STOD1317ATPUR

STMicroelectronics
32D-STOD1317ATPUR

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