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Home Products Integrated Circuits (ICs)Specialized ICs~~S25FL128LAGNFB010~~

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S25FL128LAGNFB010 -

Name: S25FL128LAGNFB010
SKU: S25FL128LAGNFB010
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: S25FL128LAGNFB010

Manufacturer

Allelco Part Number: 53D-S25FL128LAGNFB010

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 13,964 pcs available, New & Original

Parts Description: -

Data sheet: -

Category: Integrated Circuits (ICs) > Specialized ICs

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In stock: 13964

Specifications

S25FL128LAGNFB010 Tech Specifications
- S25FL128LAGNFB010 technical specifications, attributes, parameters and parts with similar specifications to - S25FL128LAGNFB010

Product Attribute	Attribute Value
Part Number	S25FL128LAGNFB010
Package	-
Description	-
Stock Condition	Get 13964 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	-
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Parts Introduction

Manufacturer Part Number

S25FL128LAGNFB010

Manufacturer

Infineon Technologies

Introduction

The Infineon S25FL128LAGNFB010 is a high-performance, low-power, NOR-type FLASH memory device with a memory capacity of 128Mbit. It offers a wide operating temperature range, SPI/Quad I/O and QPI interfaces, and is qualified to the AEC-Q100 automotive standard, making it suitable for a variety of industrial and automotive applications.

Product Features and Performance

128Mbit memory capacity

SPI, Quad I/O, and QPI interfaces for high-speed data transfer

Operating frequency up to 133MHz

Wide operating temperature range of -40°C to +105°C

Low power consumption in active and standby modes

Fast program and erase times

Sophisticated security features, including Secure Boot and Hardware Encryption

Product Advantages

Automotive-grade qualification for reliable operation in harsh environments

Versatile interface options for compatibility with various system architectures

High performance and energy efficiency for critical applications

Robust security features to protect against unauthorized access and data theft

Key Reasons to Choose This Product

Proven reliability and performance in demanding industrial and automotive applications

Seamless integration into a wide range of embedded systems

Cost-effective solution with a long product lifecycle

Backed by Infineon's extensive technical support and customer service

Quality and Safety Features

AEC-Q100 qualified for automotive applications

Robust design and manufacturing processes to ensure long-term reliability

Built-in security features to protect against data breaches and system vulnerabilities

Compatibility

The S25FL128LAGNFB010 is compatible with a variety of microcontrollers, processors, and system-on-chip (SoC) devices that support SPI, Quad I/O, and QPI interfaces.

Application Areas

Automotive electronics (e.g., ECUs, infotainment systems, advanced driver assistance systems)

Industrial automation and control systems

Networking and communication equipment

Medical devices and healthcare equipment

Portable and IoT devices

Product Lifecycle

The S25FL128LAGNFB010 is an active product and is not nearing discontinuation. Equivalent or alternative models are available, such as the S25FL128LAGNFI010 and S25FL128LAGNFI020, which offer similar features and performance. Customers are advised to contact our website's sales team for more information on product availability and alternatives.

Frequently Asked Questions(FAQ)

How does the S25FL128LAGNFB010 compare to other 128Mbit NOR Flash devices in terms of interface flexibility and clock speed for automotive-grade applications?: The S25FL128LAGNFB010 supports both standard SPI and Quad I/O (QPI) modes, enabling higher data throughput compared to single-bit SPI-only alternatives. With a maximum clock frequency of 133 MHz, it achieves significantly faster read performance than typical 50–75 MHz parts, making it suitable for real-time firmware execution in automotive systems. This dual-mode capability allows system designers to balance pin count and speed requirements during layout optimization.

What are the key thermal and environmental constraints when integrating the S25FL128LAGNFB010 into a high-temperature automotive powertrain control module?: Operating reliably from -40°C to +105°C ensures compatibility with under-hood environments where ambient temperatures can exceed 100°C due to proximity to engine components. The device’s AEC-Q100 Grade 1 qualification confirms long-term stability under thermal cycling and extended exposure, reducing risk of functional failure in harsh conditions. Designers must still consider PCB solder joint reliability and thermal vias near the 8-WSON package to maintain junction temperature within safe limits during peak power events.

Can the S25FL128LAGNFB010 be used as an XIP (execute-in-place) memory for boot code in safety-critical automotive ECUs?: Yes, its 133 MHz clock frequency and support for Quad I/O enable fast random access required for XIP applications. The NOR architecture allows direct execution of code without full RAM buffering, conserving system resources. However, firmware must avoid write operations during active execution unless protected by hardware write protection features, which are configurable via status registers.

How should system designers manage signal integrity challenges when routing the S25FL128LAGNFB010’s DQ0–DQ3 pins over distances exceeding 10 cm on a multi-layer PCB?: For traces longer than 10 cm, controlled impedance routing (typically 50 Ω differential or 100 Ω single-ended differential) is recommended to minimize reflections. Termination resistors near the controller may improve signal quality, especially at full 133 MHz operation. Additionally, avoiding parallel routing with noisy lines such as switching regulators reduces crosstalk. Layout should follow Infineon’s reference design guidelines for WSON packages to maintain timing margins.

What distinguishes the power consumption profile of the S25FL128LAGNFB010 from lower-speed NOR Flash alternatives in battery-operated automotive subsystems?: While active read current peaks around 15 mA at 133 MHz, standby current drops below 1 µA in deep power-down mode—critical for systems requiring low quiescent current. Compared to slower SPI-only devices that may consume similar active current but require more frequent polling, this part offers better energy efficiency for intermittent data logging tasks in telematics units.

Is the S25FL128LAGNFB010 compatible with legacy SPI controllers that do not support Quad I/O commands?: Absolutely. The device operates seamlessly in standard SPI mode using only DQ0 (SI) and DQ1 (SO), falling back gracefully to single-data-rate transfers even if QPI is not supported. This backward compatibility ensures integration into existing platforms while allowing future migration to quad-mode for bandwidth upgrades.

What considerations apply when implementing wear leveling or block protection strategies with the S25FL128LAGNFB010?: Although the device lacks internal wear-leveling logic, software-based wear leveling must account for erase cycle limits (~100k cycles per sector). Block protection registers allow locking specific regions against accidental writes, useful for preserving calibration data. However, partial sector updates require careful management to avoid premature wear on frequently modified pages.

How does the Moisture Sensitivity Level (MSL) rating of 3 for the S25FL128LAGNFB010 affect handling and storage in high-humidity manufacturing facilities?: Classified as MSL 3, the component must be used within 168 hours after opening dry-packaging unless baked according to JEDEC J-STD-033 standards. In humid assembly environments, this necessitates humidity indicator cards and controlled atmosphere storage to prevent popcorning during reflow soldering, particularly important given the exposed pad design of the 8-WSON package.

What impact does voltage droop during programming have on write reliability in the S25FL128LAGNFB010?: Write operations require stable VCC between 2.7V and 3.6V; transient drops below 2.5V can cause incomplete program cycles leading to bit errors. Designers should ensure adequate decoupling capacitance (>10 µF bulk + 0.1 µF ceramic) close to the supply pins, especially during erase/program bursts. Brown-out detection features can alert firmware to abort operations before corruption occurs.

In what scenarios would replacing the S25FL128LAGNFB010 with a smaller-capacity NOR Flash compromise system robustness?: Using a 64Mbit part instead of 128Mbit might force compression or truncation of diagnostic logs in event recorders, limiting forensic utility post-failure. Similarly, insufficient space could require splitting code across multiple chips, increasing complexity and fault points. The extra capacity also provides margin for OTA updates and feature expansion in long-lifecycle vehicle models.

How does the absence of ECC in the S25FL128LAGNFB010 influence error handling in functional safety applications?: Without built-in error correction, single-bit flips due to cosmic rays or electromagnetic interference must be mitigated through external redundancy, watchdog timers, or application-level checksums. Safety-critical functions like airbag deployment logic may require architectural hardening beyond the memory itself, such as lockstep processors and periodic memory scrubbing routines.

What role does the exposed pad play in thermal management for the S25FL128LAGNFB010 during continuous high-throughput streaming?: The exposed thermal pad enhances heat dissipation from the silicon die to the PCB ground plane, reducing junction temperature under sustained read/write loads. Properly soldered with minimal solder voids and connected to a solid copper pour improves thermal conductivity, helping maintain performance and longevity in densely packed automotive electronics stacks.

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

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Contact us if you have any questions.

Phone: +00852 9146 4856
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA