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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC2VP7-6FF672I
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XC2VP7-6FF672I - AMD

Manufacturer Part Number
XC2VP7-6FF672I
Manufacturer
AMD Xilinx
Allelco Part Number
98D-XC2VP7-6FF672I
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,490 pcs available, New & Original
Parts Description
IC FPGA 396 I/O 672FCBGA
Package
672-FCBGA (27x27)
Data sheet
XC2VP7-6FF672I.pdf

PCN Obsolescence/ EOL

Mult Dev EOL 6/Jan/2020.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
 
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In stock: 16490

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Specifications

XC2VP7-6FF672I Tech Specifications
AMD - XC2VP7-6FF672I technical specifications, attributes, parameters and parts with similar specifications to AMD - XC2VP7-6FF672I

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 811008
Supplier Device Package 672-FCBGA (27x27)
Series Virtex®-II Pro
Package / Case 672-BBGA, FCBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 11088
Number of LABs/CLBs 1232
Number of I/O 396
Mounting Type Surface Mount
Base Product Number XC2VP7

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the XC2VP7-6FF672I compare to other Virtex-II Pro FPGAs in terms of logic density and power efficiency for high-performance embedded applications?
The XC2VP7-6FF672I contains 11,088 logic elements and 1,232 LABs, offering a balanced mix of logic resources within the Virtex-II Pro family. While it provides higher logic capacity than lower-density variants like the XC2VP30, its power consumption scales accordingly due to increased routing complexity and I/O load. For designs requiring more than 5,000 logic elements but constrained by thermal or supply voltage limits (1.425V–1.575V), this device represents a middle ground between area efficiency and functionality. Compared to larger members such as the XC2VP50, it consumes less dynamic power per logic unit but may necessitate additional buffering or partitioning in systems where full system-on-chip integration is needed.
What are the implications of using the XC2VP7-6FF672I in a system requiring -40°C to 100°C operation, especially regarding timing closure and signal integrity?
Operating across -40°C to 100°C introduces significant process-voltage-temperature (PVT) variation effects on the XC2VP7-6FF672I’s internal delays. At temperature extremes, clock skew increases due to slower transistor switching speeds at low temperatures and elevated leakage at high temperatures. Designers must apply margining during static timing analysis—typically adding 10–15% extra slack—to ensure setup and hold times are met under worst-case conditions. Additionally, long interconnects benefit from controlled impedance routing and termination strategies to mitigate reflection risks over extended operating ranges. Thermal gradients across the FCBGA package can also cause localized performance shifts, so floorplanning should avoid placing critical paths near package edges.
Can the XC2VP7-6FF672I support DDR memory interfaces, and what design considerations apply when implementing such high-speed I/O?
Yes, the XC2VP7-6FF672I includes programmable SERDES and high-speed differential I/O blocks capable of supporting DDR2 and DDR3 protocols up to several hundred Mbps. However, achieving reliable operation requires careful attention to reference clock jitter tolerance, equalization settings, and PCB trace length matching within ±50 mils for data lines. The device’s internal delay-locked loops (DLLs) help deskew incoming clocks, but external termination resistors and proper layer stackup (with dedicated reference planes) are essential to maintain eye diagram integrity. Power integrity is equally critical; decoupling capacitors must be placed within 2 mm of each VCCO bank to suppress switching noise that could corrupt high-speed signaling.
How does the 672-FCBGA packaging affect board-level reliability and assembly yield for the XC2VP7-6FF672I?
The 672-pin FCBGA (27×27 mm) configuration demands precise solder joint formation during reflow, with tight tolerances on ball pitch (typically 1 mm) and pad registration accuracy. Poor alignment during pick-and-place can lead to bridging or open joints, particularly affecting power and ground balls. Given its MSL4 classification (72-hour window after dry pack removal), handling must follow strict anti-static and moisture control procedures to prevent popcorning. From a reliability standpoint, the FCBGA enables shorter global interconnects compared to QFP alternatives, reducing electromigration risk and improving thermal dissipation through direct die attachment to the substrate, though hotspot management remains necessary due to concentrated power delivery.
What is the maximum achievable clock frequency for user logic in the XC2VP7-6FF672I, and how does resource utilization influence this?
The theoretical maximum clock frequency depends heavily on architectural choices and routing congestion. In typical implementations with moderate logic density (<60% utilization), internal routing allows for frequencies up to 300 MHz. However, pushing beyond 250 MHz often requires pipelining, which trades latency for throughput. High fanout signals and complex combinational paths can reduce achievable speed by 20–30%. For example, a single 16-bit carry chain spanning multiple CLBs might limit the clock to ~200 MHz unless partitioned. Thus, while the XC2VP7-6FF672I supports high-speed designs, practical limits emerge from synthesis and placement constraints rather than raw gate count alone.
How does the XC2VP7-6FF672I handle configuration security, and what mechanisms exist to prevent unauthorized bitstream loading?
The XC2VP7-6FF672I supports AES encryption via external configuration devices when using SelectMAP or JTAG interfaces with a secure key loaded into an external SPI flash. Without hardware protection, the FPGA can be reprogrammed arbitrarily through standard programming modes. To enforce authenticity, designers implement one-time-programmable fuses or use Xilinx’s built-in boot protection features (though note that RoHS non-compliance may impact availability of newer security tools). It is recommended to pair the device with tamper-resistant configuration storage and validate checksums before loading user logic to mitigate firmware injection attacks.
What trade-offs exist between using block RAM versus distributed RAM in the XC2VP7-6FF672I for small lookup tables?
Block RAM in the XC2VP7-6FF672I offers 811,008 total bits organized into 1,232 configurable blocks, ideal for larger memories (>2 KB) or wide data buses. Distributed RAM uses LUTs as memory elements and consumes no block RAM resources. For small LUTs (<16 words × 16-bit width), distributed RAM reduces routing overhead and avoids fragmenting available BRAM, but increases LUT usage by approximately 15–20%. In contrast, block RAM minimizes power consumption and preserves logic resources for control logic. Therefore, selecting between them hinges on balancing area efficiency against power budgets and ensuring sufficient BRAM remains for other functions like FIFO buffers or frame memory.
Is the XC2VP7-6FF672I suitable for radiation-hardened or industrial-grade applications requiring long-term field deployment?
No, the XC2VP7-6FF672I is not specified for radiation-hardened environments and lacks the latch-up immunity, SEU mitigation, and extended temperature cycling validation required for aerospace or deep-industrial use. Its commercial-grade qualification (-40°C to 100°C TJ) ensures functional operation but does not guarantee reliability under ionizing radiation or mechanical stress. For mission-critical systems, alternative solutions such as hardened-by-design FPGAs or triple-modular redundancy architectures should be considered. Even in non-radiated industrial settings, derating logic utilization below 50% and avoiding single points of failure in clock distribution networks improves mean time between failures (MTBF).
How does the voltage range of 1.425V to 1.575V affect mixed-signal interface compatibility for the XC2VP7-6FF672I?
This narrow core voltage window aligns with 1.5V LVCMOS standards, limiting compatibility with newer 3.3V or 1.8V I/O families without level-shifting circuitry. When interfacing with legacy peripherals (e.g., RS-232 transceivers or older DRAM), external translation circuits add BOM cost and layout complexity. Additionally, VCCO banks must be independently regulated if driving multiple I/O standards, complicating power sequencing. Designers should verify that all connected ASICs or ASSPs support 1.5V inputs/outputs or plan for discrete voltage translators to avoid damaging either side of the interface.
What role do the global clock buffers in the XC2VP7-6FF672I play in achieving deterministic timing across large designs?
The XC2VP7-6FF672I features four dedicated global clock networks driven by BUFG primitives, which provide low-skew distribution of clock signals to hundreds of flip-flops simultaneously. These buffers compensate for RC delays along long metal routes, maintaining phase coherence critical for synchronous systems. Without proper global clocking, local routing variations can introduce skew exceeding 100 ps, violating timing constraints above 150 MHz. By strategically placing flip-flops on global clock trees and minimizing use of regional buffers (BUFGCE), engineers achieve more predictable propagation delays, enabling higher clock margins and simplifying timing closure efforts in multi-clock domain partitions.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC2VP7-6FF672I

Product Attribute XC2VP7-6FFG672I XC2VP7-6FFG672C XC2VP7-5FFG672I XC2VP7-6FF672C
Part Number XC2VP7-6FFG672I XC2VP7-6FFG672C XC2VP7-5FFG672I XC2VP7-6FF672C
Manufacturer AMD AMD AMD AMD
Mounting Type - Surface Mount Through Hole Surface Mount
Number of I/O - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Base Product Number - DAC34H84 MAX500 ADS62P42
Total RAM Bits - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of LABs/CLBs - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of Logic Elements/Cells - - - -
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply - - - -

XC2VP7-6FF672I Datasheet PDF

Download XC2VP7-6FF672I pdf datasheets and AMD documentation for XC2VP7-6FF672I - AMD.

Datasheets
Virtex-II Pro, Pro X.pdf
PCN Obsolescence/ EOL
Mult Dev EOL 6/Jan/2020.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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XC2VP7-6FF672I Image

XC2VP7-6FF672I

AMD
98D-XC2VP7-6FF672I

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