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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC2VP7-6FFG672C
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XC2VP7-6FFG672C - AMD

Manufacturer Part Number
XC2VP7-6FFG672C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC2VP7-6FFG672C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,550 pcs available, New & Original
Parts Description
IC FPGA 396 I/O 672FCBGA
Package
672-FCBGA (27x27)
Data sheet
XC2VP7-6FFG672C.pdf

PCN Obsolescence/ EOL

Mult Dev EOL 6/Jan/2020.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 15550

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Specifications

XC2VP7-6FFG672C Tech Specifications
AMD - XC2VP7-6FFG672C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC2VP7-6FFG672C

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 811008
Supplier Device Package 672-FCBGA (27x27)
Series Virtex®-II Pro
Package / Case 672-BBGA, FCBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 11088
Number of LABs/CLBs 1232
Number of I/O 396
Mounting Type Surface Mount
Base Product Number XC2VP7

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

XC2VP7-6FFG672C Image
XC2VP7-6FFG672C (1)

Manufacturer Part Number

XC2VP7-6FFG672C

Manufacturer

Xilinx

Introduction

The Xilinx XC2VP7-6FFG672C is a high-performance, field-programmable gate array (FPGA) from the Virtex-II Pro series. It is designed for a wide range of embedded applications, offering a balance of logic resources, on-chip memory, and high-speed serial transceivers.

Product Features and Performance

1232 logic cells (CLBs) and 11,088 logic elements

811,008 total RAM bits

396 user-programmable I/O pins

Operates at a supply voltage of 1.425V to 1.575V

Operating temperature range of 0°C to 85°C (junction temperature)

672-pin BBGA (Ball Grid Array) package, 27x27 mm size

Product Advantages

Versatile and reconfigurable architecture for flexible design implementation

Optimized for high-performance, low-power embedded applications

Integrated serial transceivers for high-speed data communication

Extensive on-chip memory resources for data buffering and processing

Key Reasons to Choose This Product

Powerful FPGA capabilities with a robust feature set

Proven Virtex-II Pro technology for reliable and efficient performance

Scalable solution for a wide range of embedded system requirements

Supports rapid prototyping and design flexibility

Quality and Safety Features

Rigorously tested and validated to meet Xilinx's quality standards

Designed with robust power management and thermal considerations

Supports various safety-critical applications through advanced features

Compatibility

The XC2VP7-6FFG672C is compatible with the Virtex-II Pro series of FPGAs and can be used in a variety of embedded systems and applications.

Application Areas

Industrial automation and control systems

Medical imaging and instrumentation

Telecommunications and networking equipment

Military and defense applications

Scientific and research equipment

Product Lifecycle

The XC2VP7-6FFG672C is an obsolete product, meaning it is no longer in active production. However, there are several equivalent and alternative Virtex-II Pro FPGA models available from Xilinx that may be suitable replacements. If you require more information or assistance in finding a suitable alternative, please contact our website's sales team.

Frequently Asked Questions(FAQ)

How does the XC2VP7-6FFG672C handle power sequencing during startup, and what are the implications for board-level power supply design?
The XC2VP7-6FFG672C requires careful adherence to power-up sequencing due to its dual-rail architecture—core voltage (VCCINT) at 1.5V nominal and I/O voltage (VCCO) banks that can operate from 1.2V to 3.3V. AMD recommends bringing VCCINT up before or simultaneously with VCCO to prevent latch-up and ensure proper configuration. A typical design uses sequenced regulators or power management ICs with enable pin control. Deviations can cause unpredictable I/O behavior or increased inrush current, especially with 396 user I/Os active during configuration.
What is the significance of the 811008 total RAM bits in the XC2VP7-6FFG672C, and how does it influence memory-intensive embedded applications?
The XC2VP7-6FFG672C integrates 811008 bits of block RAM, organized as 36 individually configurable 18Kb blocks. This allows implementation of moderate-sized FIFOs, lookup tables, or small instruction caches without external memory. For example, a dual-port 16K x 32-bit buffer consumes approximately 512Kb, leaving headroom for control logic. However, for larger datasets, external DDR or SRAM remains necessary—this on-chip RAM is best suited for latency-sensitive data staging rather than bulk storage.
Can the XC2VP7-6FFG672C support high-speed serial interfaces like RocketIO, and what design considerations apply?
Yes, the XC2VP7-6FFG672C includes embedded RocketIO multi-gigabit transceivers capable of 3.125 Gbps per lane. When implementing serial links, impedance-controlled routing (100Ω differential), proper reference clocking, and power supply decoupling near transceiver banks are critical. Ground plane integrity under the 672-FCBGA package is essential to minimize return path discontinuities. Thermal management also becomes relevant at sustained high data rates due to localized power dissipation in the transceiver tiles.
How does the 672-FCBGA (27x27) package affect PCB layout and thermal performance in compact embedded systems?
The 672-FCBGA package with 1mm ball pitch demands high-density interconnect (HDI) PCB design, typically requiring microvias and 6+ layers for escape routing. Due to the 396 I/Os, signal integrity must be prioritized—controlled impedance traces, length matching, and via stub minimization are standard practices. Thermally, the package’s 0°C to 85°C junction range assumes adequate airflow or a thermal pad connection to the PCB. In enclosed environments, a heat spreader or thermal vias under the die pad help maintain TJ within limits under full logic utilization.
What are the trade-offs between using the XC2VP7-6FFG672C versus a newer FPGA family for a legacy system upgrade?
While the XC2VP7-6FFG672C offers proven reliability and lower unit cost in mature designs, it lacks modern features like hardened PCIe, DDR3/4 controllers, or lower static power. Migrating to a newer architecture (e.g., Artix-7 or Zynq-7000) could reduce total system power by 40–60% and simplify I/O expansion. However, redesign effort, toolchain changes, and potential re-certification may outweigh benefits unless power, performance, or integration density are critical constraints.
How does the MSL 4 rating of the XC2VP7-6FFG672C impact manufacturing and handling procedures?
With an MSL 4 (72-hour floor life), the XC2VP7-6FFG672C must be baked for 24 hours at 125°C if exposed to ambient conditions beyond 72 hours post-vacuum seal. This prevents moisture-induced delamination during reflow. Manufacturers must track exposure time using humidity indicator cards and maintain dry storage (<5% RH) for unused components. Automated placement systems should minimize dwell time between opening and reflow to avoid costly rework.
What configuration methods are supported by the XC2VP7-6FFG672C, and how do they affect boot time in embedded applications?
The XC2VP7-6FFG672C supports Master Serial, Slave Serial, Master SelectMAP, and JTAG configuration modes. Master Serial using a parallel NOR flash offers the fastest boot—typically under 50ms with a 16Mb device at 50 MHz CCLK. Slave Serial via microcontroller is slower but more flexible for field updates. Designers must ensure the configuration clock meets timing margins, especially with long trace lengths, and consider watchdog timers to detect and recover from failed boots in unattended systems.
How does the 1.425V to 1.575V core voltage range influence power supply noise margins and decoupling strategy?
The narrow ±5% tolerance on VCCINT (nominal 1.5V) demands tight regulation and low-noise power delivery. A typical design uses a point-of-load regulator with <2% ripple and places 0.1µF and 10µF capacitors within 2mm of each VCCINT pin. Simultaneous switching of 396 I/Os can induce ground bounce, so decoupling must account for transient current spikes during configuration or high-toggle-rate logic. Poor decoupling risks functional errors or reduced timing margin in the 11,088 logic cells.
In what scenarios would the XC2VP7-6FFG672C be preferred over a microcontroller-based solution for embedded control?
The XC2VP7-6FFG672C excels in applications requiring parallel processing, custom peripherals, or real-time deterministic response—such as motor control with sub-microsecond loop timing or protocol bridging across multiple asynchronous interfaces. Unlike microcontrollers, its 1232 CLBs allow hardware-level state machines and glue logic integration, reducing component count. However, for sequential tasks with moderate I/O, a modern MCU with integrated ADCs and communication stacks often delivers lower power and faster development.
How does the operating temperature range of 0°C to 85°C (TJ) constrain deployment in industrial environments?
While the XC2VP7-6FFG672C’s junction temperature range supports commercial and light industrial use, sustained operation near 85°C reduces long-term reliability due to electromigration and timing degradation. In high-ambient environments (e.g., >60°C enclosure), active cooling or derating logic utilization becomes necessary. Designers should monitor TJ using on-die thermal diodes and avoid stacking high-power components nearby to prevent thermal coupling.
What are the implications of the XC2VP7-6FFG672C being RoHS3 compliant and REACH unaffected for global product certification?
RoHS3 compliance ensures the XC2VP7-6FFG672C meets EU Directive 2011/65/EU restrictions on hazardous substances, including lead, cadmium, and phthalates, simplifying export to regulated markets. REACH unaffected status confirms no SVHCs (Substances of Very High Concern) above 0.1% w/w, reducing documentation burden during product declarations. This facilitates compliance in medical, automotive, and consumer electronics without requiring material substitution or redesign.
How does the 11088 logic elements/cells count translate into realizable digital functions in a typical embedded design?
The 11,088 logic cells in the XC2VP7-6FFG672C equate to roughly 7,000–9,000 usable ASIC gates depending on function complexity. A practical example: a 32-bit RISC processor core with cache and UARTs may consume 4,000–5,000 logic cells, leaving ample resources for custom accelerators or glue logic. However, routing congestion can limit utilization beyond 70–75% in dense designs, so floorplanning and timing-driven synthesis are essential to avoid placement bottlenecks.
What design verification steps are recommended before committing to production with the XC2VP7-6FFG672C?
Pre-production verification should include power-on reset characterization, configuration reliability testing across temperature, and signal integrity analysis on high-speed I/Os. Thermal imaging under worst-case logic loading helps validate cooling assumptions. Additionally, boundary-scan (JTAG) testing should be implemented to detect assembly defects in the 672-ball array. Prototype units should undergo extended burn-in at 85°C to screen for early-life failures, especially given the device’s use in embedded systems with limited field serviceability.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC2VP7-6FFG672C

Product Attribute XC2VP7-6FFG672I XC2VP7-6FF672C XC2VP7-6FF672I XC2VP7-7FF672C
Part Number XC2VP7-6FFG672I XC2VP7-6FF672C XC2VP7-6FF672I XC2VP7-7FF672C
Manufacturer AMD AMD AMD AMD
Number of Logic Elements/Cells - - - -
Total RAM Bits - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply - - - -
Number of LABs/CLBs - - - -
Number of I/O - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

XC2VP7-6FFG672C Datasheet PDF

Download XC2VP7-6FFG672C pdf datasheets and AMD documentation for XC2VP7-6FFG672C - AMD.

Datasheets
Virtex-II Pro, Pro X.pdf
PCN Obsolescence/ EOL
Mult Dev EOL 6/Jan/2020.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Cost

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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XC2VP7-6FFG672C Image

XC2VP7-6FFG672C

AMD
32D-XC2VP7-6FFG672C

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