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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EP1K50TC144-1N
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EP1K50TC144-1N - Intel

Manufacturer Part Number
EP1K50TC144-1N
Manufacturer
Intel
Allelco Part Number
32D-EP1K50TC144-1N
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,750 pcs available, New & Original
Parts Description
IC FPGA 102 I/O 144TQFP
Package
144-TQFP (20x20)
Data sheet
EP1K50TC144-1N.pdf
RoHs Status
 
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Specifications

EP1K50TC144-1N Tech Specifications
Intel - EP1K50TC144-1N technical specifications, attributes, parameters and parts with similar specifications to Intel - EP1K50TC144-1N

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 40960
Supplier Device Package 144-TQFP (20x20)
Series ACEX-1K®
Package / Case 144-LQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 70°C (TA)
Number of Logic Elements/Cells 2880
Number of LABs/CLBs 360
Number of I/O 102
Number of Gates 199000
Mounting Type Surface Mount
Base Product Number EP1K50

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EP1K50TC144-1N Image
EP1K50TC144-1N (1)

Manufacturer Part Number

EP1K50TC144-1N

Manufacturer

Intel

Introduction

Intel’s EP1K50TC144-1N is an embedded FPGA from the ACEX-1K® series, designed for programmable logic solutions.

Product Features and Performance

360 Logic Array Blocks (LABs)

2880 Logic Elements/Cells

40,960 Total RAM Bits

102 I/O Pins

199,000 Gates

375V to 2.625V Supply Voltage Range

Surface Mount Package

Product Advantages

Optimized for high-density programmable logic designs

Ample logic cells and RAM bits for complex tasks

Supports a wide range of I/O standards

Key Technical Parameters

360 LABs

2880 Logic Elements/Cells

40,960 Total RAM Bits

199,000 Number of Gates

102 Number of I/O

375V ~ 2.625V Voltage - Supply

0°C ~ 70°C Operating Temperature

Quality and Safety Features

Complies with Intel’s standards for quality and safety in semiconductor design

Compatibility

Supports various logic standards for compatibility with a wide range of digital circuits

Application Areas

Can be used in a variety of applications where embedded FPGA solutions are required

Product Lifecycle

Obsolete

Replacement or upgrade options may be available for newer designs

Reasons to Choose This Product

Offers a balance of power and performance for embedded systems

Versatile for a range of applications and design implementations

Backed by Intel’s reputation for semiconductor excellence

Obsolescence status suggests evaluating newer alternatives for future designs

Frequently Asked Questions(FAQ)

How does the EP1K50TC144-1N compare to the XC3S200-4TQG144C in terms of logic capacity and power characteristics for low-power embedded applications?
The EP1K50TC144-1N offers 2880 logic elements and operates at 2.5V with a maximum junction temperature of 70°C, making it suitable for cost-sensitive designs where moderate complexity and ambient cooling suffice. In contrast, the XC3S200-4TQG144C provides higher logic density with 3840 CLBs and targets 3.3V operation with extended industrial temperature ranges, often resulting in higher dynamic power consumption. While both devices share similar packaging and gate counts (~200k), the ACEX-1K® architecture of the EP1K50TC144-1N emphasizes lower static current due to its optimized routing and reduced leakage in 0.5µm process technology, whereas the Spartan-3 XC3S200-4TQG144C trades some power efficiency for broader environmental tolerance and greater I/O flexibility.
What are the implications of using the EP1K50TC144-1N in a design that requires more than 40960 bits of distributed RAM?
The EP1K50TC144-1N contains exactly 40960 total RAM bits distributed across its LABs, which are allocated automatically based on implemented logic. If a design exceeds this limit—such as requiring large FIFO buffers or block memory for video processing—the device cannot accommodate the full requirement without external SRAM or DRAM. Engineers must therefore either partition data structures across multiple clock domains, use external memory interfaces, or consider a higher-density FPGA like the EP1K100 variant. Overutilization risks timing closure issues due to congestion in the programmable interconnect matrix, potentially increasing critical path delays by 15–20% depending on routing complexity.
Can the EP1K50TC144-1N support LVDS signaling at standard data rates commonly used in industrial imaging systems?
No, the EP1K50TC144-1N lacks dedicated high-speed transceivers and does not support LVDS natively at rates above 100 Mbps per pin pair. Its general-purpose I/O banks operate up to approximately 166 Mbps under typical conditions but without calibrated skew control or differential receiver thresholds required for robust LVDS compliance. For industrial cameras transmitting at 650 Mbps or higher (e.g., Camera Link baselines), alternative FPGAs with SERDES blocks such as Xilinx Spartan-6 or newer Intel Cyclone IV would be more appropriate. Attempting LVDS implementation here introduces significant jitter and bit error risks unless heavily buffered and routed with matched traces—adding board area and reducing reliability.
Is the Moisture Sensitivity Level (MSL) of 3 for the EP1K50TC144-1N compatible with standard reflow profiles used in mass production?
Yes, an MSL rating of 3 indicates the EP1K50TC144-1N can withstand up to three reflow cycles as long as it is stored properly before assembly. This aligns with standard lead-free soldering profiles (e.g., peak temperature ≤245°C). However, manufacturers must ensure storage below 30% RH and within 168 hours of opening the moisture barrier bag. Exceeding this window without baking increases popcorning risk during thermal cycling, especially given the fine pitch of the 144-pin TQFP package. Most contract assemblers follow IPC-J-STD-033 guidelines, so compatibility is generally assured if procurement follows JEDEC standards.
How does the number of I/O pins (102) on the EP1K50TC144-1N affect PCB layout complexity compared to larger packages like 208-pin variants?
With only 102 available I/Os, the EP1K50TC144-1N limits signal routing options and forces tighter trace spacing in high-density layouts. The absence of additional VREF pins means all banks share common termination schemes, reducing flexibility for mixed-voltage systems. Moreover, unused I/Os should be terminated to avoid floating inputs causing increased power consumption or noise coupling. Compared to larger packages, this constraint may require careful partitioning of logic into separate modules to minimize global routing congestion, potentially increasing layer count or via usage by up to 20% in complex digital designs.
What voltage margin exists between nominal supply and absolute maximum ratings for the EP1K50TC144-1N’s core power rail?
The EP1K50TC144-1N specifies a nominal operating range of 2.375V to 2.625V, centered at 2.5V. The absolute maximum rating for VCCINT is typically listed as -0.5V to +3.8V in most ACEX-1K® documentation. Thus, the safe operating margin is about 1.2V above the highest valid supply (2.625V), leaving ~1.2V headroom before reaching absolute max. However, exceeding 2.7V even briefly can degrade oxide integrity over time. Designers should include series resistors (≥10Ω) and decoupling capacitors (≥10µF bulk + 0.1µF per pin) to suppress transient overshoots during hot-plug events or inductive load switching.
Are there known timing closure challenges when implementing synchronous state machines with more than 360 LABs using the EP1K50TC144-1N?
Yes. Although the device contains 360 LABs, each LAB supports only one register per function, meaning dense sequential logic can quickly exhaust register resources. When mapping complex FSMs across adjacent LABs, the programmable interconnect fabric introduces variable delay—typically 2–4 ns per switch matrix hop. In worst-case scenarios with wide fan-out or long carry chains, this can push setup times beyond 8 ns, violating constraints at clock frequencies above 100 MHz. Placement constraints or forced pipelining become necessary; otherwise, hold violations may occur if local routing delays are shorter than expected due to optimistic estimation tools.
Why might the EP1K50TC144-1N be preferred over newer FPGA families despite its older technology node?
The EP1K50TC144-1N benefits from mature IP availability, extensive legacy support, and predictable behavior validated over decades of deployment. At 0.5µm CMOS process, it consumes less static power than modern FinFET-based devices when running simple control logic—sometimes under 5 mA in idle mode. Additionally, many reference designs and synthesis scripts remain optimized for ACEX-1K® primitives, reducing migration effort. For non-time-critical embedded systems where BOM cost dominates and performance requirements are modest (<100 MHz), this device remains economical and reliable. However, for high-speed interfaces or radiation-hardened environments, newer architectures offer superior scalability and feature sets.
Does the EP1K50TC144-1N support partial reconfiguration, and how would that impact system reliability in field-deployed equipment?
No, the EP1K50TC144-1N does not support dynamic partial reconfiguration. All configuration occurs via external flash upon power-up or reset. Attempting runtime updates requires a soft processor core to manage boot sequences, increasing code size and introducing failure modes if the update process is interrupted. In mission-critical systems, this necessitates dual-bank flash with rollback capability—adding cost and board space. Alternatives like Intel MAX 10 or Microsemi ProASIC3 offer partial updates but come with trade-offs in speed or I/O count. For the EP1K50TC144-1N, firmware updates demand full device reprogramming, raising mean time between failures (MTBF) concerns during unattended deployments.
How does the gate count specification (199,000 equivalent gates) correlate with actual usable logic in real-world designs using the EP1K50TC144-1N?
The 199K gate estimate assumes ideal mapping efficiency, but real designs typically achieve only 60–70% utilization due to inefficient coding practices, excessive hierarchy, or poor floorplanning. On average, a practical application uses around 110K–140K equivalent gates before hitting placement or routing bottlenecks. Beyond this threshold, incremental gains require architectural changes rather than just scaling complexity. Therefore, designers targeting the EP1K50TC144-1N should aim to keep mapped logic below 130K gates to maintain timing margins and avoid iterative synthesis loops. Tools like Quartus Prime report actual resource usage after place-and-route, which should guide final selection.
What precautions are necessary when interfacing asynchronous signals into clock domains driven by the EP1K50TC144-1N’s internal oscillator?
Since the EP1K50TC144-1N relies on internal PLL or external crystal references, asynchronous inputs must undergo double-synchronizer flip-flop chains to prevent metastability. Each synchronization stage adds at least two flip-flops, consuming LAB resources and potentially increasing latency by 2–4 clock cycles. Without proper CDC protection, cross-domain signals have a failure probability of 10^-4 per transition under worst-case skew, leading to silent data corruption. Best practice dictates using Gray-coded state machines and validating synchronizers with formal verification tools. Failure to do so risks intermittent bugs that manifest only under rare timing conditions, complicating debug efforts in production units.
Can the EP1K50TC144-1N drive legacy 5V TTL peripherals directly from its 2.5V I/O banks?
Only if the target peripheral accepts 2.5V logic levels. Standard TTL inputs typically require >2.0V for HIGH recognition, so 2.5V outputs may marginally meet thresholds but lack noise margins comparable to 3.3V systems. Driving legacy 5V CMOS loads directly is unsafe due to insufficient output drive strength and risk of latch-up if input exceeds 3.8V. Instead, level shifters such as TXB0108 or discrete MOSFET circuits are recommended. Direct connection could stress the EP1K50TC144-1N’s ESD diodes, especially during electrostatic discharge events, potentially degrading long-term reliability despite passing initial testing.
How does the operating temperature range (0°C to 70°C) constrain thermal management strategies for the EP1K50TC144-1N in outdoor applications?
The commercial-grade temperature spec implies the device must dissipate heat through conduction and convection without active cooling. In still-air environments, natural convection limits heat transfer to roughly 5–10 W/m·K for typical PCBs. At full load, the EP1K50TC144-1N may consume 1.5–2W due to leakage and switching activity, generating 10–15°C rise above ambient. Exceeding 70°C TA violates specifications, so enclosures must allow airflow or incorporate heatsinks. Environments with dust accumulation or direct sunlight further reduce effective cooling, forcing derating of logic utilization or clock frequency to maintain junction temperatures below 85°C TJmax.
What role do LABs play in determining maximum achievable clock frequency when implementing arithmetic pipelines using the EP1K50TC144-1N?
Each Logic Array Block (LAB) houses 10 logic cells organized into 5 adaptive lookup tables (LUTs) and 5 registers. Arithmetic-intensive operations like multipliers or adders consume multiple LUTs per LAB, limiting parallelism. For example, a 16-bit adder may span 8 LABs, creating long carry propagation paths. The critical path delay depends on both combinational logic depth and interconnect routing, typically yielding maximum frequencies between 80–120 MHz for balanced designs. To exceed 100 MHz, pipelining across LAB boundaries becomes essential, but this increases latency and reduces throughput. Synthesis reports provide accurate timing estimates post-place-and-route, which should inform architectural decisions early.
Why might a designer choose the EP1K50TC144-1N over microcontrollers for glue logic in legacy industrial control systems?
Microcontrollers struggle with deterministic response times due to OS overhead or interrupt latency, whereas the EP1K50TC144-1N executes logic in nanosecond-scale cycles without context switches. For tasks like protocol bridging (RS-485 to CAN), pulse width modulation generation, or real-time state monitoring, FPGA parallelism ensures sub-microsecond response consistency. The ACEX-1K® architecture also allows simultaneous execution of multiple state machines, improving throughput in multi-tasking environments. Though programming models differ, experienced engineers leverage VHDL/Verilog to implement reliable, low-latency control loops that outperform software-only solutions in harsh electromagnetic environments common in factories.
How does the absence of built-in DLLs or PLLs affect clock distribution networks in designs using the EP1K50TC144-1N?
The EP1K50TC144-1N includes basic PLL functionality for frequency synthesis and phase shifting, but lacks Delay-Locked Loops (DLLs) for deskewing clock trees. This forces reliance on global clock buffers with inherent skew variations of ±500 ps across the chip. In synchronous systems with tight timing budgets (<1 ns), this can cause hold violations or setup failures unless clock paths are carefully constrained. Designers must manually balance lengths of clock nets or accept lower maximum frequencies. External crystals or oscillators paired with on-board PLLs mitigate skew but increase bill-of-materials cost and PCB footprint, trading integration for performance predictability.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP1K50TC144-1N

Product Attribute EP1K50TC144-2N EP1K50TC144-1 EP1K50TC144-3N EP1K50TC144-3
Part Number EP1K50TC144-2N EP1K50TC144-1 EP1K50TC144-3N EP1K50TC144-3
Manufacturer Intel Intel Intel Intel
Mounting Type - Surface Mount Through Hole Surface Mount
Total RAM Bits - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Number of Gates - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Logic Elements/Cells - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of I/O - - - -
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of LABs/CLBs - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

EP1K50TC144-1N Datasheet PDF

Download EP1K50TC144-1N pdf datasheets and Intel documentation for EP1K50TC144-1N - Intel.

Datasheets
Cylindrical Battery Holders.pdf
PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification
Mult Series Software Chgs 26/Mar/2020.pdf
PCN Other
Software Disc 06/Nov/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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EP1K50TC144-1N Image

EP1K50TC144-1N

Intel
32D-EP1K50TC144-1N

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