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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EP1K50TC144-2
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EP1K50TC144-2 - Intel

Manufacturer Part Number
EP1K50TC144-2
Manufacturer
Intel
Allelco Part Number
32D-EP1K50TC144-2
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,890 pcs available, New & Original
Parts Description
IC FPGA 102 I/O 144TQFP
Package
144-TQFP (20x20)
Data sheet
EP1K50TC144-2.pdf
RoHs Status
 
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In stock: 14890

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Specifications

EP1K50TC144-2 Tech Specifications
Intel - EP1K50TC144-2 technical specifications, attributes, parameters and parts with similar specifications to Intel - EP1K50TC144-2

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 2.375V ~ 2.625V
Total RAM Bits 40960
Supplier Device Package 144-TQFP (20x20)
Series ACEX-1K®
Package / Case 144-LQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 70°C (TA)
Number of Logic Elements/Cells 2880
Number of LABs/CLBs 360
Number of I/O 102
Number of Gates 199000
Mounting Type Surface Mount
Base Product Number EP1K50

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EP1K50TC144-2 Image
EP1K50TC144-2 (1)

Manufacturer Part Number

EP1K50TC144-2

Manufacturer

Intel

Introduction

ACEX-1K family FPGA optimized for low power applications and cost-sensitive markets.

Product Features and Performance

FPGA device from ACEX-1K series with 360 LABs/CLBs

Features 2880 Logic Elements/Cells

Provides 40,960 Total RAM Bits

Equipped with 102 I/O pins for versatile connectivity

Designed with 199,000 Gate density for complex functionality

Product Advantages

Tailored for applications requiring power efficiency

Cost-effective solution for embedded applications

High integration to reduce board space and component counts

Key Technical Parameters

Number of LABs/CLBs: 360

Number of Logic Elements/Cells: 2880

Total RAM Bits: 40960

Number of I/O: 102

Number of Gates: 199000

Voltage Supply Range: 2.375V ~ 2.625V

Quality and Safety Features

Operates reliably within the temperature range of 0°C ~ 70°C

Surface Mount technology for secure and robust PCB installation

Compatibility

Fits in a standard 144-LQFP package

Compatible with systems using 144-TQFP (20x20) packages

Application Areas

Ideal for cost-sensitive and power-sensitive applications including consumer electronics, automotive, and telecommunications.

Product Lifecycle

Product Status: Obsolete

Potential for limited availability; suggested to look for replacements or upgrades

Several Key Reasons to Choose This Product

Energy-efficient design suitable for power-sensitive applications

Affordable FPGA option without compromising functionality

Capable of supporting a variety of digital logic designs

Applicable in a wide range of industries and applications

Intel's reputation for quality and support despite product obsolescence

Frequently Asked Questions(FAQ)

How does the EP1K50TC144-2 FPGA’s logic element count and LAB architecture influence resource utilization in mid-complexity embedded control applications?
The EP1K50TC144-2 provides 2,880 logic elements organized into 360 Logic Array Blocks (LABs), each containing eight logic elements. This granularity allows efficient mapping of moderate state machines, glue logic, and interface bridging—common in industrial automation or communication protocol handling. However, due to the fixed LAB-to-LE ratio and absence of hardened DSP blocks, algorithms requiring high parallelism or arithmetic intensity may exhaust routing resources before reaching logic saturation, especially when targeting clock frequencies above 50 MHz.
What are the thermal and power implications of operating the EP1K50TC144-2 at its maximum rated supply voltage under full I/O load?
At 2.625 V supply voltage and 102 I/Os toggling simultaneously at moderate frequencies (e.g., 20–30 MHz), dynamic power can exceed 400 mW depending on toggle rates and capacitive loading. Combined with static power typical of 2.5 V FPGAs, total junction temperature may approach 85°C in still-air environments without heatsinking. Designers should implement I/O banking strategies to stagger switching and consider airflow or thermal vias beneath the 144-TQFP package to maintain safe operating margins within the 0°C to 70°C ambient range.
Can the EP1K50TC144-2 support a reliable 3.3 V LVTTL interface despite its 2.5 V core voltage?
Yes, but only through careful I/O bank configuration. The device supports selectable I/O standards per bank, including LVTTL at 3.3 V, provided the VCCIO supply for the relevant bank is set to 3.3 V. However, mixing 3.3 V and 2.5 V I/Os on adjacent banks may introduce ground bounce or timing skew due to differing slew rates. Signal integrity simulations are recommended when interfacing with 3.3 V microcontrollers or sensors, particularly for bidirectional buses like I²C or SPI.
How does the 40,960-bit embedded RAM in the EP1K50TC144-2 compare to block RAM resources in competing FPGAs like the XC3S200-4TQG144C for FIFO or buffer implementations?
The EP1K50TC144-2’s 40,960 bits are distributed as dual-port embedded system blocks (ESBs), configurable as 256x16 or 512x8, suitable for small FIFOs or lookup tables. In contrast, the XC3S200-4TQG144C offers 216 Kbits of dedicated block RAM organized in 4 Kbit blocks, enabling deeper or wider buffers with less routing overhead. For applications requiring multi-kilobyte data buffering—such as UART packet reassembly or image line storage—the XC3S200 provides superior memory density and easier address management.
What design considerations apply when migrating a legacy design from the EP1K50TC144-2 to a modern FPGA platform?
Migration requires reevaluation of I/O voltage compatibility, clocking architecture, and configuration schemes. The EP1K50TC144-2 uses a passive serial configuration mode with limited security features, whereas modern alternatives often support encrypted bitstreams and faster JTAG. Additionally, its 2.5 V core limits direct interfacing with sub-2.5 V logic families. Engineers must also account for differences in PLL availability—the ACEX-1K series lacks dedicated phase-locked loops, relying instead on delay-locked loops (DLLs) for clock management—which affects jitter performance in high-speed synchronous interfaces.
Is the EP1K50TC144-2 suitable for safety-critical applications requiring long-term reliability in industrial environments?
While the EP1K50TC144-2 operates within the industrial temperature range (0°C to 70°C), its MSL-3 rating (168-hour floor life) demands strict moisture control during assembly to prevent delamination or popcorning. Furthermore, as a non-RoHS device, it may face regulatory restrictions in new designs targeting EU markets. For safety-critical systems, the absence of SEU (single-event upset) mitigation features and limited radiation tolerance data makes it less favorable compared to newer automotive- or industrial-grade FPGAs with built-in error correction and extended qualification reports.
How do the 102 user I/Os on the EP1K50TC144-2 constrain system-level pin multiplexing in compact embedded designs?
With 102 I/Os shared across configuration, clock, and user functions, effective usable pins drop to approximately 85–90 after accounting for dedicated configuration pins (nCONFIG, CONF_DONE, etc.). This necessitates strategic pin multiplexing—for example, using shared SPI lines for both flash programming and sensor communication—or adopting serial interfaces (I²C, UART) to reduce pin count. Careful PCB layout is essential to avoid crosstalk between high-speed configuration signals and analog sensor inputs, especially given the 20×20 mm TQFP footprint’s limited ground/power pin distribution.
What are the key trade-offs between using the EP1K50TC144-2 and a CPLD for glue logic integration in a cost-sensitive embedded system?
The EP1K50TC144-2 offers significantly higher gate density (199K gates) and reconfigurability compared to most CPLDs, enabling complex state machines or protocol conversion that would require multiple CPLD chips. However, its higher static power consumption, need for external configuration memory, and larger footprint increase BOM cost and board complexity. For simple address decoding, bus interfacing, or reset sequencing under 500 macrocells, a modern CPLD may offer lower total system cost, faster instant-on behavior, and simpler power management—making it preferable in ultra-low-complexity applications.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP1K50TC144-2

Product Attribute EP1K50TC144-2N EP1K50TI144-2 EP1K50TC144-3N EP1K50TI144-2N
Part Number EP1K50TC144-2N EP1K50TI144-2 EP1K50TC144-3N EP1K50TI144-2N
Manufacturer Intel Intel Intel Intel
Number of LABs/CLBs - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Total RAM Bits - - - -
Number of Gates - - - -
Number of I/O - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of Logic Elements/Cells - - - -
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount

EP1K50TC144-2 Datasheet PDF

Download EP1K50TC144-2 pdf datasheets and Intel documentation for EP1K50TC144-2 - Intel.

Datasheets
Cylindrical Battery Holders.pdf
PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification
Mult Series Software Chgs 26/Mar/2020.pdf
PCN Other
Software Disc 06/Nov/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

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EP1K50TC144-2 Image

EP1K50TC144-2

Intel
32D-EP1K50TC144-2

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