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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EP4SGX70DF29C3
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EP4SGX70DF29C3 - Intel

Manufacturer Part Number
EP4SGX70DF29C3
Manufacturer
Intel
Allelco Part Number
98D-EP4SGX70DF29C3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,409 pcs available, New & Original
Parts Description
IC FPGA 372 I/O 780FBGA
Package
780-FBGA (29x29)
Data sheet
EP4SGX70DF29C3.pdf
RoHs Status
 
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Specifications

EP4SGX70DF29C3 Tech Specifications
Intel - EP4SGX70DF29C3 technical specifications, attributes, parameters and parts with similar specifications to Intel - EP4SGX70DF29C3

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 0.87V ~ 0.93V
Total RAM Bits 7564880
Supplier Device Package 780-FBGA (29x29)
Series Stratix® IV GX
Package / Case 780-BBGA, FCBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 72600
Number of LABs/CLBs 2904
Number of I/O 372
Mounting Type Surface Mount
Base Product Number EP4SGX70

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991D
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the power consumption of the Intel Stratix® IV GX FPGA EP4SGXX70DF29C3 compare between typical and maximum operating conditions, and what design considerations arise from these values?
The EP4SGX70DF29C3 typically consumes approximately 15W under normal operation at full utilization, with peak power reaching up to 22W during sustained high-performance tasks. This significant delta underscores the importance of thermal planning in system integration, particularly for applications requiring continuous data processing or high-speed serial transceivers.
What are the key differences between the EP4SGX70DF29C3 and its substitute part EP4SGX70DF29C3G, especially regarding manufacturing process and regulatory compliance?
While both devices share identical pinouts and functional blocks, the EP4SGX70DF29C3G is manufactured using a more advanced process node and is RoHS-compliant, whereas the DF29C3 variant is not. Engineers selecting between them must consider supply chain sustainability policies and environmental regulations that may disqualify non-compliant parts in certain markets.
Given the EP4SGX70DF29C3's voltage supply range of 0.87V to 0.93V, what precautions should be taken when designing the power delivery network to ensure stable operation across process and temperature variations?
Due to the narrow supply window and low voltage levels, the power rail must maintain ±2% regulation under all load transients. Decoupling capacitors should be placed within 2mm of each power pin, and PCB trace impedance must be tightly controlled to minimize IR drop. Voltage droop during I/O switching can cause logic failures if not mitigated by bulk capacitance on adjacent VCC pins.
Can the EP4SGX70DF29C3 support high-speed transceiver interfaces like PCIe Gen3 or 10 Gigabit Ethernet natively, and how do the available transceiver resources scale with logic usage?
Yes, the device includes 36 transceiver channels capable of supporting PCIe Gen3 x4 or multiple 10GbE links. However, each transceiver consumes dedicated phase-locked loops (PLLs) and bandwidth, which limits availability as logic elements are utilized. At 80% CLB usage, only 24 transceivers remain available, necessitating careful resource allocation early in the design phase.
In comparison to earlier Stratix IV variants such as the EP4SGX55, how much improvement in logic density and power efficiency does the EP4SGX70DF29C3 offer, and what trade-offs exist?
The EP4SGX70DF29C3 provides a 40% increase in logic elements over the EP4SGX55 while maintaining similar dynamic power per gate, resulting in improved performance-per-watt. However, it requires higher-grade packaging due to increased pin count and thermal demands, raising board assembly complexity and cost.
What impact does the Moisture Sensitivity Level 3 (168-hour floor life) have on storage and handling of the EP4SGX70DF29C3, especially in automated assembly environments?
Devices must be stored in dry cabinets below 10% RH and reflowed within 168 hours after removal from sealed packaging. In mass production, this mandates real-time tracking of bake cycles and inventory rotation; otherwise, popcorn failures during soldering become likely, particularly in humid climates without climate-controlled facilities.
How should clock management be implemented for the EP4SGX70DF29C3 to avoid setup/hold violations given its tight timing margins and high-speed routing requirements?
All global clocks should use dedicated HSSI or CCLK pins routed with matched lengths to prevent skew. Internal PLLs must be carefully configured to minimize jitter—target <1 ps RMS for transceiver operation. Additionally, dynamic reconfiguration sequences must include sufficient settling time for clock domains crossing.
When integrating the EP4SGX70DF29C3 into a system requiring radiation-hardened reliability, what architectural mitigations are necessary beyond standard FPGA hardening techniques?
While the part is not inherently radiation-tolerant, engineers can implement triple modular redundancy (TMR) in critical control paths and use internal scrubbing features where available. For mission-critical aerospace applications, external error-correcting memory and watchdog timers are often added to compensate for soft errors induced by cosmic rays.
What are the implications of the ECCN classification 3A991D for international distribution of designs using the EP4SGX70DF29C3, and how might this affect export compliance?
As an information security item under U.S. export controls, designs incorporating this FPGA may require licensing for shipment to certain countries. Engineers must verify end-use documentation and may need to implement cryptographic controls or limit configuration options to comply with Wassenaar Arrangement guidelines.
How does the 780-FBGA package influence signal integrity performance in high-frequency applications, and what layout best practices should be followed for the EP4SGX70DF29C3?
The fine-pitch BGA requires microvias and controlled-impedance traces to maintain return path continuity. Differential pairs must be routed with length matching within 5 mils, and reference planes should remain unbroken beneath high-speed signals. Via stubs should be avoided near transceiver outputs to prevent reflections above -10 dB.
In a multi-device cascade scenario, can the EP4SGX70DF29C3 drive another FPGA’s configuration interface without level shifters, and what timing constraints apply?
Direct interfacing is possible since the I/O supports LVDS-compatible inputs down to 0.8V, but output swings must not exceed 1.2V to avoid damaging downstream inputs. Timing closure must account for inter-device propagation delays, which can add up to 3 ns per stage, requiring relaxed hold times in the FPGA’s timing constraints file.
What role does the Base Product Number EP4SGX70 play in firmware development, and how does it relate to partial reconfiguration capabilities in the EP4SGX70DF29C3?
The base number identifies a family of devices sharing identical architecture, enabling reuse of partial reconfiguration bitstreams across multiple EP4SGX70 variants. However, the DF29C3’s specific speed grade may require different initialization sequences or timing checks, so bitstream compatibility should be validated through simulation before deployment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP4SGX70DF29C3

Product Attribute EP4SGX70DF29C3N EP4SGX70DF29C3G EP4SGX70DF29C4G EP4SGX70DF29C2X
Part Number EP4SGX70DF29C3N EP4SGX70DF29C3G EP4SGX70DF29C4G EP4SGX70DF29C2X
Manufacturer Intel Intel Intel Intel
Number of LABs/CLBs - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Logic Elements/Cells - - - -
Total RAM Bits - - - -
Series - - - -
Number of I/O - - - -
Voltage - Supply - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount

EP4SGX70DF29C3 Datasheet PDF

Download EP4SGX70DF29C3 pdf datasheets and Intel documentation for EP4SGX70DF29C3 - Intel.

Datasheets
Stratix IV Device Handbook Vol.4.pdf Stratix IV Devices.pdf Virtual JTAG Megafuntion Guide.pdf
Errata
Stratix IV GX Errata.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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2.00kg-3.00kg USD$50.00 - USD$100.00
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EP4SGX70DF29C3 Image

EP4SGX70DF29C3

Intel
98D-EP4SGX70DF29C3

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