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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EP4SGX70DF29C3N~~

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EP4SGX70DF29C3N - Intel

Name: Intel EP4SGX70DF29C3N
Brand: Intel
SKU: EP4SGX70DF29C3N
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: EP4SGX70DF29C3N

Manufacturer: Intel

Allelco Part Number: 98D-EP4SGX70DF29C3N

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 5,461 pcs available, New & Original

Parts Description: IC FPGA 372 I/O 780FBGA

Package: 780-FBGA (29x29)

Data sheet: EP4SGX70DF29C3N.pdf

Datasheets
Stratix IV Device Handbook Vol.1.pdf Stratix IV Devices.pdf Virtual JTAG Megafuntion Guide.pdf

PCN Obsolescence/ EOL
Mult Dev Add Subs 6/Sep/2019.pdf Mult Dev EOL REV 2/Aug/2019.pdf Mult Dev EOL 28/Feb/2019.pdf

PCN Other
Readiness Plan Update 3/Apr/2020.pdf

PCN Packaging
Mult Dev Label CHG 24/Jan/2020.pdf Mult Dev Label Chgs 24/Feb/2020.pdf

Errata
Stratix IV GX Errata.pdf

RoHs Status: RoHS Compliant

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In stock: 5461

Specifications

EP4SGX70DF29C3N Tech Specifications
Intel - EP4SGX70DF29C3N technical specifications, attributes, parameters and parts with similar specifications to Intel - EP4SGX70DF29C3N

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	0.87V ~ 0.93V
Total RAM Bits	7564880
Supplier Device Package	780-FBGA (29x29)
Series	Stratix® IV GX
Package / Case	780-BBGA, FCBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	72600
Number of LABs/CLBs	2904
Number of I/O	372
Mounting Type	Surface Mount
Base Product Number	EP4SGX70

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
ECCN	3A991D
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

What are the key architectural differences between the EP4SGX70DF29C3N and other Stratix IV GX FPGAs that make it suitable for high-speed serial applications?: The EP4SGX70DF29C3N features a high-performance transceiver architecture optimized for 10.3 Gbps operation, which is significantly higher than earlier Stratix III generations. It integrates 16 transceivers per device with advanced equalization and clocking capabilities, enabling robust performance in backplane and point-to-point serial links. This contrasts with lower-density Stratix IV GX variants like the EP4SGX55, which may offer fewer transceivers and reduced logic capacity. The combination of 72,600 logic elements and 2,904 LABs provides sufficient fabric bandwidth to support dense routing around the transceivers without congestion.

How does the power supply voltage range of 0.87V to 0.93V impact thermal management and system design when using the EP4SGX70DF29C3N in industrial environments?: Operating at such low core voltages reduces dynamic power consumption quadratically compared to older technologies, but also demands tight voltage regulation due to sensitivity to noise and process variation. At full utilization, the EP4SGX70DF29C3N can draw over 10W under peak load, necessitating careful PCB layout with controlled impedance power delivery and adequate heat spreading on the 780-pin FBGA package. Thermal resistance from junction to ambient must be minimized through proper heatsinking or airflow in systems operating near the upper temperature limit of 85°C.

Can the EP4SGX70DF29C3N reliably operate across the full -40°C to +125°C industrial temperature range if only rated for 0°C to +85°C commercial use?: No. Although some FPGA components exhibit extended functionality beyond their specified ranges due to conservative margins, the EP4SGX70DF29C3N is certified only for 0°C to +85°C operation. Operation outside this window risks timing violations, configuration errors, or permanent damage to the silicon. In applications requiring wider temperature tolerance, alternative parts such as those in the Cyclone V or newer Arria series should be considered instead.

What considerations apply when selecting a socket or test platform for prototyping designs using the EP4SGX70DF29C3N?: Due to its 780-FBGA (29x29) package and high pin count, the EP4SGX70DF29C3N cannot be used in standard ZIF sockets without risking pad damage. Instead, specialized test platforms with compliant BGA contactors are required. These platforms often require custom adapter boards matching the specific pinout and must maintain precise alignment during programming and debugging phases.

How does the total RAM bit count of 7,564,880 bits compare across Stratix IV GX devices and what implications does this have for embedded memory requirements?: With 7.56 Mbits of embedded memory distributed across multiple M9K blocks, the EP4SGX70DF29C3N offers substantial block RAM capacity—more than double that of the mid-range EP4SGX36 variant. This enables native implementation of larger FIFO structures, frame buffers, or soft-processor caches without external SRAM. However, memory must be carefully partitioned across available blocks to avoid fragmentation, especially when combined with DSP block usage.

What are the trade-offs between using hard IP cores versus soft logic for PCIe endpoint implementation on the EP4SGX70DF29C3N?: While the EP4SGX70DF29C3N supports soft PCIe implementations using soft IP, these consume significant logic resources and introduce latency. Hard IP solutions leverage dedicated transceivers and protocol engines, freeing up 10–15% more logic for application code while offering deterministic performance. However, hard IP may lock users into specific configurations and reduce flexibility compared to fully customizable soft implementations.

Is it feasible to upgrade an existing Stratix II-based system to use the EP4SGX70DF29C3N without redesigning the entire PCB?: Direct drop-in replacement is not possible due to differences in pin compatibility, voltage levels, and package type. Even if mechanical fit were achieved, the power sequencing, I/O standards, and configuration interface differ between families. A complete board revision is necessary to accommodate the new voltage domain, thermal profile, and signal integrity requirements of the EP4SGX70DF29C3N.

How does the Moisture Sensitivity Level (MSL) status affect storage and handling procedures for bulk-packaged EP4SGX70DF29C3N units?: Although the datasheet lists MSL as "Vendor Undefined," Altera typically classifies FBGA-packaged devices as MSL 1 or 2. As a precaution, components should be stored in dry packaging (<10% RH) and handled within 12 months of manufacture date. Bake-out before reflow may be required if exposure exceeds recommended thresholds, particularly in humid climates.

What factors determine whether to choose the EP4SGX70DF29C3N over a structured ASIC or ASSP for a high-volume communication system?: The EP4SGX70DF29C3N offers reprogrammability and lower NRE costs ideal for prototyping and low-to-mid volume production, whereas structured ASICs or ASSPs provide better power efficiency and smaller form factors at scale. If final hardware will ship in millions of units and requires minimal customization, an ASSP might yield lower BOM cost despite higher upfront development effort.

How many I/O pins are usable after accounting for dedicated configuration, clock, and JTAG signals on the EP4SGX70DF29C3N?: Out of 372 total I/O pins, approximately 12–15 are reserved for configuration (ASDI), JTAG (TCK, TMS, TDI, TDO), global clocks, and optional power-on reset circuits. Thus, roughly 357 pins remain available for user-defined functions, which must be allocated considering bank-level voltage constraints and ESD protection needs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP4SGX70DF29C3N

Product Attribute
Part Number	EP4SGX70DF29C2XN	EP4SGX70DF29C3	EP4SGX70DF29C4N	EP4SGX70DF29I3N
Manufacturer	Intel	Intel	Intel	Intel
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of Logic Elements/Cells	-	-	-	-
Number of I/O	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Voltage - Supply	-	-	-	-
Series	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of LABs/CLBs	-	-	-	-
Total RAM Bits	-	-	-	-

EP4SGX70DF29C3N Datasheet PDF

Download EP4SGX70DF29C3N pdf datasheets and Intel documentation for EP4SGX70DF29C3N - Intel.

Datasheets: Stratix IV Device Handbook Vol.1.pdf Stratix IV Devices.pdf Virtual JTAG Megafuntion Guide.pdf
PCN Obsolescence/ EOL: Mult Dev Add Subs 6/Sep/2019.pdf Mult Dev EOL REV 2/Aug/2019.pdf Mult Dev EOL 28/Feb/2019.pdf
PCN Other: Readiness Plan Update 3/Apr/2020.pdf
PCN Packaging: Mult Dev Label CHG 24/Jan/2020.pdf Mult Dev Label Chgs 24/Feb/2020.pdf
Errata: Stratix IV GX Errata.pdf

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Customer Reviews

Evaluation: 10 Articles

Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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