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HomeProductsIntegrated Circuits (ICs)Data Acquisition - Analog to Digital Converters (ADC)ADS61B23IRHB25
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ADS61B23IRHB25 - Texas Instruments

Manufacturer Part Number
ADS61B23IRHB25
Manufacturer
Texas Instruments
Allelco Part Number
98D-ADS61B23IRHB25
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,070 pcs available, New & Original
Parts Description
IC ADC 12BIT PIPELINED 32VQFN
Package
32-VQFN (5x5)
Data sheet
-
RoHs Status
ROHS3 Compliant
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Specifications

ADS61B23IRHB25 Tech Specifications
Texas Instruments - ADS61B23IRHB25 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - ADS61B23IRHB25

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply, Digital 1.65V ~ 3.6V
Voltage - Supply, Analog 3V ~ 3.6V
Supplier Device Package 32-VQFN (5x5)
Series -
Sampling Rate (Per Second) 80M
Reference Type External, Internal
Ratio - S/H:ADC 1:1
Package / Case 32-VFQFN Exposed Pad
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C
Product Attribute Attribute Value
Number of Inputs 1
Number of Bits 12
Number of A/D Converters 1
Mounting Type Surface Mount
Input Type Differential
Features -
Data Interface LVDS - Parallel, Parallel
Configuration S/H-ADC
Base Product Number ADS61B23
Architecture Pipelined

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What are the key design considerations when selecting a 12-bit pipelined ADC like the ADS61B23IRHB25 for high-speed signal acquisition in industrial control systems?
The ADS61B23IRHB25 offers an 80 MSPS sampling rate and differential input configuration, making it suitable for high-fidelity signal capture in environments with moderate noise. Designers should account for its dual supply rails—3.0 V to 3.6 V for analog and 1.65 V to 3.6 V for digital—requiring careful power sequencing and isolation to minimize substrate noise coupling. Its LVDS parallel interface supports robust data transfer but demands controlled impedance routing and termination to maintain signal integrity at high speeds. The device’s 1:1 S/H-to-ADC ratio simplifies timing analysis, though input bandwidth and settling time must be validated against the target signal’s rise time to avoid aperture uncertainty errors.
How does the ADS61B23IRHB25 compare to successive approximation register (SAR) ADCs in terms of latency and throughput for real-time feedback applications?
Unlike SAR ADCs, which typically exhibit lower latency per conversion, the ADS61B23IRHB25 employs a pipelined architecture that introduces several clock cycles of pipeline delay—approximately 5–7 cycles at 80 MSPS—resulting in ~60–90 ns of effective latency. While this is acceptable for many control loops, it may require compensation in ultra-fast feedback paths. However, its sustained 80 MSPS throughput outperforms most 12-bit SARs, which often cap below 5 MSPS. The trade-off favors the ADS61B23IRHB25 in applications prioritizing continuous data streaming over minimal single-conversion delay.
Can the ADS61B23IRHB25 operate reliably in automotive-grade temperature environments, and what derating practices should be applied?
The ADS61B23IRHB25 is rated for -40°C to +85°C operation, aligning with industrial rather than full automotive qualification. While it can function in under-hood or cabin-edge applications, sustained operation near 85°C requires attention to thermal dissipation due to the 32-VQFN exposed pad package. Junction temperature should be monitored, especially when driving LVDS loads or operating at maximum supply voltage. TI’s thermal resistance (θJA ≈ 38°C/W) suggests that power dissipation above 1.3 W could push the die beyond safe limits without adequate PCB copper area or airflow, necessitating thermal vias and ground plane integration.
What input signal conditioning is necessary to maximize SNR when using the ADS61B23IRHB25 with a differential sensor output?
The ADS61B23IRHB25’s differential input structure benefits from a well-matched anti-aliasing filter and balun or differential amplifier to maintain common-mode rejection. Input-referred noise is typically below 0.8 LSB RMS, but external source impedance above 100 Ω can degrade performance due to charge injection mismatch during sampling. A 2nd-order Butterworth filter with a cutoff near 35 MHz (Nyquist for 80 MSPS) helps suppress out-of-band noise while minimizing group delay distortion. Additionally, the reference input should be driven by a low-noise, low-output-impedance buffer to prevent code-dependent reference droop.
How does the LVDS parallel interface of the ADS61B23IRHB25 impact FPGA or processor selection in data acquisition systems?
The ADS61B23IRHB25 outputs 12-bit data via LVDS in parallel format, requiring an FPGA or SoC with sufficient high-speed differential I/O pins and built-in SERDES or DDR input capabilities. At 80 MSPS, each data line toggles at 80 Mbps, demanding careful PCB layout to avoid skew and crosstalk. The interface lacks embedded clocking, so a separate LVDS clock output from the ADC must be routed with matched length to the data lines. This increases FPGA resource usage compared to serial interfaces but reduces software overhead for real-time processing, making it favorable for deterministic systems like radar or medical imaging.
Is the internal reference of the ADS61B23IRHB25 sufficient for precision measurement applications, or should an external reference be used?
The ADS61B23IRHB25 supports both internal and external reference modes, but the internal reference typically exhibits higher drift (~50 ppm/°C) and initial accuracy (±0.5%) compared to precision external references like the REF5025. For applications requiring better than 0.1% gain stability over temperature—such as calibration equipment or test instrumentation—an external low-noise reference with <10 ppm/°C drift is recommended. The internal reference may suffice in cost-sensitive or space-constrained designs where absolute accuracy is secondary to relative consistency across channels.
What layout practices are critical for minimizing EMI and ensuring stable operation of the ADS61B23IRHB25 in mixed-signal PCBs?
The 32-VQFN package with an exposed thermal pad requires a solid ground plane beneath the device, connected through multiple vias to reduce ground inductance and improve heat dissipation. Analog and digital supply domains should be separated at the PCB level, with ferrite beads or π-filters isolating the 3.3 V analog rail from digital noise. The LVDS traces must be length-matched (±50 ps skew tolerance) and routed away from high-frequency digital signals. Additionally, the reference input and analog input traces should be guarded with ground shields to prevent coupling from adjacent switching nodes.
How does the ADS61B23IRHB25 perform in undersampling applications, and what limitations should be considered?
The ADS61B23IRHB25 can be used for undersampling RF signals up to approximately 200 MHz, leveraging its full-power input bandwidth of ~400 MHz. However, harmonic folding and aliasing require precise bandpass filtering before the ADC to prevent out-of-band signals from corrupting the desired Nyquist zone. The differential input helps reject even-order harmonics, but third-order intermodulation products may still degrade SFDR at high input frequencies. Careful spectral planning and pre-filtering are essential to maintain dynamic performance when operating above the first Nyquist zone.
What are the trade-offs between the ADS61B23IRHB25 and higher-resolution pipelined ADCs (e.g., 14-bit or 16-bit) in terms of power, cost, and system complexity?
Compared to 14-bit or 16-bit pipelined ADCs, the ADS61B23IRHB25 consumes less power (~220 mW typical) and reduces data processing overhead due to its 12-bit output width. This makes it advantageous in power-constrained or high-channel-count systems where marginal gains in resolution do not justify increased cost, thermal load, or FPGA resource usage. However, in applications requiring fine voltage discrimination—such as spectroscopy or precision instrumentation—the lower effective number of bits (ENOB ≈ 10.5 at 80 MSPS) may limit dynamic range below acceptable thresholds.
How should the ADS61B23IRHB25 be handled during assembly to comply with its moisture sensitivity level (MSL 3)?
The ADS61B23IRHB25 is classified as MSL 3, meaning it can be exposed to ambient conditions for up to 168 hours after removal from dry packaging before requiring baking. During PCB assembly, it should be processed within this floor life window using standard reflow profiles (peak ~260°C). If exposure exceeds 168 hours, a 125°C bake for 24 hours is necessary to remove absorbed moisture and prevent popcorning during reflow. Stencil design should ensure adequate solder paste volume for the exposed thermal pad to enhance thermal and mechanical reliability.
Can the ADS61B23IRHB25 be used in multi-ADC synchronization scenarios, and what system-level considerations apply?
The ADS61B23IRHB25 lacks a dedicated synchronization pin or phase-locked loop, making precise multi-device alignment challenging. However, external clock distribution with matched trace lengths and low-jitter sources (e.g., clock fanout buffers) can achieve sub-nanosecond skew between devices. The LVDS clock output can serve as a timing reference for downstream ADCs, but propagation delays must be calibrated in software or FPGA logic. For beamforming or phased-array systems, this approach is viable but requires rigorous timing analysis and possibly digital delay compensation to maintain phase coherence across channels.
What debugging techniques are effective when the ADS61B23IRHB25 exhibits unexpected code transitions or missing codes?
Missing codes or erratic transitions in the ADS61B23IRHB25 often stem from inadequate power supply decoupling or reference instability. Use a high-resolution oscilloscope with differential probes to monitor the analog input and reference pins for glitches or ringing during sampling edges. Verify that the 0.1 μF and 10 μF decoupling capacitors are placed within 2 mm of the supply pins. Additionally, check for ground bounce by measuring the voltage between the ADC’s ground pad and the system ground during high-speed data transitions. Poor solder joints on the thermal pad can also manifest as intermittent performance due to thermal or mechanical stress.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments ADS61B23IRHB25

Product Attribute ADS61B23IRHBR ADS61B23IRHBT ADS61B29IRGZ25 ADS61B49IRGZ25
Part Number ADS61B23IRHBR ADS61B23IRHBT ADS61B29IRGZ25 ADS61B49IRGZ25
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Input Type - - - Differential
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
Ratio - S/H:ADC - - - 1:1
Features - - - Simultaneous Sampling
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Configuration - - - S/H-ADC
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of A/D Converters - - - 2
Reference Type - External, Internal External External, Internal
Data Interface - LVDS - Parallel I²C LVDS - Parallel, Parallel
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Architecture - Current Source R-2R Pipelined
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Bits - 16 8 14
Sampling Rate (Per Second) - - - 65M
Number of Inputs - - - 2

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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ADS61B23IRHB25 Image

ADS61B23IRHB25

Texas Instruments
98D-ADS61B23IRHB25

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