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HomeProductsIntegrated Circuits (ICs)Interface - SpecializedDP83822IFRHBT
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DP83822IFRHBT - Texas Instruments

Manufacturer Part Number
DP83822IFRHBT
Manufacturer
Texas Instruments
Allelco Part Number
32D-DP83822IFRHBT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,317 pcs available, New & Original
Parts Description
IC INTERFACE SPECIALIZED 32VQFN
Package
32-VQFN (5x5)
Data sheet
DP83822IFRHBT.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 9317
  • Unit Price: $2.179
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.179 $2.18
10+ $1.90 $19.00
30+ $1.734 $52.02
250+ $1.567 $391.75
500+ $1.489 $744.50
1000+ $1.454 $1,454.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

DP83822IFRHBT Tech Specifications
Texas Instruments - DP83822IFRHBT technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - DP83822IFRHBT

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 1.71V ~ 3.45V
Supplier Device Package 32-VQFN (5x5)
Series -
Package / Case 32-VFQFN Exposed Pad
Product Attribute Attribute Value
Package Tape & Reel (TR)
Mounting Type Surface Mount
Interface MII, RMII
Base Product Number DP83822
Applications Ethernet

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

DP83822IFRHBT Image
DP83822IFRHBT (1)

Manufacturer Part Number

DP83822IFRHBT

Manufacturer

Texas Instruments

Introduction

The DP83822IFRHBT is a robust, low-power Ethernet physical layer transceiver from Texas Instruments, designed for precision applications requiring reliable data transmission over physical network layers.

Product Features and Performance

Supports both 100BASE-TX and 10BASE-Te Ethernet protocols

Low power consumption enhances energy efficiency

Extended temperature range suitable for industrial applications

Auto-MDIX support enables automatic cable detection

Integrated cable diagnostics for advanced network troubleshooting

Energy Efficient Ethernet (IEEE 802.3az) for reduced power during low data activity

Wake-on-LAN support for remote wake-up of network devices

Product Advantages

High integration optimizes PCB space

Flexibility in power supply (1.71V to 3.45V) accommodates diverse system designs

Improved signal quality and network reliability

Easy to deploy in various networking equipment due to MII and RMII interfaces

DP83822IFRHBT Image
DP83822IFRHBT (2)

Key Technical Parameters

Voltage Supply: 1.71V ~ 3.45V

Interface: MII, RMII

Package / Case: 32-VFQFN Exposed Pad

Mounting Type: Surface Mount

Quality and Safety Features

Rigorous testing ensures high reliability and performance stability

Built-in protection mechanisms against electrostatic discharge and voltage surges

Compatibility

Compatible with IEEE 802.3u standard for Fast Ethernet

Seamlessly works with various microcontrollers and processors supporting MII/RMII interfaces

Application Areas

Industrial automation and control systems

Smart grid and energy management

Automotive networking and infotainment systems

Consumer electronics and home networking

Product Lifecycle

Currently active and not near discontinuation

Ongoing support and availability of replacements or upgrades

Several Key Reasons to Choose This Product

State-of-the-art reliability and performance for critical network communication

Texas Instruments' proven expertise and support in networking technology

Versatile power and interface options support diverse application needs

Advanced features for energy saving and network diagnostics enhance overall system efficiency and maintenance

Robust design ensuring long-term stability and compatibility in various environments and applications

Frequently Asked Questions(FAQ)

What are the key differences between the DP83822IFRHBT and similar Ethernet PHY transceivers when selecting for low-power industrial applications?
The DP83822IFRHBT offers a supply voltage range of 1.71V to 3.45V, which enables operation in low-voltage systems commonly found in energy-efficient industrial designs. This flexibility supports integration into battery-powered or thermally constrained environments where power budgeting is critical. Compared to higher-voltage alternatives, this device reduces static power consumption under light-load conditions, making it suitable for always-on sensor nodes or remote monitoring equipment. However, designers must verify that signal integrity and timing margins remain acceptable across the full operating temperature range, particularly at the lower end of the supply window.
How does the DP83822IFRHBT handle clock synchronization in RMII mode compared to other TI PHYs with similar interface support?
The DP83822IFRHBT provides precise reference clock generation and recovery in RMII mode, allowing system-level optimization of oscillator usage. In typical configurations, it generates a 50 MHz clock from an external crystal or oscillator, reducing BOM cost and board space. Unlike some competitors that require external clock recovery circuitry, this device integrates phase-locked loop (PLL) functionality internally, improving jitter performance and reducing timing skew between transmit and receive paths. This is especially beneficial in time-sensitive applications such as real-time control loops over Ethernet.
Can the DP83822IFRHBT operate reliably in extended temperature environments without additional thermal management?
Yes, the DP83822IFRHBT is specified for commercial and industrial temperature ranges, typically from -40°C to +85°C or possibly wider depending on the specific variant. Its 32-VQFN package features an exposed pad for improved heat dissipation, allowing it to maintain stable operation under moderate ambient conditions without forced cooling. However, sustained high data throughput—such as continuous full-duplex gigabit transfers—can elevate junction temperatures. Designers should perform thermal simulation using the JEDEC standard test condition (JESD51-2) and consider PCB copper area augmentation if operating near upper thermal limits.
What considerations apply when interfacing the DP83822IFRHBT with a microcontroller that lacks native MII or RMII support?
The DP83822IFRHBT uses either MII or RMII interfaces, so direct connection requires a host processor with corresponding MAC peripheral capability. If the microcontroller does not include built-in Ethernet MAC functionality, an external bridge chip or FPGA may be needed to translate between the processor’s bus protocol and the PHY’s serial control interface. Additionally, GPIO lines used for LED status indication or interrupt signaling must be properly debounced and configured according to the device’s electrical characteristics. Failure to account for these constraints can lead to unreliable link detection or configuration errors during boot-up.
How does the DP83822IFRHBT compare to the DP83826E in terms of power efficiency and feature set for compact embedded designs?
While both are Texas Instruments Ethernet PHYs targeting embedded applications, the DP83822IFRHBT differs significantly from the DP83826E in its voltage tolerance and integration level. The DP83822IFRHBT supports a broader supply range (1.71V–3.45V) compared to the DP83826E’s tighter window, offering greater flexibility in mixed-voltage systems. It also includes enhanced EMI mitigation features such as integrated termination resistors and selectable output drive strength, which reduce the need for external components. As a result, the DP83822IFRHBT often achieves lower total system BOM count and improved signal integrity in noisy environments, albeit at a slightly higher unit cost.
What impact does layout parasitics have on the DP83822IFRHBT’s Ethernet performance, and how should traces be routed?
Impedance mismatches caused by improper trace routing can degrade signal quality and increase bit error rates on the Ethernet link. For the DP83822IFRHBT, differential pairs (TX± and RX±) must be routed as controlled-impedance traces (typically 100Ω differential) with consistent spacing and length matching. Length skew beyond ±50 mils can introduce intersymbol interference, particularly at 100 Mbps or higher speeds. Ground planes should be uninterrupted beneath these traces, and vias should be minimized to prevent impedance discontinuities. Poor layout practices may cause false link drops or intermittent communication failures even when all electrical specifications are met.
Is it possible to use the DP83822IFRHBT in PoE-powered devices, and what precautions are necessary?
The DP83822IFRHBT itself does not integrate PoE power sourcing equipment (PSE) or powered device (PD) functionality; however, it can be deployed in PoE-compliant systems when paired with an external PD controller. When used in PoE applications, special attention must be paid to transient protection on the VDD pins due to inductive kickback from magnetics during power insertion events. A transient voltage suppressor (TVS) diode rated for the expected surge current (e.g., 0.5A to 1A per IEC 61000-4-5) should be placed close to the PHY’s power input. Additionally, decoupling capacitors must meet fast-ramp requirements to avoid brownout resets during initial power-up.
How does the Moisture Sensitivity Level (MSL) rating of 2 for the DP83822IFRHBT affect manufacturing handling procedures?
With an MSL rating of 2, the DP83822IFRHBT must be stored in dry packaging and assembled within one year of manufacture. After opening the moisture barrier bag, the component must undergo reflow soldering within 168 hours (seven days) under controlled humidity (<10% RH). If the time exceeds this threshold, the part must be baked before reflow to prevent popcorning during thermal cycling. Standard IPC-J-STD-033 guidelines apply, including use of humidity indicator cards and desiccant packs in shipping containers. Compliance ensures long-term reliability and avoids latent defects in high-volume production.
What role do LED indicators play in diagnosing connectivity issues with the DP83822IFRHBT, and how can they be utilized effectively?
The DP83822IFRHBT supports configurable LED outputs that reflect link status, activity, and speed negotiation results. These signals are driven by internal logic and can be monitored via GPIOs on the host system. For troubleshooting, observing blink patterns helps isolate physical layer problems such as cable faults, impedance mismatches, or incorrect duplex settings. For instance, a steady green LED typically indicates a 100 Mbps link, while rapid blinking suggests data transmission. However, LEDs alone cannot diagnose higher-layer protocol issues, so complementary tools like oscilloscopes or network analyzers are recommended for full validation.
Can the DP83822IFRHBT support auto-negotiation across different cable types, and what limitations might arise?
Yes, the DP83822IFRHBT implements full IEEE 802.3u auto-negotiation capabilities, allowing it to detect and configure optimal speed and duplex settings automatically regardless of cable category (e.g., Cat 5e, Cat 6). However, performance degrades with longer or poorly shielded cables, especially beyond 100 meters, due to increased attenuation and crosstalk. In industrial settings with high electromagnetic interference, unshielded twisted pair (UTP) cables may require additional filtering or grounding strategies. Auto-negotiation failures can also occur if the far-end device has disabled this feature, leading to forced-mode mismatches and packet loss.
What steps are required to ensure EMC compliance when deploying the DP83822IFRHBT in a consumer-grade product?
Achieving EMC compliance involves both hardware design and firmware configuration. The DP83822IFRHBT includes programmable output swing and slew rate controls that help reduce radiated emissions. Proper grounding, shielding of high-speed traces, and use of ferrite beads on power rails further mitigate susceptibility. During testing per CISPR 32/EN 55032 standards, common-mode chokes should be implemented on the magnetics to suppress differential-to-common-mode conversion. Firmware should avoid aggressive retry behaviors during collisions and implement exponential backoff algorithms to minimize retransmission bursts that could exacerbate emission peaks.
How does the choice between MII and RMII interfaces affect system complexity when using the DP83822IFRHBT?
The MII interface on the DP83822IFRHBT uses parallel signaling with dedicated clocks and data lanes, requiring more PCB layers and GPIO resources but offering deterministic timing. In contrast, RMII reduces pin count by half through time-division multiplexing, saving cost and footprint—ideal for space-constrained designs. However, RMII demands strict clock synchronization, typically provided by an external 50 MHz oscillator shared between PHY and MAC. Designers must weigh trade-offs: MII offers easier debugging due to visible bus traffic, while RMII reduces interconnect complexity at the expense of tighter timing discipline.
Are there any known errata or silicon revisions affecting stability of the DP83822IFRHBT in field-deployed systems?
As of available public documentation, no widespread errata have been reported for the DP83822IFRHBT that compromise core functionality. However, early production lots may exhibit minor variations in reference clock accuracy or LED response latency. Always consult the latest datasheet and technical reference manual from Texas Instruments for updates. When designing for mission-critical applications, it’s advisable to request lot traceability and perform accelerated life testing under worst-case conditions (e.g., high temperature, voltage stress) to validate long-term reliability.
What is the significance of the exposed pad on the 32-VQFN package of the DP83822IFRHBT, and how should it be handled during assembly?
The exposed pad on the DP83822IFRHBT serves as a thermal interface to dissipate heat generated during operation and also acts as a ground return path. Proper attachment requires soldering the pad to a solid ground plane on the PCB using solder paste and reflow profiling compatible with lead-free processes. Mechanical stress should be avoided during handling to prevent cracking the die attach. Best practice dictates applying thermal vias underneath the pad to enhance heat spreading into adjacent copper layers, thereby maintaining junction temperature below maximum ratings even under sustained load.
How does the DP83822IFRHBT compare to third-party PHY solutions in terms of diagnostic features and register accessibility?
The DP83822IFRHBT provides extensive internal registers accessible via MDIO/MDC interface, enabling detailed monitoring of link status, error counters, and operational modes. This level of visibility surpasses many generic PHY chips that offer only basic LED-driven feedback. Engineers can poll statistics registers to identify intermittent noise sources or duplex mismatches without physical access to the link. Additionally, TI’s proprietary diagnostic tools and SDKs streamline development, providing faster time-to-market compared to less instrumented alternatives that rely solely on hardware indicators.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments DP83822IFRHBT

Product Attribute DP83822HFRHBT DP83822IFRHBR DP83822IRHBT DP83822HFRHBR
Part Number DP83822HFRHBT DP83822IFRHBR DP83822IRHBT DP83822HFRHBR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Interface - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage - Supply - - - -
Applications - - - -
Series - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

DP83822IFRHBT Datasheet PDF

Download DP83822IFRHBT pdf datasheets and Texas Instruments documentation for DP83822IFRHBT - Texas Instruments.

PCN Design/Specification
DP83822 Datasheet Chg 27/Aug/2019.pdf DP83822YYY 16/Apr/2018.pdf
HTML Datasheet
Cylindrical Battery Holders.pdf
PCN Assembly/Origin
2.73KHz.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Brazil 7
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United Kingdom 4
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New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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DP83822IFRHBT Image

DP83822IFRHBT

Texas Instruments
32D-DP83822IFRHBT

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