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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5249IRGCR~~

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MSP430F5249IRGCR - Texas Instruments

Name: Texas Instruments MSP430F5249IRGCR
Brand: Texas Instruments
SKU: MSP430F5249IRGCR
Price: 2.182 USD
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: MSP430F5249IRGCR

Manufacturer: Texas Instruments

Allelco Part Number: 32D-MSP430F5249IRGCR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 9,102 pcs available, New & Original

Parts Description: IC MCU 16BIT 128KB FLASH 64VQFN

Package: 64-VQFN (9x9)

Data sheet: MSP430F5249IRGC.pdf

Datasheets
MSP430x5xx,MSP430x6xx Family Guide.pdf

PCN Assembly/Origin
Copper Wire Base 12/May/2014.pdf

PCN Design/Specification
MSP430 DS Chg 11/Jan/2021.pdf Mult Dev Datasheet Rev 17/Dec/2018.pdf

Errata
MSP430F5249 Errata.pdf

HTML Datasheet
MSP430F52xx Datasheet.pdf

RoHs Status: ROHS3 Compliant

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10+	$2.264	$22.64
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100+	$2.182	$218.20

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Specifications

MSP430F5249IRGCR Tech Specifications
Texas Instruments - MSP430F5249IRGCR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5249IRGCR

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	64-VQFN (9x9)
Speed	25MHz
Series	MSP430F5xx
RAM Size	8K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	64-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	53
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 12x10b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, SPI, UART/USART
Base Product Number	MSP430F5249

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Parts Introduction

MSP430F5249IRGCR (1)

Manufacturer Part Number

MSP430F5249IRGCR

Manufacturer

Texas Instruments

Introduction

Low-Power Mixed-Signal Microcontroller

Product Features and Performance

MSP430 CPUXV2 Core

16-Bit RISC Architecture

Speed of 25MHz

Integrated I2C, IrDA, SPI, UART/USART

Brown-out Detect/Reset, DMA, POR, PWM, WDT Peripherals

53 I/O Ports Provide Extensive Connectivity

128KB Flash Memory for Program Storage

8KB RAM for Data Handling

12-Channel 10-Bit Analog-to-Digital Converter

Internal Oscillator for Clock Generation

Surface Mount 64-VQFN Package

Product Advantages

Optimized for Low-Power Applications

Offers Comprehensive Set of Analog and Digital Peripherals

Large Memory for Complex Applications

Wide Range of Communication Interface Support

Robust Design with Built-in Safety Features

Small Form Factor for Space-Constrained Applications

Key Technical Parameters

Core Size: 16-Bit

Speed: 25MHz

Program Memory Size: 128KB (128K x 8)

Program Memory Type: FLASH

RAM Size: 8K x 8

Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V

Data Converters: A/D 12x10b

Operating Temperature Range: -40°C ~ 85°C

Quality and Safety Features

Brown-out Detect/Reset Function

Watchdog Timer for System Integrity

Power-On Reset (POR) Circuit

Compatibility

Compatible with MSP430F5xx Series Ecosystem

Supports Various Peripheral Communication Standards

Application Areas

IoT Devices

Consumer Electronics

Industrial Controllers

Automation Systems

Portable Medical Devices

Energy Management

Smart Metering

Product Lifecycle

Active Status

Not Near Discontinuation

Support for Replacements and Upgrades Available

Several Key Reasons to Choose This Product

Efficient Power Consumption for Battery-Led Applications

Scalable Memory Options Facilitating Complex Embedded Solutions

Wide Operating Temperature Range Suitable for Harsh Environments

Robust Peripheral Set for Versatile Application Design

Large I/O Count for Enhanced Device Control

Reliable Manufacturer with Long-Term Support and Documentation

High Integration Level Reducing the Need for External Components

Frequently Asked Questions(FAQ)

What are the key power management features of the MSP430F5249IRGCR that support ultra-low-power design in battery-operated applications?: The MSP430F5249IRGCR integrates multiple low-power modes (LPM0 to LPM4) with fast wake-up times, allowing dynamic power scaling based on processing demands. Its active current consumption is typically 165 µA/MHz at 3.0 V, while LPM3 draws only 1.8 µA with real-time clock (RTC) functionality active. The on-chip brown-out reset (BOR) and power-on reset (POR) ensure reliable startup and operation across the full 1.8 V to 3.6 V supply range, minimizing external supervisory components in energy-constrained systems.

How does the internal oscillator of the MSP430F5249IRGCR impact timing accuracy and system design complexity?: The MSP430F5249IRGCR features a factory-calibrated internal 32 kHz low-frequency oscillator (VLO) and a digitally controlled oscillator (DCO) that can reach up to 25 MHz. The DCO supports frequency trimming via software, enabling clock stability without external crystals in many applications. For higher precision timing, such as UART communication or RTC operation, an external 32.768 kHz crystal can be connected. This flexibility reduces BOM cost and board space but requires careful evaluation of clock drift in temperature-sensitive environments due to the VLO’s ±4% initial accuracy.

What is the effective usable RAM size for application code and data in the MSP430F5249IRGCR, and how does memory partitioning affect real-time performance?: The MSP430F5249IRGCR provides 8 KB of RAM (8K x 8), which must accommodate both stack, heap, and static variables. With the 128 KB flash organized in 512-byte segments, firmware updates or bootloader implementations may require careful memory mapping to avoid fragmentation. The DMA controller allows background data transfers between peripherals and RAM, reducing CPU overhead during high-throughput operations such as ADC sampling or SPI communication, thereby preserving real-time responsiveness.

How does the 10-bit ADC in the MSP430F5249IRGCR compare to higher-resolution ADCs in similar ultra-low-power MCUs for sensor interfacing?: The MSP430F5249IRGCR includes a 12-channel, 10-bit successive approximation register (SAR) ADC with a maximum sampling rate of 200 ksps. While 10-bit resolution is sufficient for many environmental sensing applications (e.g., temperature, light), it offers less granularity than 12-bit or 16-bit ADCs found in competing devices. For example, a 10-bit ADC over a 3.3 V range yields ~3.2 mV per step, which may limit precision in low-amplitude signal chains. Designers should evaluate signal conditioning and oversampling techniques to improve effective resolution when needed.

Can the MSP430F5249IRGCR support real-time operating systems (RTOS), and what are the practical limitations given its memory and core architecture?: Yes, the MSP430F5249IRGCR can run lightweight RTOS such as FreeRTOS or TI-RTOS, leveraging its 16-bit MSP430 CPUXV2 core and 8 KB RAM. However, the limited RAM constrains the number of concurrent tasks and stack sizes—typical RTOS configurations may allocate 512–1024 bytes per task, leaving minimal headroom for application logic. The 25 MHz clock speed provides adequate throughput for moderate multitasking, but complex scheduling with high-frequency interrupts may require optimization of context-switch overhead and ISR latency.

What are the thermal and packaging considerations when using the MSP430F5249IRGCR in high-density PCB layouts?: Housed in a 64-VQFN (9x9 mm) exposed pad package, the MSP430F5249IRGCR benefits from improved thermal dissipation through the central pad, which should be soldered to a grounded thermal plane. With an operating temperature range of -40°C to 85°C, junction temperatures can rise under continuous high-load operation, especially in enclosed environments. Proper via stitching beneath the pad and adequate copper area help maintain thermal stability. The MSL 3 rating (168 hours floor life) necessitates controlled handling during assembly to prevent moisture-related defects.

How does the MSP430F5249IRGCR’s peripheral set compare to the MSP430F5529 in terms of connectivity and integration for industrial sensor nodes?: The MSP430F5249IRGCR and MSP430F5529 both feature I2C, SPI, UART, and DMA, but the F5529 includes USB 2.0 full-speed support, which the F5249IRGCR lacks. For applications requiring wired host communication, the F5529 offers greater flexibility, while the F5249IRGCR excels in cost-sensitive, non-USB designs with tighter power budgets. Both share similar flash and RAM sizes, but the F5249IRGCR’s lower pin count (64 vs. 80 pins) suits space-constrained designs where USB is unnecessary.

What design strategies should be employed to minimize EMI when using the MSP430F5249IRGCR in mixed-signal environments with high-speed switching?: To reduce EMI, route high-frequency digital traces (e.g., SPI clock lines) away from analog inputs and the ADC reference. Use the internal pull-up/pull-down resistors instead of external ones to minimize loop area. The MSP430F5249IRGCR’s power supply pins should be decoupled with 100 nF ceramic capacitors placed close to each VCC/GND pair. Additionally, leveraging the low-power modes to gate clock signals during idle periods reduces radiated emissions. The exposed pad must be properly grounded to serve as a shield and improve signal integrity.

Is the MSP430F5249IRGCR suitable for safety-critical applications requiring fault detection and system resilience?: The MSP430F5249IRGCR includes essential fault detection mechanisms such as brown-out reset (BOR), power-on reset (POR), and a watchdog timer (WDT), which enhance system reliability in unpredictable environments. However, it lacks hardware redundancy, error-correcting code (ECC) memory, or lockstep core features required for functional safety standards like IEC 61508. It is appropriate for non-certified resilient designs but not recommended for ASIL or SIL-rated systems without additional external monitoring circuitry.

How does the flash memory endurance of the MSP430F5249IRGCR influence firmware update strategies in field-deployed devices?: The MSP430F5249IRGCR’s flash memory supports up to 10,000 program/erase cycles per segment. Frequent in-field firmware updates can prematurely wear specific flash blocks, especially if bootloaders repeatedly write to the same sectors. To extend lifetime, implement wear-leveling algorithms or reserve dedicated update partitions. The 512-byte segment size allows granular updates, reducing the risk of corruption during power loss, but requires robust rollback mechanisms and checksum validation to ensure firmware integrity.

What are the trade-offs between using internal versus external clock sources for UART communication on the MSP430F5249IRGCR?: Using the internal DCO for UART baud rate generation simplifies design and reduces component count, but introduces potential timing errors due to DCO drift over temperature and voltage. For standard baud rates (e.g., 9600, 115200), the DCO can be calibrated to maintain acceptable error margins (<2%). However, in multi-drop or long-distance serial networks, an external crystal ensures tighter frequency tolerance, minimizing framing errors. The MSP430F5249IRGCR’s UART supports automatic baud rate detection, which can compensate for minor clock deviations during initialization.

How does the I/O structure of the MSP430F5249IRGCR support interfacing with 5 V logic systems without level shifters?: The MSP430F5249IRGCR’s I/O pins are not 5 V tolerant; applying voltages above VCC + 0.3 V may damage the device. However, its 53 general-purpose I/Os support Schmitt-trigger inputs and configurable pull-up/down resistors, enabling robust communication with 3.3 V peripherals. For 5 V systems, external level translation (e.g., MOSFET-based or dedicated ICs) is required. Alternatively, open-drain configurations with external pull-ups to 5 V can be used for signals like I2C, provided current limits and timing are respected.

What role does the DMA controller play in optimizing power efficiency during high-data-rate peripheral operations on the MSP430F5249IRGCR?: The DMA controller in the MSP430F5249IRGCR enables direct data transfers between peripherals (e.g., ADC, SPI) and memory without CPU intervention, significantly reducing active-mode duration. For example, capturing 1 KB of ADC samples at 200 ksps can be completed in the background while the CPU remains in LPM0, cutting average current by up to 60% compared to polling or interrupt-driven methods. This is particularly beneficial in data-logging applications where burst transfers are followed by long sleep intervals.

How does the MSP430F5249IRGCR’s performance at 25 MHz compare to ARM Cortex-M0+ MCUs in similar power domains?: The MSP430F5249IRGCR operates at 25 MHz with a 16-bit architecture, delivering approximately 1.25 DMIPS, while many Cortex-M0+ devices run at 48 MHz and achieve ~1.25 DMIPS/MHz, resulting in higher overall throughput. However, the MSP430F5249IRGCR maintains a significant advantage in deep-sleep current (sub-µA range) and wake-up time (<5 µs), making it preferable for duty-cycled applications. The trade-off lies in computational intensity—Cortex-M0+ excels in math-heavy tasks, whereas the MSP430F5249IRGCR optimizes for energy-per-task efficiency.

What precautions are necessary when designing the power supply network for the MSP430F5249IRGCR in multi-voltage systems?: The MSP430F5249IRGCR operates from 1.8 V to 3.6 V, so in systems with higher rail voltages (e.g., 5 V or 3.3 V domains), a low-dropout regulator (LDO) or buck converter should be used to supply VCC. Ensure the power-up sequence avoids voltage overshoots that could trigger latch-up. Decoupling capacitors (100 nF per power pin plus a 1–10 µF bulk capacitor) must be placed close to the package to suppress noise. The exposed pad should connect to a clean ground plane to maintain signal reference integrity and thermal performance.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5249IRGCR

Product Attribute
Part Number	MSP430F5247IRGCR	MSP430F5244IRGZR	MSP430F5253IRGCR	MSP430F5252IRGCT
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Program Memory Type	-	-	-	-
Core Processor	-	-	-	-
Data Converters	-	-	-	-
Core Size	-	-	-	-
Series	-	-	-	-
EEPROM Size	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Peripherals	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Oscillator Type	-	-	-	-
Number of I/O	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
RAM Size	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Program Memory Size	-	-	-	-
Connectivity	-	-	-	-
Speed	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

MSP430F5249IRGCR Datasheet PDF

Download MSP430F5249IRGCR pdf datasheets and Texas Instruments documentation for MSP430F5249IRGCR - Texas Instruments.

Datasheets: MSP430x5xx,MSP430x6xx Family Guide.pdf
PCN Assembly/Origin: Copper Wire Base 12/May/2014.pdf
PCN Design/Specification: MSP430 DS Chg 11/Jan/2021.pdf Mult Dev Datasheet Rev 17/Dec/2018.pdf
Errata: MSP430F5249 Errata.pdf
HTML Datasheet: MSP430F52xx Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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