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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5249IZQER~~

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MSP430F5249IZQER - Texas Instruments

Manufacturer Part Number: MSP430F5249IZQER

Manufacturer: Texas Instruments

Allelco Part Number: 98D-MSP430F5249IZQER

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 6,846 pcs available, New & Original

Parts Description: IC MCU 16BIT 128KB FLASH 80BGA

Package: 80-BGA MICROSTAR JUNIOR (5x5)

Data sheet: MSP430F5249IZQE.pdf

Datasheets
MSP430x5xx,MSP430x6xx Family Guide.pdf

HTML Datasheet
MSP430F52xx.pdf

PCN Design/Specification
Mult Dev Datasheet Rev 17/Dec/2018.pdf CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

Errata
MSP430F5249 Errata.pdf

RoHs Status: ROHS3 Compliant

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In stock: 6846

Specifications

MSP430F5249IZQER Tech Specifications
Texas Instruments - MSP430F5249IZQER technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5249IZQER

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	80-BGA MICROSTAR JUNIOR (5x5)
Speed	25MHz
Series	MSP430F5xx
RAM Size	8K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	80-VFBGA
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	53
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 12x10b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, SPI, UART/USART
Base Product Number	MSP430F5249

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the MSP430F5249IZQER for a low-power embedded system with real-time sensor data acquisition?: The MSP430F5249IZQER offers a balanced architecture suitable for energy-constrained applications, but designers must consider its 8KB RAM limitation when handling large sensor datasets. While its 25MHz clock speed and 128KB FLASH support efficient data processing, the lack of integrated EEPROM means non-volatile parameter storage requires external solutions or FLASH wear-leveling algorithms. Its 12-channel, 10-bit ADC enables precise analog measurements, but higher resolution or faster sampling may require external converters. The device’s ultra-low active power consumption (as low as 160µA/MHz) is offset by longer wake-up times from sleep modes, impacting responsiveness in time-critical tasks.

How does the MSP430F5249IZQER compare to the MSP430F5249IRGCR in terms of thermal performance and PCB layout complexity?: The MSP430F5249IZQER uses an 80-BGA MICROSTAR JUNIOR (5x5) package with a smaller footprint than the IRGCR’s 80-VQFN, offering better space efficiency but demanding significantly tighter PCB design tolerances. BGA assembly requires advanced soldering techniques and X-ray inspection due to its 0.4mm pitch. In contrast, the VQFN version allows for more forgiving surface-mount processes. Both share identical electrical characteristics, but the BGA package has slightly higher thermal resistance due to reduced copper exposure, potentially requiring careful thermal via placement under the exposed pad during board layout to maintain junction temperatures below 85°C under full load.

Can the MSP430F5249IZQER be used in automotive-grade temperature monitoring systems, and what design precautions are necessary?: The MSP430F5249IZQER operates reliably from -40°C to +85°C, which covers most industrial and commercial temperature ranges, including many automotive environments. However, it is not AEC-Q100 qualified, so its use in safety-critical automotive applications should be carefully evaluated. Designers must ensure proper decoupling near the Vcc pins, use stable external references if high ADC accuracy is needed, and implement watchdog and brown-out reset circuits to handle power fluctuations. Additionally, signal integrity on high-speed interfaces like SPI or I2C should be maintained through controlled impedance routing and shielding where required.

What is the impact of using internal versus external oscillators with the MSP430F5249IZQER, particularly in battery-powered devices?: The MSP430F5249IZQER includes an internal 25MHz DCO oscillator that can be trimmed for accuracy but typically has ±1% tolerance. For precision timing or communication protocols like UART at high baud rates, this variation may exceed acceptable limits. Using an external crystal improves stability and reduces calibration overhead, saving FLASH memory used for trimming codes. However, crystals consume more power and add cost and board space. In low-power designs, the device’s flexible clock system allows switching between internal and external sources, enabling duty-cycled operation where the MCU runs briefly with the crystal for accurate transmission before reverting to the low-power internal oscillator.

How does the 80-BGA packaging affect the reliability of the MSP430F5249IZQER in harsh mechanical environments?: The 80-BGA MICROSTAR JUNIOR (5x5) package provides excellent electrical performance and compact size but presents mechanical challenges under vibration and thermal cycling. BGA solder joints are prone to fatigue failure if subjected to repeated stress. To enhance reliability, designers should avoid placing the IC near edges of PCBs, use stiffeners, and minimize layer transitions near the BGA. Thermal management is critical—ensuring adequate heat dissipation through vias under the die helps prevent warpage and solder joint cracking. MSL level 3 indicates standard moisture sensitivity, but reflow profiles must comply with IPC standards to avoid popcorning during assembly.

What are the limitations of the MSP430F5249IZQER’s PWM capabilities when driving motor control loads?: The MSP430F5249IZQER includes multiple PWM modules capable of generating up to 16 independent channels, but all share a maximum frequency of approximately 1 MHz with 10-bit resolution. This is sufficient for many servo and stepper motor applications but insufficient for high-frequency BLDC motor drives requiring >100kHz switching. Additionally, output drive strength is limited to standard CMOS levels (~3.3V, 8–12mA), necessitating external drivers for inductive loads. The lack of complementary outputs or dead-time generation in hardware limits H-bridge control without software intervention, increasing CPU load and potential for shoot-through faults.

Is the MSP430F5249IZQER suitable for firmware development with real-time operating systems (RTOS), and what constraints apply?: Yes, the MSP430F5249IZQER supports RTOS integration due to its 8KB RAM and deterministic interrupt response. However, task stacks and kernel overhead consume a significant portion of available RAM—typical RTOS usage may occupy 1–2KB, leaving limited headroom for application buffers and context switching. Developers must optimize ISR duration to avoid blocking other tasks and carefully manage shared resources. The built-in DMA controller offloads data transfers from the CPU, reducing latency and freeing cycles for RTOS scheduling. Careful partitioning of memory regions and use of static allocation rather than dynamic memory are recommended to ensure timing predictability.

How does the absence of on-chip EEPROM in the MSP430F5249IZQER affect system calibration and configuration persistence?: Unlike some MSP430 variants, the MSP430F5249IZQER lacks integrated EEPROM, so calibration coefficients, device-specific IDs, or user configurations cannot be stored non-volatily without external components. Designers often reserve a small section of FLASH (e.g., 512 bytes) for such data, implementing wear-leveling and periodic backup routines. This increases firmware complexity and risks corruption during power loss. Alternatively, external serial EEPROMs (like 24xx series) add cost and pins, but offer larger capacity and byte-wise write flexibility. The choice depends on update frequency, endurance requirements, and system cost targets.

What considerations apply when interfacing the MSP430F5249IZQER with 5V logic systems using its 3.3V I/O banks?: The MSP430F5249IZQER operates at 1.8V–3.6V, so direct connection to 5V logic (e.g., older sensors or legacy peripherals) risks damaging the MCU. Level shifting is mandatory. Simple resistor-divider networks suffice for unidirectional signals but do not protect against reverse voltage. Bidirectional interfaces require dedicated transceivers like TXB0104 or MOSFET-based level shifters. For UART/I2C, open-drain signaling allows safe 5V pull-ups only if input thresholds are compatible; otherwise, active translation is needed. Always verify voltage compliance across all pins, especially during power sequencing.

How does the DMA feature in the MSP430F5249IZQER improve system efficiency in data-intensive applications?: The MSP430F5249IZQER includes a DMA controller that transfers data between memory and peripherals without CPU intervention, reducing interrupt frequency and CPU load. For example, continuous ADC sampling into RAM can occur while the CPU sleeps, waking only after buffer thresholds are reached. This enables low-latency, high-throughput data capture essential for audio processing or sensor fusion. The DMA supports multiple channel priorities and burst modes, allowing flexible configuration. Proper buffer alignment and double-buffering techniques prevent data loss during transfers, maximizing effective throughput even at high sample rates.

What are the implications of the MSP430F5249IZQER’s Moisture Sensitivity Level (MSL) 3 classification for manufacturing and handling?: MSL 3 indicates the MSP430F5249IZQER can withstand up to 168 hours of exposure to ambient conditions before requiring baking. After opening the moisture barrier bag, the component must be assembled within this window unless baked per JEDEC J-STD-033. Failure to comply risks delamination and popcorn cracking during reflow. Facilities must track time-to-assembly and maintain controlled storage (dry cabinets with desiccant). This applies equally to prototype builds and mass production. Proper handling procedures, including ESD protection and humidity monitoring, are essential to preserve reliability throughout the supply chain.

Can the MSP430F5249IZQER replace microcontrollers with integrated CAN or LIN interfaces in automotive lighting control?: No, the MSP430F5249IZQER lacks native CAN or LIN transceivers, making it unsuitable for direct replacement in automotive networks requiring these protocols. While it supports UART/USART and can emulate LIN via bit-banging, this approach consumes CPU cycles and lacks hardware error detection. For automotive lighting, where timing and fault tolerance matter, dedicated transceivers like TJA1050 (CAN) or TJA1021 (LIN) are preferred. The MSP430F5249IZQER could still serve as a host processor behind such a transceiver, handling PWM generation and diagnostics, but not as a standalone node.

What are the best practices for minimizing power consumption in the MSP430F5249IZQER during standby operation?: To minimize power in the MSP430F5249IZQER, enable deep sleep mode (LPM3 or LPM4), disable unused clocks, turn off analog peripherals via control registers, and configure GPIOs as inputs with pull-downs to prevent leakage. Use the real-time clock (RTC) or external interrupts to wake the device periodically. The RTC draws less than 1µA in LPM3. Avoid leaving unused pins floating—they can cause parasitic current paths. Also, ensure supply rails are clean and bypass capacitors are placed close to VCC/GND pins to reduce switching noise that increases quiescent current.

How does the 128KB FLASH memory of the MSP430F5249IZQER constrain firmware updates and over-the-air (OTA) functionality?: The 128KB FLASH provides ample space for most embedded applications, but OTA updates require careful planning. Firmware must support partial image flashing and rollback mechanisms to survive failed updates. Since FLASH has limited erase/write cycles (~10k), frequent writes reduce longevity. Delta updates and compression help mitigate this. Additionally, the BGA package complicates debugging and recovery—if a corrupted flash renders the device unresponsive, programming may require specialized equipment. Secure boot and cryptographic verification become essential to prevent malicious updates, adding computational overhead that strains the 25MHz CPU.

What are the advantages of using the MSP430F5249IZQER in wearable health monitoring devices compared to general-purpose MCUs?: The MSP430F5249IZQER excels in wearables due to its ultra-low active and sleep currents, compact 5x5mm BGA package, and integrated precision ADC for bio-signal conditioning. Its wake-on-interrupt capability allows duty-cycling sensors like accelerometers or PPG LEDs, extending battery life. The 16-bit CPU efficiently handles digital filters and baseline wander removal in ECG signals. However, the limited RAM may restrict complex algorithms, requiring external SRAM or simplified processing. The absence of USB hardware (only UART/I2C/SPI) simplifies connectivity but limits direct PC interfacing without protocol conversion.

How does the operating voltage range of 1.8V–3.6V influence power supply design for the MSP430F5249IZQER?: The wide supply range offers flexibility but demands robust regulation. Buck-boost converters or LDOs with low dropout (e.g., <100mV at 3.3V) are common choices. At 1.8V, noise margins shrink, increasing susceptibility to EMI-induced resets. Decoupling capacitors (100nF ceramic + 10µF bulk) must be placed within millimeters of each VCC pin. Brown-out reset (BOR) settings should align with minimum operating voltage to avoid false resets during brownouts. In coin-cell powered designs, ensuring clean shutdown sequences prevents FLASH corruption when voltage drops below 1.8V.

What tools and IDEs are optimized for developing firmware on the MSP430F5249IZQER, and how do they support debugging constraints?: Texas Instruments’ Code Composer Studio (CCS) and IAR Embedded Workbench are fully supported, providing optimized compilers and debug probes (e.g., MSP-FET). CCS integrates MSP430Ware libraries and peripheral driver examples. Due to the BGA package, physical probing is challenging; JTAG/SBW connectors must be precisely aligned. Boundary scan testing helps verify connections. Flash memory debugging allows live variable inspection, but erase operations require manual triggers. Stack overflow detection and real-time analysis features aid in optimizing power-aware code. Third-party tools like Segger J-Link also support this device with similar capabilities.

What are the environmental and regulatory considerations when deploying the MSP430F5249IZQER in global markets?: The MSP430F5249IZQER complies with RoHS3 and is REACH unaffected, meeting EU directives. ECCN EAR99 and HTSUS 8542.31.0001 simplify export controls in most countries. However, end-product certifications (FCC, CE, UL) depend on full system design, including antennas and power stages if present. In medical or industrial applications, additional standards (IEC 60601, ISO 13485) may apply. Thermal derating above 85°C requires airflow or heat sinks. Packaging materials must meet regional recycling laws. Always verify latest status on TI’s website, as regulations evolve.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5249IZQER

Product Attribute
Part Number	MSP430F5249IZQE	MSP430F5247IZQER	MSP430F5247IZQE	MSP430F5252IZQER
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Core Processor	-	-	-	-
Oscillator Type	-	-	-	-
Peripherals	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Series	-	-	-	-
Program Memory Size	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
EEPROM Size	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
RAM Size	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Speed	-	-	-	-
Connectivity	-	-	-	-
Data Converters	-	-	-	-
Number of I/O	-	-	-	-
Program Memory Type	-	-	-	-
Core Size	-	-	-	-

MSP430F5249IZQER Datasheet PDF

Download MSP430F5249IZQER pdf datasheets and Texas Instruments documentation for MSP430F5249IZQER - Texas Instruments.

Datasheets: MSP430x5xx,MSP430x6xx Family Guide.pdf
HTML Datasheet: MSP430F52xx.pdf
PCN Design/Specification: Mult Dev Datasheet Rev 17/Dec/2018.pdf CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf
PCN Obsolescence/ EOL: Cylindrical Battery Holders.pdf
Errata: MSP430F5249 Errata.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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