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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5253IZQER~~

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MSP430F5253IZQER - Texas Instruments

Name: Texas Instruments MSP430F5253IZQER
Brand: Texas Instruments
SKU: MSP430F5253IZQER
Availability: InStock
Rating: 5 (9 reviews)

Manufacturer Part Number: MSP430F5253IZQER

Manufacturer: Texas Instruments

Allelco Part Number: 98D-MSP430F5253IZQER

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 11,269 pcs available, New & Original

Parts Description: IC MCU 16BIT 128KB FLASH 80BGA

Package: 80-BGA MICROSTAR JUNIOR (5x5)

Data sheet: MSP430F5253IZQE.pdf

Datasheets
MSP430F525x.pdf MSP430x5xx,MSP430x6xx Family Guide.pdf

PCN Design/Specification
Mult Dev Datasheet Rev 17/Dec/2018.pdf CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf

RoHs Status: ROHS3 Compliant

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In stock: 11269

Specifications

MSP430F5253IZQER Tech Specifications
Texas Instruments - MSP430F5253IZQER technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5253IZQER

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	80-BGA MICROSTAR JUNIOR (5x5)
Speed	25MHz
Series	MSP430F5xx
RAM Size	16K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	80-VFBGA
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	53
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 10x10b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART
Base Product Number	MSP430F5253

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the MSP430F5253IZQER compare to the MSP430F5253IRGCT in terms of pin count and package dimensions, and what are the implications for PCB layout when substituting one for the other?: The MSP430F5253IZQER is packaged in an 80-BGA MICROSTAR JUNIOR (5x5) configuration, while the MSP430F5253IRGCT uses the same package type but with a different ball pitch or arrangement. Both devices share identical electrical characteristics, including 16-bit core, 25MHz speed, 128KB Flash, and 53 I/O lines, making them functionally interchangeable in logic design. However, due to subtle differences in ball placement or solder joint geometry between the two variants, mechanical alignment during reflow may vary. Engineers should verify land pattern compatibility in their PCB stackup, especially if transitioning from prototype to production. Thermal performance under high-load conditions remains consistent across both packages, assuming equivalent PCB copper area and airflow.

What are the key trade-offs in power consumption when operating the MSP430F5253IZQER at 1.8V versus 3.6V, and how do these impact battery life in portable embedded systems?: At 1.8V operation, the MSP430F5253IZQER consumes approximately 30% less current than at 3.6V for equivalent CPU load and peripheral activity, based on typical active-mode measurements. This results in significantly extended battery life for applications like wireless sensor nodes or wearable devices powered by coin-cell batteries. However, lower supply voltage increases propagation delay in internal logic paths, potentially reducing maximum achievable clock speed under tight timing constraints. When using external peripherals such as sensors with higher-voltage interfaces, level shifting may be required, adding component count and leakage risk. In low-power modes like LPM3.5, where the device runs off VCORE, voltage scaling also affects wake-up time—higher voltages reduce wake latency but increase energy per cycle. Designers must balance responsiveness against energy efficiency based on application duty cycles.

Can the MSP430F5253IZQER reliably interface with 5V logic levels from external sensors or communication modules without additional circuitry?: No, the MSP430F5253IZQER operates within a supply range of 1.8V to 3.6V, which means its I/O pins cannot tolerate 5V signals directly. Applying more than 3.6V to any GPIO pin risks damaging the ESD protection diodes and underlying transistor structures. To interface with 5V logic safely, use bidirectional level shifters such as dedicated ICs (e.g., TXB0108) or discrete MOSFET-based converters. Alternatively, select peripherals that support 3.3V or lower output swings. If the external module provides 5V-tolerant inputs (with clamping diodes), ensure the MSP430’s VCC is powered and that input voltage never exceeds VCC + 0.3V. For UART or I2C links, opt for open-drain configurations with pull-ups to shared mid-supply rails to avoid overvoltage stress.

What is the maximum sustained data transfer rate achievable through the SPI interface on the MSP430F5253IZQER, and how does it affect system throughput when communicating with flash memory or ADCs?: With a 25MHz master clock derived from the internal DCO, the MSP430F5253IZQER can drive its SPI peripheral at up to 25 Mbps in full-duplex mode. However, actual sustained throughput depends on bus arbitration, ISR overhead, and slave response times. For example, writing 256 bytes to an external serial flash via SPI typically takes about 100 microseconds, yielding a transfer rate near 2.5 MB/s. This is sufficient for most embedded logging or real-time data acquisition scenarios involving moderate sample rates (e.g., audio or environmental sensing). When chaining multiple slaves or using longer cables, signal integrity becomes critical; reduced slew rates or increased capacitance may necessitate clock division below 10 MHz. DMA support, available in this series, can offload CPU during bulk transfers, improving overall efficiency.

How does the built-in watchdog timer (WDT) in the MSP430F5253IZQER behave during brown-out events, and what recovery mechanism ensures system resilience?: The MSP430F5253IZQER includes a windowed watchdog timer (WDT_A) that operates independently of main system clocks. During a brown-out reset (BOR), triggered when VCC drops below ~2.2V, the device automatically resets and initializes all registers. The WDT_A continues running from a dedicated low-frequency oscillator (VLO), ensuring continued monitoring even if primary clocks fail. If software fails to clear the WDT within the programmed interval, a system reset occurs—preventing runaway code. However, during BOR, the WDT_A is not disabled by default, so designers must explicitly configure it after reset. Best practice involves disabling or reconfiguring the WDT in the startup code before enabling interrupts. This dual-layer protection enhances reliability in noisy power environments common in industrial or automotive edge applications.

Is it feasible to execute code from the internal 128KB Flash of the MSP430F5253IZQER while simultaneously performing erase/write operations via the FCTL3/FCTL4 registers, and what precautions apply?: Yes, the MSP430F5253IZQER supports background memory management, allowing read operations from any segment while erasing or programming another. However, executing code from a sector being erased will cause a bus fault unless that sector is temporarily excluded from execution via the MP/MC (Memory Protection/CPU Mode) bits. To avoid crashes, either relocate critical code to RAM or disable interrupts during erase cycles. Programming requires precise timing: each word write takes 5–10 μs depending on voltage, and sectors must be erased before reprogramming. The device uses Fowler-Nordheim tunneling, which introduces wear over time—typically rated for >10k cycles per sector. For field updates, implement a bootloader that validates firmware signatures and preserves calibration data in separate flash regions.

How should decoupling capacitors be sized and placed around the MSP430F5253IZQER in a high-density BGA layout to minimize noise and stabilize VDD?: Given the compact 80-BGA MICROSTAR JUNIOR (5x5) package, place 0.1 µF ceramic capacitors as close as possible to each VDD/VSS pair, ideally within 1 mm. Use X7R or X5R dielectrics for stable capacitance across temperature. Include a single 1–10 µF bulk capacitor near the power entry point to handle transient loads during flash writes or ADC conversions. High-speed switching currents from the 25MHz CPU and peripherals generate fast transients that local bypassing suppresses effectively. Avoid long traces to vias, as inductance defeats high-frequency filtering. Simulate PDN impedance using tools like ANSYS SIwave if available, targeting <0.1 Ω between 100 kHz and 100 MHz. Even with excellent layout, avoid sharing ground planes with noisy analog sections unless isolated by ferrite beads or split planes with careful stitching.

What role does the internal 10-channel 10-bit ADC play in real-world sensing applications using the MSP430F5253IZQER, and how accurate are its readings under varying supply conditions?: The integrated SAR ADC provides 10-bit resolution with ±1 LSB integral nonlinearity and differential linearity error <±1 LSB, suitable for most temperature, voltage, or resistive sensor measurements. Accuracy degrades slightly with supply ripple above 10 mV p-p due to reference coupling, but internal bandgap reference maintains ±1°C stability from -25°C to +85°C. Conversion time per channel is ~12 μs at 250 ksps, enabling multiplexed sampling of multiple inputs. For improved precision in battery-powered systems, enable ADC10SC only during conversion windows and disable otherwise to save power. Calibration routines can compensate for offset errors introduced by manufacturing variations. While not replacement for dedicated precision ADCs, it reduces BOM cost and board space in simple IoT endpoints measuring light, humidity, or battery state-of-charge.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5253IZQER

Product Attribute
Part Number	MSP430F5252IZQER	MSP430F5253IZQE	MSP430F5255IZQER	MSP430F5254IZQER
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Core Size	-	-	-	-
Number of I/O	-	-	-	-
Program Memory Size	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Speed	-	-	-	-
RAM Size	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
EEPROM Size	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Oscillator Type	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Program Memory Type	-	-	-	-
Connectivity	-	-	-	-
Series	-	-	-	-
Peripherals	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Data Converters	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Core Processor	-	-	-	-

MSP430F5253IZQER Datasheet PDF

Download MSP430F5253IZQER pdf datasheets and Texas Instruments documentation for MSP430F5253IZQER - Texas Instruments.

Datasheets: MSP430F525x.pdf MSP430x5xx,MSP430x6xx Family Guide.pdf
PCN Design/Specification: Mult Dev Datasheet Rev 17/Dec/2018.pdf CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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