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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5255IRGCR~~

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MSP430F5255IRGCR - Texas Instruments

Name: Texas Instruments MSP430F5255IRGCR
Brand: Texas Instruments
SKU: MSP430F5255IRGCR
Price: 3.647 USD
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: MSP430F5255IRGCR

Manufacturer: Texas Instruments

Allelco Part Number: 32D-MSP430F5255IRGCR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,557 pcs available, New & Original

Parts Description: IC MCU 16BIT 128KB FLASH 64VQFN

Package: 64-VQFN (9x9)

Data sheet: MSP430F5255IRGC.pdf

Datasheets
MSP430x5xx,MSP430x6xx Family Guide.pdf

PCN Design/Specification
CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf MSP430F525 12/Jan/2021.pdf

PCN Assembly/Origin
2.73KHz.pdf

Errata
MSP430F5255 Errata.pdf

RoHs Status: ROHS3 Compliant

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Specifications

MSP430F5255IRGCR Tech Specifications
Texas Instruments - MSP430F5255IRGCR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5255IRGCR

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	64-VQFN (9x9)
Speed	25MHz
Series	MSP430F5xx
RAM Size	32K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	64-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	53
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 10x10b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART
Base Product Number	MSP430F5255

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Parts Introduction

MSP430F5255IRGCR (1)

Manufacturer Part Number

MSP430F5255IRGCR

Manufacturer

Texas Instruments

Introduction

The MSP430F5255IRGCR is a high-performance, ultra-low-power 16-bit microcontroller from Texas Instruments' MSP430 family. It is designed for a wide range of embedded applications, offering a rich set of integrated peripherals and advanced power management features.

Product Features and Performance

16-bit MSP430 CPUXV2 core with a maximum operating frequency of 25MHz

128KB of FLASH program memory and 32KB of RAM

Integrated peripherals include I2C, IrDA, LIN bus, SCI, SPI, UART/USART, and more

Advanced power management capabilities with features like brown-out detect/reset and power-on reset

10-channel 10-bit ADC

Operating voltage range of 1.8V to 3.6V

Operating temperature range of -40°C to 85°C

Product Advantages

Ultra-low-power consumption, making it ideal for battery-powered applications

Extensive peripheral set for versatile connectivity and control

Robust power management features for reliable operation

Flexible memory configuration to accommodate various application needs

Key Reasons to Choose This Product

Exceptional performance and energy efficiency for your embedded system

Broad range of integrated peripherals to simplify design

Reliable and long-lasting operation in challenging environments

Ease of integration and scalability for your project

Quality and Safety Features

Manufactured using high-quality processes to ensure reliability

Robust overcurrent and overvoltage protection mechanisms

Compliance with industry standards for safety and EMC

Compatibility

The MSP430F5255IRGCR is compatible with other members of the MSP430F5xx series, allowing for easy migration and scalability within the product family.

Application Areas

Industrial automation and control

Portable medical devices

Wireless sensor networks

Building automation and security systems

Handheld and portable electronics

Product Lifecycle

The MSP430F5255IRGCR is an active product, and our website's sales team continues to offer it as part of their MSP430 microcontroller portfolio. There are several equivalent or alternative models available within the MSP430F5xx series, which may offer different feature sets, performance characteristics, or packaging options to suit your specific application requirements. If you need further assistance, please contact our website's sales team.

Frequently Asked Questions(FAQ)

What are the key differences between the MSP430F5255IRGCR and other MSP430F5xx series microcontrollers in terms of program memory and I/O availability for industrial control applications?: The MSP430F5255IRGCR distinguishes itself within the MSP430F5xx family by offering 128KB of flash memory, which is among the highest in the series, making it suitable for complex firmware with extensive peripheral drivers and communication stacks. It provides 53 general-purpose I/O pins, supporting robust external interface design. In contrast, lower-memory variants like the MSP430F5235 offer only 64KB of flash and 48 I/Os. This expanded memory and pin count make the MSP430F5255IRGCR more appropriate when implementing multi-protocol communication (I2C, SPI, UART, LIN, IrDA) and advanced power management features simultaneously in space-constrained industrial systems.

How does the MSP430F5255IRGCR handle voltage regulation and brown-out detection, and what implications does this have for battery-powered embedded designs?: The MSP430F5255IRGCR operates across a supply voltage range of 1.8V to 3.6V, enabling efficient operation in low-power applications such as battery-backed sensors or portable instrumentation. Its integrated brown-out reset (BOR) circuitry monitors Vcc and triggers a system reset if the voltage falls below a programmable threshold, typically around 1.8V–2.7V depending on configuration. This feature enhances reliability in systems where undervoltage conditions could corrupt flash or cause undefined behavior. When paired with the device’s ultra-low active current consumption (~100µA/MHz), these features support extended operation from coin-cell batteries in continuous monitoring scenarios.

Can the MSP430F5255IRGCR be used in automotive environments, and what certifications or environmental limits apply?: No, the MSP430F5255IRGCR is not designed for automotive-grade operation. Its operating temperature range is limited to -40°C to +85°C, which falls short of AEC-Q100 Grade 2 requirements that extend up to +105°C. While it may function in some non-critical automotive sub-systems with careful thermal management, it lacks the reliability validation and stress testing required for safety-relevant applications. Engineers seeking automotive suitability should consider TI’s more robust families like the TMS570 or Hercules series, which meet full automotive qualifications.

What trade-offs exist when selecting the MSP430F5255IRGCR over higher-performance ARM Cortex-M0+ devices for motor control applications?: The MSP430F5255IRGCR offers superior power efficiency compared to many ARM Cortex-M0+ MCUs at similar clock speeds, consuming significantly less active and standby current. However, its 25MHz CPUXV2 core and lack of hardware floating-point unit limit computational throughput for high-resolution motor control algorithms requiring real-time matrix operations or field-oriented control (FOC). For applications prioritizing energy harvesting or battery life—such as wireless sensor nodes driving brushed DC motors—the MSP430F5255IRGCR’s balance of peripherals, wake-up times, and power scaling often outweighs raw performance. But for BLDC or PMSM drives requiring fast ADC sampling rates and complex math, a Cortex-M0+ with FPU may be preferable despite higher quiescent current.

How does the internal oscillator configuration affect timing accuracy in the MSP430F5255IRGCR when using low-cost crystal references?: The MSP430F5255IRGCR includes a digitally controlled oscillator (DCO) capable of generating frequencies up to 25MHz, but its initial calibration depends on factory-trimmed settings. Without an external crystal, frequency drift can exceed ±1% over temperature and voltage variations, impacting UART baud rate accuracy or PWM timing consistency. When precise timing is required—for example, in LIN bus synchronization or data logging with time stamps—an external 32.768kHz crystal or MEMS resonator should be used with the device’s built-in low-frequency oscillator (LFXT) to improve long-term stability to ±20 ppm or better.

Is it feasible to use the MSP430F5255IRGCR in a system requiring concurrent operation of multiple communication protocols such as SPI, I2C, and UART?: Yes, the MSP430F5255IRGCR supports simultaneous operation of multiple communication interfaces through its modular architecture. Each USCI module can independently configure as SPI, I2C, or UART/USART, and the DMA controller allows background data transfer without CPU intervention. For instance, one USCI pair can manage an SPI-connected DAC while another handles I2C sensor traffic via UART. Care must be taken to avoid shared pin conflicts and ensure sufficient interrupt latency budget, but the 53 I/O count provides adequate flexibility for most industrial automation setups where isolated signaling domains are maintained.

How does the flash memory endurance of the MSP430F5255IRGCR influence firmware update strategies in field-deployed devices?: The MSP430F5255IRGCR utilizes standard NOR-type flash with typical erase/write cycles of 10,000 to 100,000 operations per sector, depending on programming algorithm and process node. This constrains how frequently firmware can be updated in the field—frequent over-the-air (OTA) updates may degrade memory integrity over time. To mitigate this, firmware should implement wear-leveling logic or reserve infrequently written sectors for new code. Additionally, bootloader-based update mechanisms must include CRC checks and rollback capabilities to prevent bricking during failed writes, especially critical given the 128KB total size and potential for partial-page programming errors.

What considerations apply when routing the exposed pad on the 64-VQFN (9x9) package of the MSP430F5255IRGCR for thermal dissipation and signal integrity?: The thermal pad under the 64-VQFN package must be connected to ground and thermally tied to a solid copper plane on the PCB to dissipate heat from internal regulators and reduce junction temperatures during sustained operation. Poor thermal vias can elevate operating temperatures by 10–15°C, potentially reducing reliability margins. Signal traces routed near high-speed lines (e.g., SPI at 10 Mbps) should maintain impedance control and minimize stub lengths to avoid reflections. Given the dense pinout with adjacent analog (ADC inputs) and digital lines, careful layer stacking and guard traces help prevent crosstalk, particularly between the 10-channel 10-bit SAR ADC and nearby GPIO.

How does the MSP430F5255IRGCR compare to the MSP430FR5969 in terms of non-volatile memory architecture and power loss resilience?: Unlike the MSP430FR5969, which uses ferroelectric RAM (FRAM) for both program and data storage—enabling unlimited write cycles and instant writes at near-zero power—the MSP430F5255IRGCR relies on traditional flash memory. Flash requires block erasure before rewriting, increasing write latency and power consumption during updates. However, the MSP430F5255IRGCR compensates with deeper sleep modes and faster wake-up from LPM3.5, making it preferable in applications where data retention after power loss isn’t critical but ultra-low leakage current matters more than write endurance.

What role do the watchdog timer and power-on reset (POR) play in ensuring reliable startup sequences in the MSP430F5255IRGCR-based systems?: The MSP430F5255IRGCR integrates both a watchdog timer (WDT+) and power-on reset (POR) circuit to safeguard against software hangs and unstable power transitions. The WDT must be periodically serviced during normal operation; failure results in a system reset. During startup, the POR ensures the CPU begins execution only after stable Vcc reaches above the BOR threshold, preventing erratic behavior from brownouts. These mechanisms are essential in battery-powered or mains-failure-prone environments where transient voltage dips could leave the microcontroller in an undefined state without proper initialization safeguards.

Can the MSP430F5255IRGCR drive capacitive loads directly from its GPIO pins without external buffering?: The MSP430F5255IRGCR’s GPIO pins are designed for digital switching and cannot reliably drive large capacitive loads (e.g., >10pF) directly due to limited output drive strength (~20–30 mA sink/source). Driving LEDs, small LCD segments, or long cables introduces propagation delay and risks violating noise margins. External buffers or drivers (e.g., 74LVC07A) are recommended for loads exceeding 50pF or when rise/fall times must remain under 100ns. This limitation is consistent across all MSP430F5xx devices and must be accounted for in timing-sensitive interface designs such as touch panels or high-speed communication links.

How does the 10-bit ADC resolution in the MSP430F5255IRGCR perform in noisy industrial environments, and what mitigation techniques improve effective bit precision?: The MSP430F5255IRGCR’s 10-bit SAR ADC achieves nominal 10-bit linearity but exhibits reduced effective resolution in electrically noisy settings due to supply ripple, ground bounce, and electromagnetic interference. In practice, effective number of bits (ENOB) often drops to 8–9 bits under industrial EMI conditions. Mitigation strategies include using shielded cables, placing decoupling capacitors (<100nF) close to Vcc/GND pins, enabling internal sample-and-hold averaging, and selecting channels sequentially rather than burst sampling. Additionally, oversampling and digital filtering post-conversion can enhance perceived resolution for slow-changing signals like temperature or pressure.

What constraints apply when using the DMA controller with the MSP430F5255IRGCR for transferring ADC results to RAM without CPU involvement?: The MSP430F5255IRGCR supports basic DMA transfers initiated by peripheral events such as ADC conversion complete or timer overflow. However, its DMA engine is relatively simple compared to modern ARM implementations and lacks scatter-gather capabilities. Transfers are limited to single blocks of memory with fixed source/destination addresses. Engineers must ensure that destination buffers do not overlap with active code regions and that interrupts remain disabled during critical sections to prevent corruption. Maximum transfer rates are constrained by the 25MHz system clock and peripheral bus arbitration overhead, limiting real-time throughput for high-speed sensor arrays.

Why might the MSP430F5255IRGCR require external level shifters when interfacing with 5V legacy peripherals?: Although the MSP430F5255IRGCR accepts inputs down to 1.8V, its GPIO high-level input threshold is approximately Vcc × 0.7. At 3.6V supply, this corresponds to ~2.5V minimum recognized high input. If communicating with 5V TTL logic (e.g., RS-232 transceivers or older sensors), direct connection risks exceeding absolute maximum ratings unless Vcc is raised to 5V—which violates the 3.6V max specification. Therefore, bidirectional level translators or open-drain configurations with pull-ups to 5V are necessary to safely interface legacy components while protecting the MSP430F5255IRGCR.

How does the Moisture Sensitivity Level (MSL) rating of 3 for the MSP430F5255IRGCR impact assembly and shelf life in manufacturing workflows?: With an MSL rating of 3 and floor life of 168 hours, the MSP430F5255IRGCR must be assembled within 7 days after opening moisture-sensitive materials (MSD) packaging if stored at <60°C/60% RH. Exceeding this window risks popcorning during reflow soldering due to moisture expansion. Manufacturers must follow JEDEC J-STD-033 guidelines, including baking before reflow if exposure exceeds thresholds. Proper handling documentation and storage in dry cabinets are essential to maintain reliability, especially in high-volume production where traceability and process control become critical.

What are the limitations of the IrDA transceiver functionality in the MSP430F5255IRGCR when used for short-range optical communication?: The MSP430F5255IRGCR includes an integrated IrDA physical layer transceiver compliant with SIR (Slow IR) standards up to 115.2 kbps. However, it lacks support for MIR or FIR modes, limiting data rates to low-speed applications such as remote control emulation or proximity-based handshaking. Range is typically limited to 10–20 cm under ambient light conditions, and performance degrades significantly with misalignment or obstructions. For longer-range or higher-data-rate infrared links, external IrDA modules are required, adding component count and power overhead.

How does the absence of EEPROM in the MSP430F5255IRGCR affect non-volatile data storage strategies in calibration-heavy systems?: Since the MSP430F5255IRGCR has no dedicated EEPROM, persistent data such as calibration coefficients, serial numbers, or user settings must be stored in flash memory sectors. This approach incurs write penalties due to flash erase-before-write nature and reduces overall write endurance. A common workaround involves reserving a flash page for data storage, copying it to RAM during startup, modifying in-place, and periodically relocating valid data to fresh sectors—akin to wear-leveling. Alternatively, external serial EEPROMs (e.g., 24LCxx) can offload non-volatile storage, though they consume additional pins and introduce protocol complexity.

What design precautions are necessary when using the MSP430F5255IRGCR in systems powered by solar energy harvesters with highly variable input voltages?: Solar-powered systems often exhibit fluctuating Vcc due to shading or cloud cover, which can trigger brown-out resets or cause unstable operation near the 1.8V threshold. The MSP430F5255IRGCR’s BOR must be configured to the lowest reliable level (e.g., 1.8V) to avoid nuisance resets, but this reduces noise immunity. Adding bulk capacitance (>10µF) and TVS diodes helps stabilize supply rails. Additionally, firmware should enter low-power modes aggressively during periods of insufficient illumination and use brown-out interrupt service routines (BOR ISR) to log state changes rather than blindly resetting. Careful layout minimizes dropout during peak load transients.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5255IRGCR

Product Attribute
Part Number	MSP430F5253IRGCR	MSP430F5255IRGCT	MSP430F5254IRGCR	MSP430F5257IRGCT
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Program Memory Type	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of I/O	-	-	-	-
RAM Size	-	-	-	-
EEPROM Size	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-
Oscillator Type	-	-	-	-
Core Size	-	-	-	-
Connectivity	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Speed	-	-	-	-
Program Memory Size	-	-	-	-
Core Processor	-	-	-	-
Peripherals	-	-	-	-
Data Converters	-	-	-	-

MSP430F5255IRGCR Datasheet PDF

Download MSP430F5255IRGCR pdf datasheets and Texas Instruments documentation for MSP430F5255IRGCR - Texas Instruments.

Datasheets: MSP430x5xx,MSP430x6xx Family Guide.pdf
PCN Design/Specification: CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf MSP430F525 12/Jan/2021.pdf
PCN Assembly/Origin: 2.73KHz.pdf
Errata: MSP430F5255 Errata.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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