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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5254IZQE~~

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MSP430F5254IZQE - Texas Instruments

Name: Texas Instruments MSP430F5254IZQE
Brand: Texas Instruments
SKU: MSP430F5254IZQE
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: MSP430F5254IZQE

Manufacturer: Texas Instruments

Allelco Part Number: 98D-MSP430F5254IZQE

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 15,683 pcs available, New & Original

Parts Description: IC MCU 16BIT 128KB FLASH 80BGA

Package: 80-BGA MICROSTAR JUNIOR (5x5)

Data sheet: MSP430F5254IZQE.pdf

Datasheets
MSP430x5xx,MSP430x6xx Family Guide.pdf

PCN Packaging
Mult Devices New Tray 18/Dec/2017.pdf

PCN Design/Specification
CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf MSP430F525 12/Jan/2021.pdf

PCN Obsolescence/ EOL
Mult Dev EOL 07/Jan/2020.pdf

RoHs Status: ROHS3 Compliant

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In stock: 15683

Specifications

MSP430F5254IZQE Tech Specifications
Texas Instruments - MSP430F5254IZQE technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5254IZQE

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	80-BGA MICROSTAR JUNIOR (5x5)
Speed	25MHz
Series	MSP430F5xx
RAM Size	32K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	80-VFBGA
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	53
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	-
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART
Base Product Number	MSP430F5254

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the MSP430F5254IZQE compare to other MSP430F5xx series microcontrollers in terms of program memory capacity and peripheral integration for industrial sensor monitoring applications?: The MSP430F5254IZQE offers 128KB of flash memory, which provides sufficient code storage for complex sensor data processing algorithms and state machine implementations commonly required in industrial monitoring systems. When compared to other members like the MSP430F5255IRGCR, this device maintains the same core architecture and voltage range while offering comparable memory density. However, the F5254 variant typically includes a slightly lower number of I/O pins (53 vs. 63), which can influence board layout decisions when interfacing multiple analog sensors or communication interfaces.

What are the key thermal and power considerations when integrating the MSP430F5254IZQE into battery-powered edge devices operating at extended temperature ranges?: Operating across -40°C to 85°C requires careful attention to supply current characteristics, especially during wake-from-sleep transitions. The MSP430F5254IZQE’s low active-mode current draw—typically under 300 µA/MHz at 3V—supports multi-year battery life in periodic sensing scenarios. However, leakage currents increase significantly near the upper temperature limit, so designs must account for quiescent current in deep sleep modes exceeding 1 µA at 85°C to avoid premature battery depletion.

In what scenarios would the MSP430F5254IZQE be preferable over ARM Cortex-M0+ alternatives despite its older architecture?: For ultra-low-power embedded tasks with strict real-time constraints and minimal software stack overhead, the MSP430F5254IZQE remains advantageous due to its deterministic interrupt response times and integrated peripherals such as DMA and hardware PWM. Unlike many ARM-based solutions requiring external crystal oscillators and additional power management ICs, this microcontroller supports internal clocking and operates efficiently from a single 1.8–3.6V rail, simplifying system design for space-constrained or cost-sensitive applications like portable medical monitors or wireless environmental sensors.

How does the package choice between BGA and QFP affect PCB design complexity when using the MSP430F5254IZQE?: The 80-BGA MICROSTAR JUNIOR (5x5) package used by the MSP430F5254IZQE enables compact form factors ideal for densely populated PCBs but demands advanced PCB assembly capabilities due to fine-pitch solder balls and potential rework challenges. Designers must implement proper via-in-pad or escape routing strategies and consider testability trade-offs versus larger QFP variants that allow hand soldering or probing during development.

Can the MSP430F5254IZQE reliably operate with only internal oscillator sources, and what accuracy implications should designers expect?: Yes, the MSP430F5254IZQE can function entirely on its internal DCO (Digitally Controlled Oscillator), enabling operation without external crystals or resonators. At 25MHz calibration, typical frequency tolerance is ±1%, sufficient for most UART and SPI communications. However, applications requiring precise timing—such as high-speed data logging or time-stamping—should calibrate the internal oscillator against an external reference periodically to maintain synchronization accuracy within ±0.5% over full temperature range.

What impact does the 32KB RAM configuration have on real-time data buffering capabilities for the MSP430F5254IZQE?: With 32KB of RAM, the MSP430F5254IZQE supports moderate-sized data buffers suitable for streaming sensor readings or implementing finite state machines without frequent flash writes. For example, capturing one minute of 10-bit ADC samples at 1ksps consumes approximately 7.5KB of RAM, leaving ample headroom for protocol stacks and temporary computation variables. However, continuous high-bandwidth acquisition may require external SRAM or compression techniques to prevent buffer overflow.

Are there any known limitations in using the MSP430F5254IZQE for CAN bus communication compared to dedicated automotive MCUs?: The MSP430F5254IZQE lacks native CAN support; instead, it relies on UART/USART with bit-banging or software-based protocols. While feasible for low-to-moderate baud rates (up to 1Mbps in some configurations), this approach introduces jitter and CPU overhead unsuitable for robust automotive environments. Designs targeting ISO 11898 compliance should consider alternative TI devices like the MSP430FRxx series with built-in CAN modules or external transceivers paired with more capable MCUs.

How does the MSP430F5254IZQE handle brownout detection thresholds during startup from low-voltage conditions?: The MSP430F5254IZQE features programmable brownout reset circuitry with selectable thresholds typically at 2.7V or 1.8V, depending on supply voltage range. During power-up sequences below the threshold, the device resets automatically to prevent corrupted memory states. Designers must ensure power rails stabilize within 5ms after VDD reaches 1.8V to meet startup timing requirements specified in the family reference manual, particularly in systems powered by capacitors or solar cells.

What role does the integrated watchdog timer play in fail-safe operation for battery-backed metering devices using the MSP430F5254IZQE?: The windowed watchdog timer prevents runaway code execution by requiring periodic servicing within a defined time window. In metering applications where firmware hangs could disrupt billing cycles, this feature ensures automatic system reset if tasks exceed expected durations. Proper implementation involves configuring the WDT interval to align with task deadlines and disabling it during critical sections using the WDTTAP register, balancing reliability with responsiveness.

Is direct substitution possible between the MSP430F5254IZQE and its listed substitute MSP430F5255IRGCR in existing hardware designs?: Partial substitution is possible since both share identical core specifications, memory sizes, and pin-compatible packages. However, the F5255 variant includes additional peripherals such as more GPIOs and enhanced DMA channels, which may affect signal routing and power budget calculations. Designers should verify that all required functions map correctly and update linker scripts if vector table offsets differ between revisions.

What precautions should be taken during programming and debugging of the MSP430F5254IZQE to avoid unintentional flash corruption?: To preserve flash integrity, avoid interrupting erase/write cycles via power loss or JTAG disconnects. Use the BSL (Bootstrap Loader) only through secure interfaces, and ensure VDD remains above 2.7V during flash operations. Additionally, enable the flash protection fuse only after completing development, as locked devices cannot be reprogrammed without specialized equipment.

How does the operating frequency of 25MHz influence real-time performance when executing C code with tight loops on the MSP430F5254IZQE?: At 25MHz, each instruction cycle averages 40ns, allowing execution of simple arithmetic operations in single cycles. Complex functions involving floating-point math or large arrays benefit less from raw speed due to pipeline stalls and memory latency, yet the deterministic nature ensures predictable worst-case execution times essential for real-time control loops. Profiling with tools like Code Composer Studio helps identify bottlenecks not evident from datasheet figures alone.

Can the MSP430F5254IZQE support multiple communication protocols simultaneously without significant resource contention?: Yes, thanks to its rich set of peripherals—including dual USARTs, SPI, I2C, and IrDA—the MSP430F5254IZQE can concurrently manage sensor readout via I2C, transmit data over UART to a host, and synchronize timing using SPI-driven peripherals. However, shared buses like I2C require careful arbitration logic, and simultaneous use of high-speed peripherals may saturate the 16-bit DMA bandwidth, necessitating priority assignment in interrupt handlers.

What is the significance of the MSL 3 classification for the MSP430F5254IZQE in manufacturing and handling workflows?: Classified as MSL 3 (168-hour floor life), the MSP430F5254IZQE allows three days of exposure to ambient humidity before requiring dry packaging or baking. This reflects its moisture-sensitive lead-free solder joints, particularly critical in high-volume production environments. Manufacturers must track reflow cycles and storage conditions to prevent popcorn cracking, especially in lead-free soldering profiles exceeding 245°C peak temperature.

How does the absence of onboard EEPROM in the MSP430F5254IZQE affect non-volatile configuration storage strategies?: Without dedicated EEPROM, configuration parameters such as calibration coefficients or network IDs must reside in flash, increasing wear concerns due to repeated writes. Designers often partition flash into logical blocks: one section for application code and another reserved for configuration data, using wear-leveling algorithms or write-once registers mapped to flash regions. Alternatively, external serial EEPROMs or FRAM modules provide higher endurance but add component count and cost.

What design considerations apply when interfacing the MSP430F5254IZQE with capacitive touch sensors requiring high-impedance measurement?: Capacitive sensing demands low-noise analog front-ends and stable reference voltages. The MSP430F5254IZQE’s ADC supports up to 12-bit resolution and can drive external muxes for multi-sensor inputs. However, input leakage currents near 10pA at room temperature necessitate guard rings and careful PCB layout to minimize parasitic capacitance, especially in humid environments where surface contamination increases leakage paths.

Does the MSP430F5254IZQE support dynamic voltage and frequency scaling (DVFS) to optimize power consumption?: Not natively. While the device operates efficiently across 1.8–3.6V, DVFS requires external regulators and firmware intervention to switch clocks and voltages dynamically. Most MSP430 designs fix the clock source and supply voltage at boot, trading flexibility for simplicity. Implementing DVFS would demand additional hardware and complex power sequencing, making it uncommon in typical MSP430 deployments.

How reliable is the internal temperature sensor integrated into the MSP430F5254IZQE for thermal monitoring applications?: The MSP430F5254IZQE includes a bandgap-based temperature sensor with typical accuracy of ±3°C over the industrial range (-40°C to 85°C). It provides coarse monitoring suitable for triggering throttling events rather than precise thermal mapping. For higher precision, external sensors like the TMP117 offer better linearity and calibration options, but the internal sensor suffices in basic overtemperature protection schemes.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5254IZQE

Product Attribute
Part Number	MSP430F5254IZQER	MSP430F5252IZQE	MSP430F5256IZQE	MSP430F5255IZQE
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Connectivity	-	-	-	-
Core Size	-	-	-	-
Speed	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Peripherals	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Series	-	-	-	-
Data Converters	-	-	-	-
Program Memory Type	-	-	-	-
EEPROM Size	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Oscillator Type	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
RAM Size	-	-	-	-
Program Memory Size	-	-	-	-
Core Processor	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of I/O	-	-	-	-

MSP430F5254IZQE Datasheet PDF

Download MSP430F5254IZQE pdf datasheets and Texas Instruments documentation for MSP430F5254IZQE - Texas Instruments.

Datasheets: MSP430x5xx,MSP430x6xx Family Guide.pdf
PCN Packaging: Mult Devices New Tray 18/Dec/2017.pdf
PCN Design/Specification: CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf MSP430F525 12/Jan/2021.pdf
PCN Obsolescence/ EOL: Mult Dev EOL 07/Jan/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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