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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5254IRGCR~~

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MSP430F5254IRGCR - Texas Instruments

Name: Texas Instruments MSP430F5254IRGCR
Brand: Texas Instruments
SKU: MSP430F5254IRGCR
Price: 4.581 USD
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: MSP430F5254IRGCR

Manufacturer: Texas Instruments

Allelco Part Number: 32D-MSP430F5254IRGCR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,316 pcs available, New & Original

Parts Description: IC MCU 16BIT 128KB FLASH 64VQFN

Package: 64-VQFN (9x9)

Data sheet: MSP430F5254IRGC.pdf

Datasheets
MSP430x5xx,MSP430x6xx Family Guide.pdf

PCN Design/Specification
CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf MSP430F525 12/Jan/2021.pdf

RoHs Status: ROHS3 Compliant

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Specifications

MSP430F5254IRGCR Tech Specifications
Texas Instruments - MSP430F5254IRGCR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5254IRGCR

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	64-VQFN (9x9)
Speed	25MHz
Series	MSP430F5xx
RAM Size	32K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	64-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	53
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	-
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART
Base Product Number	MSP430F5254

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Parts Introduction

MSP430F5254IRGCR (1)

Manufacturer Part Number

MSP430F5254IRGCR

Manufacturer

Texas Instruments

Introduction

MSP430F5254IRGCR is a 16-bit microcontroller designed for embedded applications requiring low power consumption and high performance.

Product Features and Performance

16-Bit MSP430 CPUXV2 Core

25MHz Clock Speed

Integrated I2C, IrDA, LINbus, SCI, SPI, UART/USART

Brown-out Detect/Reset, DMA, POR, PWM, WDT peripherals

53 I/O Pins

128KB Flash Program Memory

32KB RAM

Internal Oscillator

Surface Mount 64-VQFN Package

Product Advantages

Low Power Consumption for Battery-Powered Devices

Ideal for Real-Time Control Applications

Able to Manage Multiple Tasks with Integrated Peripherals

Flexible Power Management System

Robust Serial Communication Options

MSP430F5254IRGCR (2)

Key Technical Parameters

Core Processor: MSP430 CPUXV2

Core Size: 16-Bit

Speed: 25MHz

Number of I/O: 53

Program Memory Size: 128KB (128K x 8)

RAM Size: 32K x 8

Voltage Supply: 1.8V to 3.6V

Operating Temperature: -40°C to 85°C

Quality and Safety Features

Built-in Brown-out Reset for Reliable Operation

Watchdog Timer to Prevent System Lockup

Design Tested for Industrial Temperature Ranges

Compatibility

Compatible with Many MSP430 Development Tools and Software

Ease of Migration to Other MSP430F5xx Family Products

Application Areas

Consumer Electronics

Industrial Control Systems

Automotive

Wireless Connectivity Modules

Power Management Solutions

Product Lifecycle

Active Product

Long-Term Availability

Supported by Texas Instruments for Future Designs

Several Key Reasons to Choose This Product

Ultra-Low Power Operation Extends Battery Life

High Memory Allocation Enables Complex Applications

Broad Range of Connectivity for Versatile Communication

Robust Design Suitable for Tough Industrial Environments

Comprehensive Development Support from Texas Instruments

Frequently Asked Questions(FAQ)

How does the MSP430F5254IRGCR’s power consumption compare to earlier MSP430 generations when operating at 25 MHz with typical peripheral loads?: The MSP430F5254IRGCR achieves significantly lower active-mode current than earlier MSP430 families due to its advanced CPUXV2 core and clock gating enhancements. At 25 MHz and 3.3 V, it draws approximately 8–10 mA in full-speed execution with moderate I/O activity, compared to 12–15 mA in the original MSP430G2xx series under similar conditions. In LPM3 mode, the device consumes around 0.5 µA, enabling multi-year battery life in energy-harvesting applications—a key improvement over legacy variants that typically required external low-power oscillators or incurred higher leakage.

What are the thermal implications of running the MSP430F5254IRGCR continuously at 25 MHz in a sealed enclosure without airflow?: Continuous operation at 25 MHz generates about 30–40 mW of power dissipation, resulting in a junction-to-ambient temperature rise of roughly 15–20°C above ambient under natural convection in a standard 64-VQFN package. In a sealed environment with no airflow, this can elevate the die temperature to 70–90°C at 25°C ambient, potentially triggering thermal throttling or reducing reliability margins. Engineers should account for this in enclosure design, especially near other heat-generating components.

Can the MSP430F5254IRGCR interface directly with 5 V logic signals from sensors or communication modules without level shifting?: No, the MSP430F5254IRGCR operates within a 1.8 V to 3.6 V supply range, so all GPIO pins are not 5 V tolerant. Applying 5 V directly to any input pin may exceed the absolute maximum rating and cause permanent damage. For interfacing with 5 V systems, use dedicated voltage translators such as the TI TXB0108 or resistive divider networks with clamping diodes, ensuring signal levels remain within the safe input range even during transient overshoot.

What is the impact on flash endurance when using the MSP430F5254IRGCR for frequent firmware updates in an industrial monitoring application?: The MSP430F5254IRGCR features robust 100,000 write/erase cycles per flash sector, which exceeds typical requirements for field-upgradeable firmware. However, if sectors are rewritten daily, each sector will degrade after approximately 270 years—well beyond most product lifecycles. To optimize longevity, implement wear-leveling logic that distributes writes across multiple sectors rather than repeatedly updating the same block, thereby extending usable lifespan beyond specification limits.

How does the internal oscillator accuracy of the MSP430F5254IRGCR affect LIN bus communication timing in automotive environments?: The integrated DCO (Digitally Controlled Oscillator) provides ±2% frequency accuracy at room temperature but can drift up to ±5% over temperature and voltage. This variation may push LIN frame timings outside tolerance windows defined by the LIN protocol (e.g., 20 kbps requires ±2%). While basic LIN communication might still function, stricter timing requirements or longer bus lengths could lead to synchronization errors. Using an external 16 MHz crystal improves accuracy to ±20 ppm, making it preferable for reliable automotive-grade LIN nodes.

Is it possible to use the MSP430F5254IRGCR’s DMA controller to offload UART transmission without CPU intervention?: Yes, the MSP430F5254IRGCR supports autonomous DMA transfers between memory and peripherals, including UART transmit buffers. Configure the DMA channel to trigger on UART TX ready flags and transfer data from a RAM buffer directly to the UART data register. This eliminates CPU involvement during bulk transmissions, freeing up cycles for sensor processing or other tasks—critical in real-time embedded systems where deterministic response times are essential.

What considerations apply when selecting decoupling capacitors for the MSP430F5254IRGCR in a space-constrained PCB layout?: Due to its high pin count (64 VQFN), effective decoupling is critical near each VCC/GND pair. Use 100 nF X7R/X5R ceramic capacitors placed within 2 mm of the device, paired with a single 1–10 µF bulk capacitor on the main supply line. Avoid large-value tantalum capacitors due to ESL limitations; instead, use multiple smaller ceramics in parallel. In compact designs, place decoupling caps on both top and bottom layers connected via vias close to the pads to minimize loop inductance and suppress high-frequency noise.

How does the watchdog timer configuration affect system robustness in battery-powered devices using the MSP430F5254IRGCR?: The MSP430F5254IRGCR includes a windowed watchdog timer (WDT) that prevents accidental resets if software fails to service it within a specified window. Properly configured, it ensures recovery from hangs without manual reset. However, incorrect setup—such as setting a very narrow window—can cause false resets during interrupt-heavy periods. In low-power modes like LPM3, the WDT continues running from the ACLK source (typically 32 kHz crystal), consuming minimal current while maintaining fault detection capability.

Can the MSP430F5254IRGCR support simultaneous SPI master and I2C operations without conflict?: Yes, the MSP430F5254IRGCR has independent USCI (Universal Serial Communication Interface) modules—USCI_Ax and USCI_Bx—that can operate concurrently as either SPI or I2C depending on configuration. For example, USCI_A0 can be set to SPI master while USCI_B0 runs as I2C slave, enabling bidirectional communication with different protocols simultaneously. Care must be taken to manage shared resources like GPIO assignments and interrupt priorities to avoid race conditions or bus contention.

What is the expected start-up time from deep sleep mode (LPM3) using the internal 32 kHz oscillator on the MSP430F5254IRGCR?: When waking from LPM3 using the ACLK sourced from the internal 32 kHz RC oscillator, the MSP430F5254IRGCR takes approximately 1.5 ms to stabilize and begin normal instruction execution. This delay includes oscillator stabilization and PLL lock time if switching to MCLK/DCO afterward. If precise wake-up timing matters, consider pre-calibrating the internal oscillator or using an external crystal for faster and more stable ACLK reference.

How does the MSP430F5254IRGCR handle brown-out detection during rapid voltage transitions in solar-powered IoT devices?: The MSP430F5254IRGCR features a programmable brown-out reset (BOR) circuit that monitors VCC and triggers a reset if voltage drops below a user-defined threshold (ranging from ~1.8 V to ~2.7 V). During rapid load changes—such as when a radio module powers up—the BOR prevents erratic behavior by holding reset until VCC recovers above the threshold. Setting the BOR level slightly above the minimum operating voltage (e.g., 2.0 V) balances stability and responsiveness in variable-power environments.

What role does the PWM peripheral play in motor control applications using the MSP430F5254IRGCR?: The MSP430F5254IRGCR provides up to six enhanced PWM channels capable of generating synchronized waveforms with adjustable duty cycles and frequencies up to 25 MHz. These are ideal for driving brushed DC motors via H-bridges, controlling LED brightness, or managing power converters. Combined with capture/compare units, the peripherals enable closed-loop feedback (e.g., encoder input), allowing precise speed regulation and position control without requiring additional microcontrollers.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5254IRGCR

Product Attribute
Part Number	MSP430F5254IRGCT	MSP430F5255IRGCR	MSP430F5253IRGCR	MSP430F5255IRGCT
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Data Converters	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Peripherals	-	-	-	-
Connectivity	-	-	-	-
Core Size	-	-	-	-
Number of I/O	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Oscillator Type	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Program Memory Size	-	-	-	-
EEPROM Size	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
RAM Size	-	-	-	-
Program Memory Type	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Speed	-	-	-	-
Core Processor	-	-	-	-
Series	-	-	-	-

MSP430F5254IRGCR Datasheet PDF

Download MSP430F5254IRGCR pdf datasheets and Texas Instruments documentation for MSP430F5254IRGCR - Texas Instruments.

Datasheets: MSP430x5xx,MSP430x6xx Family Guide.pdf
PCN Design/Specification: CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf MSP430F525 12/Jan/2021.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
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1.00kg-2.00kg	USD$40.00 - USD$80.00
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