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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMSP430F6635IPZ
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MSP430F6635IPZ - Texas Instruments

Manufacturer Part Number
MSP430F6635IPZ
Manufacturer
Texas Instruments
Allelco Part Number
98D-MSP430F6635IPZ
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
39,794 pcs available, New & Original
Parts Description
IC MCU 16BIT 256KB FLASH 100LQFP
Package
100-LQFP (14x14)
Data sheet
MSP430F6635IPZ.pdf

PCN Assembly/Origin

Mult Devices 23/Feb/2018.pdf

HTML Datasheet

MSP430F663x Datasheet.pdf
RoHs Status
ROHS3 Compliant
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In stock: 39794
  • Unit Price: $7.014
  • Subtotal: $0.00

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The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MSP430F6635IPZ Tech Specifications
Texas Instruments - MSP430F6635IPZ technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F6635IPZ

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Supplier Device Package 100-LQFP (14x14)
Speed 20MHz
Series MSP430F6xx
RAM Size 18K x 8
Program Memory Type FLASH
Program Memory Size 256KB (256K x 8)
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case 100-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 74
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 16x12b
Core Size 16-Bit
Core Processor MSP430 CPUXV2
Connectivity I²C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Base Product Number MSP430F6635

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

What are the key differences between the MSP430F6635IPZ and other MSP430F6xx series microcontrollers when considering USB connectivity and power efficiency for industrial sensor node applications?
The MSP430F6635IPZ stands out in the MSP430F6xx series due to its integrated USB 2.0 interface, which enables direct communication with host systems without requiring an external transceiver. This reduces component count and board space compared to devices like the MSP430F67641 that lack native USB support. Additionally, the F6635 operates at a core voltage of 1.8V to 3.6V, allowing it to maintain low power consumption during active operation while supporting USB suspend modes. With 256KB of FLASH memory and 18KB RAM, it provides sufficient program storage for complex sensor data processing algorithms, making it suitable for battery-powered industrial nodes where both performance and energy efficiency are critical.
How does the MSP430F6635IPZ compare to the MSP430FR5994 in terms of non-volatile memory architecture and retention under extended temperature conditions?
Unlike the MSP430FR5994, which uses FRAM technology offering virtually unlimited write endurance and fast access times, the MSP430F6635IPZ relies on traditional FLASH memory with a typical endurance of 10,000 write cycles. While FLASH is more cost-effective for large codebases, it requires careful management to avoid premature wear in data logging applications. Both devices support operation from -40°C to 85°C, but the F6635’s FLASH-based architecture may exhibit slightly higher susceptibility to data retention degradation at elevated temperatures above 70°C, necessitating periodic refresh routines in long-term deployments.
What considerations should be made when selecting the MSP430F6635IPZ for a motor control application requiring precise PWM timing and multiple communication interfaces?
For motor control applications, the MSP430F6635IPZ offers 74 I/O pins and multiple PWM channels through its advanced peripheral set, enabling precise timing control for brushless DC or stepper motors. The device supports UART, SPI, I2C, and LINbus, facilitating integration with encoders, current sensors, and CAN-to-LIN bridges. However, users must ensure proper decoupling of the 100-LQFP package to minimize noise coupling into analog sections, especially when using the 16x12-bit A/D converter near switching power stages. Clock accuracy must also be evaluated, as the internal oscillator has ±1% tolerance, which may require calibration in high-precision feedback loops.
Can the MSP430F6635IPZ operate reliably in environments with frequent power cycling, and how does its brown-out detection feature contribute to system robustness?
Yes, the MSP430F6635IPZ includes built-in brown-out detection (BOD) that monitors supply voltage and initiates a controlled reset if Vcc falls below a programmable threshold—typically adjustable down to 1.8V. This prevents erratic behavior during power-up transients common in solar-powered or battery-swapped systems. Combined with the device’s ultra-low standby current (as low as 0.4 µA in LPM3 mode), the BOD ensures reliable recovery after deep discharge events, making it well-suited for remote monitoring stations subject to intermittent power availability.
What impact does the 20MHz maximum speed have on real-time performance when implementing CAN bus communication alongside USB data transfers on the MSP430F6635IPZ?
The MSP430F6635IPZ’s 20MHz clock limits instruction throughput but remains sufficient for most embedded control tasks when optimized assembly or C code is used. In dual-interface scenarios involving both USB and CAN, the CPU must context-switch between protocol stacks, potentially introducing latency spikes. While the hardware UART and USB module handle much of the framing independently, the main processor still manages endpoint buffering and message routing. Careful scheduling and DMA usage—such as offloading A/D sampling to dedicated blocks—are essential to maintain deterministic response times under load.
How does the surface-mount LQFP packaging influence thermal performance and PCB layout complexity when deploying the MSP430F6635IPZ in compact enclosures?
The 100-LQFP (14x14 mm) package of the MSP430F6635IPZ features a thermally enhanced lead frame and exposed pad for improved heat dissipation, though it lacks the thermal mass of larger packages like TQFP or BGA. In tightly packed enclosures, localized heating around the IC can affect stability unless adequate copper pours and vias are implemented. Thermal simulations should account for conduction through the PCB rather than relying solely on natural convection. Additionally, the fine-pitch leads (0.5mm pitch) demand precise solder paste printing and alignment during reflow to prevent bridging, increasing manufacturing complexity.
Is it feasible to use the MSP430F6635IPZ for wireless mesh networking protocols such as Zigbee or Thread, given its limited RAM and lack of hardware MAC acceleration?
The MSP430F6635IPZ can technically support lightweight wireless protocols like 6LoWPAN but not full-stack Zigbee or Thread implementations due to insufficient RAM (only 18KB) and lack of dedicated radio peripherals. These protocols often require >32KB RAM for stack buffers and cryptographic operations. While the F6635 could run a minimal IP-based protocol over an external IEEE 802.15.4 radio module via SPI, the overhead of software packet handling would strain the 20MHz CPU. Thus, while possible in constrained edge cases, it’s generally impractical compared to dedicated SoCs like CC2538 or EFR32.
What are the implications of the MSP430F6635IPZ’s internal oscillator for time-critical applications requiring accurate wake-up intervals from low-power modes?
The MSP430F6635IPZ relies on an internal digitally calibrated oscillator (DCO) with typical frequency tolerance of ±1%, varying with temperature and supply voltage. In sleep-critical applications—such as metering or alarm systems—this variation can cause significant drift in wake-up intervals. For example, a 1-second timer based on DCO may actually range from 0.99s to 1.01s depending on operating conditions. Users needing better accuracy should implement an external 32kHz crystal in conjunction with the real-time clock (RTC) module, which consumes only 0.2 µA but requires additional PCB real estate and cost.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F6635IPZ

Product Attribute MSP430F6635IPZR MSP430F6637IPZ MSP430F6634IPZR MSP430F6635IZQWR
Part Number MSP430F6635IPZR MSP430F6637IPZ MSP430F6634IPZR MSP430F6635IZQWR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Data Converters - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Program Memory Type - - - -
Series - - - -
Core Size - - - -
Connectivity - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Core Processor - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Peripherals - - - -
Program Memory Size - - - -
Oscillator Type - - - -
EEPROM Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of I/O - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Speed - - - -
RAM Size - - - -

MSP430F6635IPZ Datasheet PDF

Download MSP430F6635IPZ pdf datasheets and Texas Instruments documentation for MSP430F6635IPZ - Texas Instruments.

PCN Design/Specification
MSP430F54yy/F6yy Datasheet Update 26/Aug/2013.pdf CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf
PCN Other
Multiple Changes 19/Sep/2014.pdf
PCN Packaging
14x14x1.4 LQFP Tray Chg 17/Nov/2015.pdf
PCN Assembly/Origin
Mult Devices 23/Feb/2018.pdf
HTML Datasheet
MSP430F663x Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

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MSP430F6635IPZ Image

MSP430F6635IPZ

Texas Instruments
98D-MSP430F6635IPZ

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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