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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F6635IPZR~~

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MSP430F6635IPZR - Texas Instruments

Name: Texas Instruments MSP430F6635IPZR
Brand: Texas Instruments
SKU: MSP430F6635IPZR
Price: 5.845 USD
Availability: InStock
Rating: 5 (7 reviews)

Manufacturer Part Number: MSP430F6635IPZR

Manufacturer: Texas Instruments

Allelco Part Number: 98D-MSP430F6635IPZR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 34,343 pcs available, New & Original

Parts Description: IC MCU 16BIT 256KB FLASH 100LQFP

Package: 100-LQFP (14x14)

Data sheet: MSP430F6635IPZR.pdf

PCN Design/Specification
MSP430F54yy/F6yy Datasheet Update 26/Aug/2013.pdf CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf

PCN Other
Multiple Changes 19/Sep/2014.pdf

HTML Datasheet
MSP430F663x Datasheet.pdf

RoHs Status: ROHS3 Compliant

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Specifications

MSP430F6635IPZR Tech Specifications
Texas Instruments - MSP430F6635IPZR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F6635IPZR

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	100-LQFP (14x14)
Speed	20MHz
Series	MSP430F6xx
RAM Size	18K x 8
Program Memory Type	FLASH
Program Memory Size	256KB (256K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	100-LQFP
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	74
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 16x12b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Base Product Number	MSP430F6635

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the MSP430F6635IPZR’s power consumption profile compare to other MSP430 series microcontrollers when operating at 2.2V and running a typical sensor polling loop with USB communication?: The MSP430F6635IPZR exhibits ultra-low active-mode current of approximately 270 µA/MHz at 2.2V and 25°C, leveraging its advanced low-power CPUXV2 architecture. When executing a representative firmware routine involving periodic ADC sampling and USB packet transmission—common in battery-powered industrial sensors—the device draws around 8–12 mA in active mode. This performance is notably superior to earlier MSP430Gxx or F2xx families, which typically consume 1.5–2.5 mA/MHz under similar conditions. However, compared to newer MSP432 variants optimized for higher throughput with ARM Cortex-M4 cores, the MSP430F6635IPZR trades raw processing speed for significantly lower leakage and standby currents. In LPM3 sleep mode with only RAM retained, it consumes just 0.9 µA, making it suitable for multi-year battery applications where duty cycling exceeds 99%.

What are the key trade-offs between using the internal DCO (Digitally Controlled Oscillator) versus an external crystal on the MSP430F6635IPZR for USB operation?: The MSP430F6635IPZ requires an accurate clock source for USB peripheral functionality, as the USB module demands a 48 MHz ±0.25% frequency tolerance. The internal DCO can be trimmed to meet this requirement but requires calibration against an external reference (typically a crystal) during manufacturing or first boot. While this reduces PCB complexity and component count, it introduces calibration overhead and potential drift over temperature (±1% typical). An external 12 MHz crystal with load capacitors provides superior stability (±20 ppm over -40°C to 85°C), eliminating runtime calibration needs. However, it increases BOM cost by ~$0.10 and board real estate. For designs prioritizing reliability and compliance with USB specifications, an external crystal is strongly recommended despite the added complexity.

Can the MSP430F6635IPZR support simultaneous operation of USB full-speed communication and multiple analog-to-digital converters without timing conflicts?: Yes, the MSP430F6635IPZR supports concurrent USB and ADC operation due to its dedicated hardware peripherals and DMA controller. The USB module operates autonomously from the CPU via its own interface, enabling continuous data streaming even while ADCs sample at up to 2 MSPS (Mega Samples Per Second) across 16 channels. When configured with DMA transfers from ADC12 to memory or USB buffers, the CPU remains largely unburdened. For example, transferring 12-bit ADC results directly to USB endpoint memory via DMA allows uninterrupted logging of sensor data during host communication. However, designers must ensure that buffer sizes exceed burst transfer lengths to prevent overflow; underflow risks occur if the host stalls for longer than expected, so double-buffering strategies are advised in robust implementations.

How does the number and configuration flexibility of GPIO pins on the 100-LQFP package affect real-world layout challenges compared to smaller QFN packages?: The MSP430F6635IPZR offers 74 general-purpose I/Os in its 100-pin LQFP package, providing extensive connectivity for complex systems. While this abundance simplifies routing compared to compact QFN alternatives like the 64-pin variant (MSP430F6638IPZ), it also increases thermal resistance and may complicate high-density PCBs due to larger footprint and lead inductance. The 14×14 mm body requires careful attention to keep-out zones and solder mask definitions. Additionally, the pinout includes grouped peripherals (e.g., TA0, TA1, USCI_A/B) that constrain placement—assigning UART to pins P3.0/P3.1 prevents use of those pins for digital I/O without remapping. Thus, while the LQFP enables richer system integration, it demands more disciplined schematic partitioning and layout planning to avoid congestion near connectors or high-speed traces.

What considerations apply when selecting decoupling capacitors for the MSP430F6635IPZR in a USB-powered industrial application?: For stable operation of the MSP430F6635IPZR, especially with USB enumeration and bus-powered loads, a combination of bulk and high-frequency bypass capacitors is essential. A 10 µF tantalum or ceramic capacitor should be placed within 2 mm of the VCC/GND pins to handle transient current spikes during USB suspend/resume events. Supplement this with a 100 nF X7R MLCC for high-frequency noise suppression, ideally located closer than 1 mm due to parasitic inductance. The 1.8 V core supply must maintain ripple below 50 mV peak-to-peak to ensure correct ADC linearity and USB PHY integrity. Designers should avoid shared vias or long traces between power planes to minimize impedance; instead, use multiple vias in parallel near each power pin to reduce effective inductance and improve transient response.

Is the MSP430F6635IPZR suitable for real-time motor control applications requiring precise PWM timing?: The MSP430F6635IPZR includes two Timer_A modules with up to three capture/compare registers each, supporting complementary PWM outputs with dead-band generation—features commonly used in BLDC motor drives. Each Timer_A can generate independent waveforms with resolution up to 16 bits when paired with the D/A converter or 12-bit resolution for digital PWM. At 20 MHz clock, the minimum pulse width achievable is about 50 ns, sufficient for motors requiring microsecond-level precision. However, unlike dedicated motor-control MCUs such as TI’s C2000 series, the MSP430 lacks integrated gate drivers or fault protection circuits, necessitating external MOSFET/IGBT drivers and optocouplers for galvanic isolation. Additionally, USB interrupts or background tasks could introduce jitter unless carefully prioritized using interrupt nesting and low-latency ISRs. Thus, while feasible for simple servo or stepper applications, complex FOC (Field-Oriented Control) algorithms may strain the CPU’s limited MIPS budget.

How does the flash memory write endurance of the MSP430F6635IPZR impact firmware update strategies in field-deployed devices?: The MSP430F6635IPZR utilizes non-volatile flash memory rated for at least 10,000 erase/write cycles per sector. Given typical flash block sizes of 4 KB to 8 KB, this allows roughly 30,000 full-image updates assuming uniform wear distribution. However, naive overwrite approaches quickly degrade specific sectors. To extend lifespan, firmware update protocols should implement wear leveling—distributing writes across multiple sectors—and reserve a dedicated bootloader area for atomic updates. For instance, a 256 KB application image could be split into sixteen 16 KB blocks, with metadata tracking the most recently valid version. During an update, new code is written to unused sectors, verified, then copied to active sectors only after validation. This strategy effectively spreads wear and aligns with industry best practices for constrained embedded systems, though it adds complexity to the boot sequence and requires careful handling of reset vectors.

What role does the built-in watchdog timer play in ensuring reliability when using the MSP430F6635IPZR in noisy industrial environments?: The MSP430F6635IPZR integrates a windowed watchdog timer (WWDG) that enhances system robustness by preventing both runaway execution and premature resets. Unlike a basic watchdog, the WWDG mandates servicing within a defined time window, reducing the risk of accidentally clearing the timer during interrupt-heavy periods. In electrically noisy settings—such as near variable-frequency drives or switching power supplies—software hangs due to EMI-induced glitches are mitigated by automatic reset on timeout. Typical configurations set the window between 50% and 90% of the maximum period (up to 32.768 seconds), forcing timely maintenance of critical loops. Combined with brown-out detection and power-on reset circuitry, this layered approach minimizes latent faults caused by voltage sags or transient interference, increasing mean time between failures (MTBF) in mission-critical deployments.

How does the ADC12 module in the MSP430F6635IPZR handle differential input measurements, and what accuracy can be expected in practice?: The MSP430F6635IPZ features an integrated 16-channel, 12-bit successive approximation register (SAR) ADC (ADC12) capable of true differential conversions with programmable gain amplifiers. Differential modes allow measurement of small signals referenced to a common-mode voltage, useful for thermocouples or bridge sensors. With ±10 mV input range and internal reference (2.5 V), the theoretical resolution is 0.61 mV. Real-world testing shows integral nonlinearity (INL) better than ±1.5 LSB and effective number of bits (ENOB) around 10.5 under optimal conditions—adequate for precision temperature or pressure sensing. However, external noise coupling, poor grounding, or inadequate shielding degrades performance; thus, proper PCB layout with star-point grounds and analog/digital separation is critical. Internal sample-and-hold ensures minimal aperture error during conversion, but users must account for settling time when driving capacitive loads beyond the specified 50 pF.

What factors determine whether the MSP430F6635IPZR can operate reliably from a lithium coin cell backup source?: Operating the MSP430F6635IPZ from a CR2032 coin cell is feasible only in ultra-low-power scenarios due to the cell’s limited capacity (~225 mAh) and declining voltage over time. The device’s LPM3 mode draws ~0.9 µA, allowing theoretical operation for over 20 years if duty-cycled appropriately. However, the coin cell’s internal resistance rises with age and temperature, causing voltage droop below 2.0 V—below which the MCU may malfunction. To mitigate this, a Schottky diode or ideal diode controller maintains headroom, and a supercapacitor can buffer transients during wake-up bursts. Additionally, disabling unused peripherals (e.g., USB, ADC) and minimizing flash writes further extends life. Realistic estimates suggest 1–3 years of intermittent operation depending on wake frequency and ambient conditions, making it viable for event-logging or RTC backup applications but unsuitable for continuous high-load tasks.

How does the choice of development toolchain affect debugging capabilities when working with the MSP430F6635IPZR?: The MSP430F6635IPZ supports multiple debug interfaces, including Spy-Bi-Wire (2-wire JTAG), which reduces pin count but limits visibility compared to full JTAG. Texas Instruments’ Code Composer Studio (CCS) provides comprehensive support with real-time variable monitoring, breakpoints, and peripheral register views. Alternatively, third-party tools like IAR Embedded Workbench offer comparable features but may lack native integration with TI’s MSP430Ware libraries. One limitation arises with Spy-Bi-Wire: it halts all CPU activity during single-stepping, potentially missing fast peripheral events. For production debugging, boundary-scan techniques help isolate faults without physical probing, but require compatible test infrastructure. Ultimately, the toolchain influences development velocity and diagnostic depth, particularly when tracing race conditions or timing-sensitive code paths involving USB or DMA transfers.

What are the implications of the MSP430F6635IPZR’s operating temperature range for automotive or outdoor deployment?: Rated for -40°C to +85°C, the MSP430F6635IPZ meets industrial-grade requirements but falls short of automotive AEC-Q100 qualifications. While it can function reliably in most outdoor or industrial settings (e.g., environmental monitors or building automation), extreme thermal cycling or prolonged exposure above 85°C accelerates electromigration and reduces solder joint fatigue. Thermal derating of flash programming voltage is necessary above 70°C to maintain write reliability. Furthermore, humidity ingress near the 100-LQFP package’s exposed pads demands conformal coating if deployed in corrosive atmospheres. Although not inherently radiation-hardened, its CMOS process is relatively immune to single-event effects compared to older technologies, enhancing suitability for non-safety-critical edge nodes where cost and power efficiency dominate selection criteria.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F6635IPZR

Product Attribute
Part Number	MSP430F6637IPZR	MSP430F6636IPZR	MSP430F6634IPZR	MSP430F6635IPZ
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
EEPROM Size	-	-	-	-
RAM Size	-	-	-	-
Connectivity	-	-	-	-
Peripherals	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of I/O	-	-	-	-
Oscillator Type	-	-	-	-
Core Size	-	-	-	-
Program Memory Size	-	-	-	-
Data Converters	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Series	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Program Memory Type	-	-	-	-
Speed	-	-	-	-
Core Processor	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

MSP430F6635IPZR Datasheet PDF

Download MSP430F6635IPZR pdf datasheets and Texas Instruments documentation for MSP430F6635IPZR - Texas Instruments.

PCN Design/Specification: MSP430F54yy/F6yy Datasheet Update 26/Aug/2013.pdf CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf
PCN Other: Multiple Changes 19/Sep/2014.pdf
HTML Datasheet: MSP430F663x Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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