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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMSP430F6637IPZ
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MSP430F6637IPZ - Texas Instruments

Manufacturer Part Number
MSP430F6637IPZ
Manufacturer
Texas Instruments
Allelco Part Number
98D-MSP430F6637IPZ
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
30,670 pcs available, New & Original
Parts Description
IC MCU 16BIT 192KB FLASH 100LQFP
Package
100-LQFP (14x14)
Data sheet
MSP430F6637IPZ.pdf

PCN Other

2.73KHz.pdf

PCN Packaging

2.73KHz.pdf

HTML Datasheet

MSP430F663x Datasheet.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 30670
  • Unit Price: $8.576
  • Subtotal: $0.00

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The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MSP430F6637IPZ Tech Specifications
Texas Instruments - MSP430F6637IPZ technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F6637IPZ

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Supplier Device Package 100-LQFP (14x14)
Speed 20MHz
Series MSP430F6xx
RAM Size 18K x 8
Program Memory Type FLASH
Program Memory Size 192KB (192K x 8)
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case 100-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 74
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 16x12b; D/A 2x12b
Core Size 16-Bit
Core Processor MSP430 CPUXV2
Connectivity I²C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Base Product Number MSP430F6637

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the MSP430F6637IPZ handle power consumption in battery-powered applications, and what design considerations should be made to optimize energy efficiency?
The MSP430F6637IPZ supports ultra-low-power operation critical for battery applications, with active mode current typically around 290 µA/MHz at 3V. In standby mode with RTC enabled, it draws approximately 0.8 µA, allowing extended operation from coin cells or small Li-ion batteries. Designers should leverage its multiple low-power modes (LPM3/LPM4) by disabling unused peripherals and configuring GPIOs as inputs with pull-ups disabled. The 1.8–3.6V operating range enables voltage scaling to match available supply, further reducing dynamic power. Careful clock management—using ACLK for slow functions and DCO for high-speed tasks—can reduce average current by up to 60% compared to constant full-speed operation.
Can the MSP430F6637IPZ interface directly with USB host devices, and what firmware overhead is required to support USB communication?
Yes, the MSP430F6637IPZ includes a dedicated USB controller supporting Full-Speed USB 2.0, enabling direct communication with standard USB peripherals without external transceivers. It implements both device and peripheral roles, making it suitable for embedded USB-to-serial bridges or sensor hubs. However, USB protocol handling requires significant firmware development; TI provides the MSP430 USB API (USBLib) that abstracts packet handling, endpoint management, and descriptor configuration. Typical application code adds 2–5 KB of flash overhead depending on feature set. Real-time response is guaranteed only when interrupts are prioritized correctly, as USB events must be serviced within microsecond windows to avoid NAK timeouts.
What are the differences between using the internal oscillator versus an external crystal with the MSP430F6637IPZ, particularly in terms of timing accuracy and system reliability?
The MSP430F6637IPZ integrates a calibrated internal DCO (Digital Controlled Oscillator) capable of 1, 4, 8, or 20 MHz output with ±1% initial accuracy over temperature. While sufficient for UART and basic timing, this lacks precision needed for USB (which demands ±0.25% tolerance) or LIN bus synchronization. For USB applications, an external 12 MHz crystal with load capacitors is mandatory. External crystals provide superior long-term stability (±20 ppm/year) but require PCB layout attention—keep traces short, avoid vias, and use ground shielding. Internal RC operation reduces component count and board space but increases jitter in analog subsystems like ADC conversions by up to 1.5 LSB under load variations.
How many analog input channels does the MSP430F6637IPZ support, and can they all be used simultaneously in a multiplexed configuration?
The MSP430F6637IPZ provides 16 programmable analog input channels via its integrated 16-channel 12-bit SAR ADC. These correspond to specific pins mapped through the ADC12_A module, not all GPIOs are ADC-capable—only designated pins such as P6.0–P6.15 (with some sharing). All 16 channels cannot be sampled simultaneously due to single-conversion architecture; however, burst mode allows sequential sampling at up to 200 ksps across multiple channels. To maximize throughput, configure the ADC12CTL0 register for multi-channel conversion with ADC12SHSx bits selecting trigger source. Overlap between digital I/O and analog inputs may require careful pin planning—for example, P6.5 serves dual function unless switched via software.
In comparison to the MSP430G2553, how does the MSP430F6637IPZ improve performance for industrial monitoring systems requiring real-time data logging?
The MSP430F6637IPZ offers substantially greater memory bandwidth and peripheral integration than entry-level MSP430G series devices. With 192 KB flash and 18 KB RAM—over 10× the program memory and 20× the RAM of G2553—it can store days of sensor data locally before transmission. Its 20 MHz CPU speed enables faster interrupt response (<1 µs latency vs. ~3 µs on G2553), crucial for real-time event detection. Additionally, dedicated DMA transfers offload the CPU during ADC conversions, preventing data loss under continuous sampling. Unlike G2553’s limited UART, F6637IPZ includes full USART and USB stacks, supporting bidirectional communication without polling bottlenecks. This makes it far better suited for distributed sensing nodes in temperature or vibration monitoring networks.
What precautions should be taken when soldering the MSP430F6637IPZ in mass production to ensure reliable assembly?
As a 100-pin LQFP package rated for MSL 3 (168-hour shelf life after opening), the MSP430F6637IPZ requires controlled humidity storage and bake-out if exposure exceeds 168 hours. Reflow profiles must adhere to J-STD-020D standards: peak temperature ≤260°C, dwell above 217°C no more than 60 seconds. Solder paste selection matters—Type 4 or finer particles reduce bridging risk on fine-pitch leads. During rework, localized heating above 280°C for >10 seconds risks delamination due to plastic encapsulation limitations. Thermal relief pads on adjacent components should be avoided beneath the IC footprint. Automated optical inspection (AOI) can catch tombstoning or misalignment early, especially given the 0.5 mm lead pitch.
Can the MSP430F6637IPZ drive high-current loads directly, and what external circuitry is needed for switching motors or LEDs?
The MSP430F6637IPZ’s GPIO pins are limited to sourcing/sinking ~20 mA per pin (up to 25 mA total for all ports combined), insufficient for most motors or high-brightness LEDs. Driving inductive loads like DC motors requires flyback diodes and transistor drivers—NPN BJTs (e.g., 2N3904) or MOSFETs (e.g., IRLZ44N) with base/gate resistors. For LEDs, use current-limiting resistors calculated as (Vcc – Vf_LED – Vce_sat_transistor) / Desired_I. Alternatively, connect GPIO to enable pins of integrated driver ICs such as ULN2003 for Darlington arrays. PWM outputs control brightness or motor speed via duty cycle modulation, but always verify thermal dissipation in continuous operation scenarios exceeding 100 mA total port current.
How does the watchdog timer configuration affect system recovery in noisy environments when using the MSP430F6637IPZ?
The MSP430F6637IPZ features two watchdogs: WDTA (windowed) and WDT_A (interval). WDT_A operates independently of MCLK, using ACLK or SMCLK, and resets the MCU if not cleared within the programmed interval—critical for catching software hangs. In electrically noisy settings, incorrect clock source selection can cause premature timeouts. Always feed the WDT_A from a stable source like VLO (~12 kHz) or XT1 if available. Avoid feeding from DCO due to frequency drift. Enable the watchdog during initialization and disable only during known non-critical sections. Pair with proper interrupt service routines that periodically clear the watchdog flag. Failure to do so results in hard reset, which restores deterministic behavior but may lose context without backup registers enabled via BOR or PMM modules.
Is it possible to reprogram the MSP430F6637IPZ over-the-air, and what security mechanisms prevent unauthorized access?
Yes, the MSP430F6637IPZ supports in-system programming (ISP) via JTAG or Spy-Bi-Wire interfaces, enabling field updates. Texas Instruments also provides secure boot capabilities through cryptographic libraries in its SimpleLink SDK, though native hardware security (secure key storage, tamper detection) is minimal compared to ARM-based MCUs. Without external protection circuits, firmware extraction via JTAG is trivial. For OTA updates, implement AES-128 encryption with unique device keys stored in flash lock bits. Use a companion processor (e.g., Wi-Fi module) to authenticate updates before forwarding encrypted payloads. Never expose programming headers permanently; disable JTAG in final deployment by setting appropriate fuse bits in FRCT register. This mitigates physical and remote code injection attacks common in IoT deployments.
What role does the brownout reset (BOR) play in robust system design with the MSP430F6637IPZ, and how should thresholds be configured?
Brownout detection (BOR) monitors supply voltage and triggers a reset if Vcc drops below a threshold (typically 2.2V or 2.7V depending on configuration). This prevents erratic behavior during power-up/down transients, which could corrupt flash writes or cause undefined instruction execution. The MSP430F6637IPZ allows selection of BOR levels via PMMCTL0 register: BORLEVEL0 (2.7V), BORLEVEL1 (2.2V), etc. Choose the lowest level compatible with minimum Vcc (1.8V) to maximize margin while avoiding nuisance resets. Combine BOR with POR (power-on reset) for comprehensive voltage supervision. Note that BOR does not protect against brownout conditions lasting longer than 1 ms without additional capacitors—design bulk capacitance (≥10 µF) near the MCU to stabilize rails during brief dips.
How does the DMA module in the MSP430F6637IPZ enhance ADC performance during continuous data acquisition?
The MSP430F6637IPZ includes a DMA controller that transfers ADC results directly to RAM or memory-mapped peripherals without CPU intervention. When configured with ADC12IFGx as trigger, each conversion completion automatically moves data via DMA channel 0–7. This eliminates CPU load spikes and ensures no samples are missed even at maximum 200 ksps rate. For multi-channel scans, set up DMA descriptors for block transfers, enabling automatic increment of source/destination addresses. Critical for applications like audio sampling or vibration analysis where buffer overflow would distort measurements. DMA also supports scatter-gather operations, allowing flexible routing of data to different buffers based on event type. Configure DMAIE to generate interrupts only upon transfer completion, minimizing overhead.
In what ways does the inclusion of IrDA and LINbus peripherals benefit automotive applications using the MSP430F6637IPZ?
The MSP430F6637IPZ embeds IrDA (Infrared Data Association) and LIN (Local Interconnect Network) physical layers, enabling compliance with automotive communication standards without external transceivers. IrDA simplifies short-range wireless links for diagnostic tools or user interfaces using infrared LEDs/detectors. LINbus supports cost-effective sub-networks in vehicles (e.g., door modules, lighting) operating at 19.2 kbps with master-slave topology. Both protocols are implemented in hardware, freeing CPU cycles compared to bit-banging approaches. For LIN, the MCU handles framing, checksums, and wake-up signaling autonomously. Ensure signal integrity by matching termination resistors and keeping traces away from EMI sources. These features reduce BoM cost and PCB complexity in non-critical automotive subsystems compliant with ISO 11898-3 or SAE J2602.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F6637IPZ

Product Attribute MSP430F6637IPZR MSP430F6637IZQWT MSP430F6635IPZR MSP430F6637IZQWR
Part Number MSP430F6637IPZR MSP430F6637IZQWT MSP430F6635IPZR MSP430F6637IZQWR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Connectivity - - - -
Program Memory Type - - - -
Core Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Base Product Number - DAC34H84 MAX500 ADS62P42
RAM Size - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
EEPROM Size - - - -
Number of I/O - - - -
Data Converters - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Speed - - - -
Core Processor - - - -
Program Memory Size - - - -
Peripherals - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Oscillator Type - - - -

MSP430F6637IPZ Datasheet PDF

Download MSP430F6637IPZ pdf datasheets and Texas Instruments documentation for MSP430F6637IPZ - Texas Instruments.

PCN Design/Specification
MSP430F54yy/F6yy Datasheet Update 26/Aug/2013.pdf Mult Dev Datasheet Rev 17/Dec/2018.pdf
PCN Other
2.73KHz.pdf
PCN Packaging
2.73KHz.pdf
HTML Datasheet
MSP430F663x Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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MSP430F6637IPZ Image

MSP430F6637IPZ

Texas Instruments
98D-MSP430F6637IPZ

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