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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMSP430F6638IPZ
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MSP430F6638IPZ - Texas Instruments

Manufacturer Part Number
MSP430F6638IPZ
Manufacturer
Texas Instruments
Allelco Part Number
32D-MSP430F6638IPZ
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
4,161 pcs available, New & Original
Parts Description
IC MCU 16BIT 256KB FLASH 100LQFP
Package
100-LQFP (14x14)
Data sheet
MSP430F6638IPZ.pdf

PCN Packaging

2.73KHz.pdf

HTML Datasheet

MSP430F663x Datasheet.pdf

PCN Assembly/Origin

2.73KHz.pdf

PCN Other

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Specifications

MSP430F6638IPZ Tech Specifications
Texas Instruments - MSP430F6638IPZ technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F6638IPZ

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Supplier Device Package 100-LQFP (14x14)
Speed 20MHz
Series MSP430F6xx
RAM Size 18K x 8
Program Memory Type FLASH
Program Memory Size 256KB (256K x 8)
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case 100-LQFP
Package Tube
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 74
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 16x12b; D/A 2x12b
Core Size 16-Bit
Core Processor MSP430 CPUXV2
Connectivity I²C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Base Product Number MSP430F6638

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

MSP430F6638IPZ Image
MSP430F6638IPZ (1)

Manufacturer Part Number

MSP430F6638IPZ

Manufacturer

Texas Instruments

Introduction

The MSP430F6638IPZ is a microcontroller unit from the MSP430F6xx series, designed for low-power and high-performance applications by Texas Instruments.

Product Features and Performance

16-Bit MSP430 CPUXV2 core

20 MHz operating speed

Integrated connectivity options: I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB

Peripherals include Brown-out Detect/Reset, DMA, POR, PWM, WDT

74 available I/O pins

256KB Flash memory

18KB RAM

Onboard A/D 16x12-bit and D/A 2x12-bit converters

Internal type oscillator

Product Advantages

Optimized for low-power consumption

High-density 16-bit RISC architecture

Robust peripheral set for versatile application use

Enables RF and digital sensor systems

Key Technical Parameters

Program Memory Size: 256KB (FLASH)

RAM Size: 18K x 8

Voltage Supply (Vcc/Vdd): 1.8V to 3.6V

Operating Temperature Range: -40°C to 85°C

Mounting Type: Surface Mount

Package/Case: 100-LQFP

Quality and Safety Features

Built-in Brown-out Detect/Reset for reliable operation

Watchdog Timer (WDT) for system protection and recovery

Over 100 years data retention with Flash memory

Compatibility

Compatible with MSP430 development tools

Supports various serial communication protocols

Application Areas

Industrial controls

Consumer electronics

Wireless networking

Energy management

Portable and battery-powered devices

Product Lifecycle

Active product status

No reported plans for discontinuation

Substitute models available as part of the MSP430 family

Several Key Reasons to Choose This Product

Low-power design suitable for battery-powered applications

Extensive integration to minimize external components and reduce system cost

High-performance CPU for intensive processing tasks

Flexible power management system

Wide operating temperature range for harsh environments

Large set of I/Os to enhance peripheral connectivity

Frequently Asked Questions(FAQ)

How does the MSP430F6638IPZ handle power consumption in battery-powered applications, and what factors influence its low-power modes?
The MSP430F6638IPZ features multiple low-power modes that allow designers to minimize energy usage in battery-operated systems. With a supply voltage range of 1.8V to 3.6V and an internal oscillator running at up to 20MHz, the device can operate at high speed during active periods while transitioning into ultra-low-power states such as LPM3 or LPM4 when idle. These modes reduce current draw to microamp levels by disabling the CPU and most peripherals. The choice of clock source, peripheral utilization, and wake-up latency directly affect how effectively the system maintains battery life. For example, using the internal DCO instead of external crystals can further reduce quiescent current in standby configurations.
What is the difference between the MSP430F6638IPZ and other MSP430 devices like the F5xx or FRxx series in terms of connectivity and memory architecture?
The MSP430F6638IPZ stands out from earlier MSP430 families due to its integrated USB 2.0 full-speed controller, which enables direct host or device functionality without additional chips. In contrast, F5xx series lack USB support, and FRxx devices use nonvolatile FRAM instead of FLASH memory. While both F5xx and FRxx offer competitive low-power performance, the F6xx family—including the MSP430F6638IPZ—provides a balance of larger program memory (256KB FLASH), enhanced analog peripherals, and rich communication interfaces including LIN, IrDA, and I2C, making it suitable for industrial and portable applications requiring moderate processing and connectivity.
Can the MSP430F6638IPZ be used in automotive environments, and are there any qualification considerations beyond standard commercial temperature ratings?
The MSP430F6638IPZ is rated for operation from -40°C to +85°C, which aligns with industrial-grade specifications but does not meet AEC-Q100 automotive qualifications. Therefore, it is generally unsuitable for core automotive systems such as engine control units or safety-critical subsystems. However, it may be acceptable in less demanding automotive peripherals like dashboard sensors or infotainment accessories where environmental stress is lower. Designers should verify application-specific reliability requirements and consider extended testing if deploying in harsh vehicle conditions.
What trade-offs exist when selecting the MSP430F6638IPZ for USB-based embedded designs compared to using an external microcontroller with discrete USB PHY?
Integrating the USB 2.0 interface directly on the MSP430F6638IPZ reduces component count and PCB area, simplifying design and improving signal integrity by minimizing trace lengths and EMI risks associated with long USB lines. However, this approach limits flexibility—any change to USB protocol stack or firmware requires reprogramming the entire MCU. External solutions with dedicated USB controllers allow reuse across projects and easier compliance testing but add cost, power, and layout complexity. The decision hinges on whether system integration benefits outweigh the constraints imposed by fixed USB functionality.
How does the 16-bit MSP430 CPUXV2 core in the MSP430F6638IPZ compare in instruction execution efficiency to ARM Cortex-M0+ cores commonly found in modern microcontrollers?
The MSP430 CPUXV2 executes most instructions in a single clock cycle and supports powerful bit manipulation operations natively, resulting in efficient code density for control-intensive tasks. While the ARM Cortex-M0+ offers higher peak performance and better DSP capabilities, the MSP430F6638IPZ excels in ultra-low-power scenarios due to its advanced sleep modes and optimized interrupt response. For applications prioritizing energy efficiency over raw throughput—such as remote sensors or wearables—the MSP430’s architecture often delivers superior real-world performance per watt.
What are the implications of the 100-LQFP package on thermal management and PCB routing for the MSP430F6638IPZ?
The 100-pin LQFP (14x14 mm) package provides good electrical performance and moderate thermal conductivity through its exposed pad. However, without additional heatsinking, sustained high-frequency operation near 20MHz could lead to localized heating, especially if the device drives multiple peripherals simultaneously. Designers must ensure adequate copper pour and vias under the package to dissipate heat effectively. Routing becomes more constrained compared to smaller packages due to dense pin placement, requiring careful layer stackup and signal integrity planning to avoid crosstalk, particularly on high-speed signals like USB differential pairs or SPI clocks.
Is it feasible to upgrade existing designs based on older MSP430 models to the MSP430F6638IPZ while maintaining software compatibility?
Partial compatibility exists due to shared MSP430 instruction set and similar register mapping, but migration requires careful evaluation. The increased memory size (256KB FLASH vs. typically 16–64KB in older variants) allows larger firmware, but differences in peripheral registers, interrupt vectors, and clock configuration routines may necessitate code modifications. Additionally, the presence of new features like USB complicates backward compatibility unless the legacy interface remains unused. Tools like TI’s MSP430Ware library help streamline porting, but regression testing is essential to validate timing-sensitive behaviors.
How reliable is the internal oscillator of the MSP430F6638IPZ in timekeeping applications, and what alternatives are recommended for precision timing?
The internal oscillator offers sufficient stability for many low-frequency applications but exhibits temperature drift and aging effects that limit accuracy to ±1% or worse over the operating range. For precise timing—such as real-time clocks or communication protocols requiring tight baud rate control—designers should use an external crystal or ceramic resonator matched to the MSP430F6638IPZ’s load capacitance requirements. This improves frequency stability to ±10 ppm or better and ensures consistent performance across temperature variations, reducing the risk of data errors in UART, USB, or I2C transactions.
What role does DMA play in optimizing performance within systems using the MSP430F6638IPZ, especially when handling ADC conversions or UART transfers?
The MSP430F6638IPZ includes DMA channels that enable peripheral-to-memory or memory-to-peripheral transfers without CPU intervention. When acquiring data from the 16-channel 12-bit ADC, DMA can automatically store samples into RAM buffers, freeing the CPU to process previous data or enter low-power mode. Similarly, DMA-driven UART transfers eliminate interrupt overhead and prevent missed characters at high baud rates. This offloads the main processor, improving responsiveness and reducing power consumption during repetitive I/O tasks, though DMA configuration requires attention to buffer sizes and transfer completion flags.
Given the absence of EEPROM, how should persistent data storage be managed in applications leveraging the MSP430F6638IPZ?
Since the MSP430F6638IPZ lacks dedicated EEPROM, non-volatile data must be stored in FLASH memory, which introduces write endurance limitations—typically 10,000 cycles per sector. Designers should implement wear leveling algorithms to distribute erase/write events evenly across sectors and minimize degradation. Data compression or delta encoding can reduce write frequency. Alternatively, external serial EEPROMs or FRAM modules connected via SPI or I2C provide more robust storage options for frequently updated parameters, trading off board space and complexity for longevity and reliability.
How do the brown-out detection and power-on reset features in the MSP430F6638IPZ contribute to system robustness in field-deployed devices?
Brown-out detection monitors Vcc and triggers a reset if voltage drops below a programmable threshold, preventing erratic behavior during power fluctuations. Combined with power-on reset (POR), these mechanisms ensure the MSP430F6638IPZ starts in a known state after brownout recovery or initial power-up. This prevents corrupted flash writes or misconfigured GPIOs that could cause system hangs. In battery-powered or grid-connected equipment subject to voltage sags, these safeguards significantly improve uptime and data integrity without requiring external supervisory ICs.
What considerations apply when integrating the MSP430F6638IPZ with USB host shields or OTG functionality in embedded projects?
The MSP430F6638IPZ supports USB device mode natively but requires external components for host operation, such as a ULPI transceiver or dedicated host shield compatible with its USB module. Implementing USB OTG demands careful attention to VBUS control, ID pin sensing, and session request protocol (SRP) timing. Layout parasitics and impedance matching become critical due to USB’s high-speed signaling requirements. Failure to adhere to USB 2.0 compliance guidelines may result in enumeration failures or unstable connections, particularly in noisy industrial environments.
How does the 74 I/O pin count influence peripheral expansion and GPIO-driven logic in designs using the MSP430F6638IPZ?
With 74 general-purpose I/O pins, the MSP430F6638IPZ supports extensive interfacing needs, including parallel LCD segments, LED matrices, button arrays, and sensor networks. However, simultaneous driving capability is limited—each pin can source/sink up to 20 mA, but total package current is capped around 100 mA. Exceeding this limit risks damage. Designers must balance multiplexing strategies against real-time responsiveness, and consider using shift registers or port expanders if additional outputs are needed. Pin functions can often be remapped via software, offering flexibility without hardware changes.
What steps are necessary to ensure EMC compliance when using the MSP430F6638IPZ in proximity to RF sources or within wireless-enabled systems?
Although the MSP430F6638IPZ itself is not an RF transmitter, its digital switching noise can couple into nearby antennas or interfere with sensitive analog circuits. To mitigate emissions, use decoupling capacitors (typically 100nF and 10µF) close to Vcc pins, minimize loop areas in high-speed traces, and route USB lines away from analog sections. Clock frequencies should avoid harmonics overlapping with ISM bands. Shielding enclosures and filtering input/output lines further enhance immunity, ensuring reliable operation alongside Wi-Fi, Bluetooth, or Zigbee radios.
How should the moisture sensitivity level (MSL 3) classification for the MSP430F6638IPZ impact manufacturing processes and storage?
MSL 3 indicates the MSP430F6638IPZ can withstand up to 168 hours above the floor-life threshold before reflow soldering is required. Beyond this window, absorbed moisture may vaporize during reflow, causing popcorning and device failure. Manufacturers must track lot receipt dates, bake parts if stored beyond MSL limits, and follow IPC/JEDEC guidelines for handling. Proper dry packaging (e.g., desiccant-sealed bags with humidity indicators) and controlled warehouse environments are essential to preserve reliability during mass production.
In what ways does the inclusion of LINbus support benefit network topologies designed around the MSP430F6638IPZ?
LINbus support simplifies implementation of low-cost, single-wire communication networks common in automotive body electronics and industrial automation. The MSP430F6638IPZ’s integrated LIN transceiver eliminates the need for external line drivers, cutting component count and PCB footprint. It enables master-slave architectures with deterministic message scheduling and error checking, supporting diagnostics and diagnostics without CAN bus complexity. This makes the part ideal for door controls, lighting systems, or sensor hubs where bandwidth needs are modest but cost and simplicity are critical.
How does the choice of programming interface affect development workflow when working with the MSP430F6638IPZ?
The MSP430F6638IPZ supports JTAG and Spy-Bi-Wire (SBW) programming interfaces. SBW uses just two pins (TEST/NMI and RST) for debugging and flashing, saving I/O resources but offering fewer diagnostic capabilities than full JTAG. Development toolchains like Code Composer Studio or IAR Embedded Workbench abstract much of this complexity, but understanding the underlying interface helps troubleshoot connection issues—especially when dealing with daisy-chained devices or noisy target boards. Flash memory can be erased and written in-system, enabling rapid iteration during prototyping.
What design precautions should be taken when combining the MSP430F6638IPZ with capacitive touch sensors or resistive touch panels?
Capacitive touch applications benefit from the MSP430F6638IPZ’s built-in capacitive-touch sensing module, which detects finger proximity through GPIO pins without external components. However, improper shielding or grounding can introduce false triggers. Resistive touch panels require separate driver circuitry, typically involving multiplexed excitation voltages and analog front ends connected to the ADC. Careful layout isolation between touch traces and high-impedance analog paths prevents coupling, while software debouncing and baseline calibration improve user experience and stability across varying temperatures and humidity levels.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F6638IPZ

Product Attribute MSP430F6638IPZR MSP430F6638IZCAT MSP430F6636IPZR MSP430F6658IPZR
Part Number MSP430F6638IPZR MSP430F6638IZCAT MSP430F6636IPZR MSP430F6658IPZR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Peripherals - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Oscillator Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage - Supply (Vcc/Vdd) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
EEPROM Size - - - -
Core Processor - - - -
Program Memory Type - - - -
Data Converters - - - -
RAM Size - - - -
Program Memory Size - - - -
Connectivity - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Speed - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Core Size - - - -
Number of I/O - - - -

MSP430F6638IPZ Datasheet PDF

Download MSP430F6638IPZ pdf datasheets and Texas Instruments documentation for MSP430F6638IPZ - Texas Instruments.

PCN Packaging
2.73KHz.pdf
PCN Design/Specification
CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf MSP430F54yy/F6yy Datasheet Update 26/Aug/2013.pdf
HTML Datasheet
MSP430F663x Datasheet.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Other
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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MSP430F6638IPZ Image

MSP430F6638IPZ

Texas Instruments
32D-MSP430F6638IPZ

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