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Home Products Integrated Circuits (ICs)Logic - Buffers, Drivers, Receivers, Transceivers~~SN74LVC245APWE4~~

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SN74LVC245APWE4 - Texas Instruments

Name: Texas Instruments SN74LVC245APWE4
Brand: Texas Instruments
SKU: SN74LVC245APWE4
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: SN74LVC245APWE4

Manufacturer: Texas Instruments

Allelco Part Number: 98D-SN74LVC245APWE4

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,726 pcs available, New & Original

Parts Description: IC TXRX NON-INVERT 3.6V 20TSSOP

Package: 20-TSSOP

Data sheet: SN74LVC245APWE4.pdf

Datasheets
Logic Guide.pdf SN74LVC245A.pdf

HTML Datasheet
SN74LVC245A.pdf

RoHs Status: ROHS3 Compliant

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In stock: 12726

Specifications

SN74LVC245APWE4 Tech Specifications
Texas Instruments - SN74LVC245APWE4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN74LVC245APWE4

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply	1.65V ~ 3.6V
Supplier Device Package	20-TSSOP
Series	74LVC
Package / Case	20-TSSOP (0.173", 4.40mm Width)
Package	Tube
Output Type	3-State
Operating Temperature	-40°C ~ 125°C (TA)

Product Attribute	Attribute Value
Number of Elements	1
Number of Bits per Element	8
Mounting Type	Surface Mount
Logic Type	Transceiver, Non-Inverting
Input Type	-
Current - Output High, Low	24mA, 24mA
Base Product Number	74LVC245

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the SN74LVC245APWE4 compare to the 74LCX245MTCX in terms of supply voltage tolerance and thermal performance under continuous high-load conditions?: The SN74LVC245APWE4 supports a supply voltage range of 1.65V to 3.6V, which provides broader compatibility with modern low-voltage digital systems compared to many legacy designs. In contrast, the 74LCX245MTCX typically operates at higher voltage thresholds, often limited to 3.3V or lower, making it less suitable for applications requiring 1.8V or 1.5V logic levels. From a thermal standpoint, both devices are fabricated using similar CMOS processes, but the SN74LVC245APWE4’s tighter voltage tolerance reduces dynamic power consumption—critical when operating continuously at full data throughput. Under sustained 24mA output current per pin across all eight channels, the SN74LVC245APWE4 demonstrates lower junction temperature rise due to improved power dissipation characteristics, especially when mounted on standard FR4 PCBs with minimal copper pour.

What design considerations should be made when cascading multiple SN74LVC245APWE4 transceivers to interface between a 1.8V microcontroller and a 3.3V FPGA without level shifting?: Direct connection between 1.8V and 3.3V domains requires careful attention to input threshold compatibility. The SN74LVC245APWE4 features LVCMOS-compatible inputs that accept up to 3.6V on any I/O pin regardless of VCC, enabling bidirectional translation. However, when interfacing a 1.8V MCU to a 3.3V FPGA, ensure that the direction control (DIR) signal is properly managed to prevent bus contention during state transitions. Additionally, since the device supports 3-state outputs, enable OE# (output enable) appropriately to isolate unused segments. Power sequencing must also be observed—either use power sequencing circuits or implement weak pull-ups/downs if hot-swapping is required. Cascading more than two such devices introduces cumulative propagation delay; each stage adds approximately 5–7 ns, which may affect timing budgets in high-speed serial links exceeding 100 Mbps.

Can the SN74LVC245APWE4 safely drive capacitive loads exceeding 50 pF per output channel without external buffering or series termination?: Yes, but with limitations. The SN74LVC245APWE4 can drive capacitive loads up to 50 pF per output with acceptable signal integrity under normal operating conditions, provided the load capacitance is evenly distributed and trace lengths are minimized. Driving higher capacitive loads (e.g., long PCB traces or unterminated cables) increases rise/fall times and may degrade noise margins. At maximum output current (24 mA), the device can charge a 50 pF load to near 90% of VCC within ~2–3 ns, meeting typical requirements for 50 MHz operation. However, for loads above 100 pF, consider adding small series resistors (22–100 Ω) near the driver to dampen ringing and reduce EMI. In environments with tight timing constraints (e.g., DDR memory interfaces), even moderate capacitive loading may necessitate buffer insertion or re-evaluation of routing topology.

What is the impact of operating the SN74LVC245APWE4 near its minimum supply voltage (1.65V) on output drive strength and noise immunity?: Operating near the minimum supply voltage (1.65V) reduces the output high-level voltage (typically 1.35V at room temperature), which diminishes noise margin by about 15–20 mV compared to 3.3V operation. While the datasheet guarantees 24 mA output current even at 1.65V, the effective switching speed decreases due to reduced overdrive voltage across internal transistors. This results in longer propagation delays—approximately 10–15% increase relative to 3.3V operation—which may violate timing specs in fast asynchronous buses. Additionally, input hysteresis narrows slightly, increasing susceptibility to glitches on noisy lines. For stable operation, maintain supply decoupling within 10 nF ceramic capacitors placed within 5 mm of the package pins, and avoid sharing power rails with high-current peripherals that could cause droop below 1.7V under transient loads.

How does the Moisture Sensitivity Level (MSL) rating of MSL 1 for the SN74LVC245APWE4 influence handling procedures during reflow soldering in mass production?: With an MSL rating of 1, the SN74LVC245APWE4 is classified as non-hygroscopic and poses no moisture-induced failure risk during standard reflow profiles. This allows unlimited storage life at ambient conditions without bake-out cycles prior to assembly. Manufacturers can proceed directly to solder paste application and reflow according to JEDEC J-STD-020 standards, including peak temperatures up to 260°C for lead-free processes. No special packaging or dry storage is required, simplifying inventory management and reducing costs in high-volume SMT lines. This contrasts with components rated MSL 3 or higher, which demand humidity monitoring and pre-drying steps before wave or reflow soldering.

What are the key differences between the SN74LVC245APWE4 and the SN74LVCH245APW in terms of power consumption and ESD protection?: The SN74LVCH245APW is functionally equivalent to the SN74LVC245APWE4 but includes higher electrostatic discharge (ESD) protection levels—up to ±8 kV HBM versus ±2 kV for the LVC version—and features a clamp diode structure optimized for automotive and industrial environments. However, this enhanced protection comes at a cost: quiescent current increases by 0.5–1 μA due to additional clamping circuitry. Both devices share the same 1.65V–3.6V supply range, 24 mA output drive, and 8-bit transceiver configuration, but the LVCH variant is better suited for exposed connectors or harsh environments where ESD events are frequent. The standard SN74LVC245APWE4 remains preferable for board-level integration with controlled I/O access.

Is it possible to use the SN74LVC245APWE4 as a clock domain synchronizer, and what precautions are necessary?: Direct use of the SN74LVC245APWE4 as a clock domain synchronizer is not recommended due to its lack of explicit setup/hold time guarantees across asynchronous clocks. While the device can transfer data between clock domains, metastability risks exist if input data changes near the sampling edge of the receiving clock. Instead, use dedicated synchronization primitives like dual-flip-flop chains or FIFOs. If the SN74LVC245APWE4 must be employed, ensure that data changes occur well outside the clock skew window, ideally using handshaking protocols or enabling OE# only after stable input assertion. Additionally, verify that both clock domains remain within ±10% frequency tolerance to minimize asynchronous transition windows.

What layout practices are critical when placing the SN74LVC245APWE4 in a mixed-signal system with analog sections?: Maintain at least 3 mm clearance between the SN74LVC245APWE4 and sensitive analog traces to prevent crosstalk via substrate coupling. Route digital signals away from analog ground returns and avoid running high-speed digital nets parallel to analog paths for more than 5 mm. Use a solid ground plane beneath the TSSOP footprint and connect all GND pins directly to this plane with multiple vias to minimize inductance. Decouple VCC and GND with 10 nF X7R capacitors placed within 2 mm of the package leads, preferably on the same layer as the IC. Avoid stitching the digital ground directly to analog ground at the IC unless isolated with ferrite beads or split planes with single-point connection downstream.

How does the propagation delay of the SN74LVC245APWE4 vary with supply voltage, and what are practical implications for timing-critical designs?: Propagation delay (tpd) decreases logarithmically as supply voltage increases from 1.65V to 3.6V. At 1.8V, tpd is approximately 4.2 ns; at 3.3V, it drops to around 2.8 ns—a 33% reduction. This variation arises from increased transistor drive current at higher voltages. In synchronous systems with tight clock margins (e.g., SPI at 40 MHz), operating at 1.8V may require derating the maximum data rate by 10–15%. Designers should simulate worst-case delays using IBIS models and include guard bands in timing budgets. When cascading multiple SN74LVC245APWE4 devices, total latency accumulates additively, potentially limiting usable bandwidth in daisy-chained configurations.

Can the SN74LVC245APWE4 operate reliably in automotive-grade temperature ranges (-40°C to +125°C), and what environmental factors affect long-term reliability?: Yes, the SN74LVC245APWE4 is qualified for commercial automotive temperatures (-40°C to +125°C), ensuring functionality across extreme climates. However, elevated temperatures accelerate electromigration and gate oxide degradation. At 125°C, leakage current increases slightly, contributing to higher static power draw in always-on systems. Thermal cycling also induces mechanical stress at the die-to-package interface, potentially causing latent cracks over time. To mitigate risks, avoid localized hotspots through adequate airflow or heatsinking, and adhere to JEDEC JESD22-A104 drop test profiles during module integration. Long-term drift in output levels may occur after >10,000 hours at 125°C, though within datasheet specifications.

What role does the direction control (DIR) pin play in preventing bus contention when using the SN74LVC245APWE4 in bidirectional communication?: The DIR pin selects the data flow direction: high enables transmission from A-side to B-side, while low reverses the direction. Critical for preventing contention, the DIR signal must change only when both sides of the bus are tri-stated (OE# active). Simultaneous assertion of opposite-direction data on both ports creates shoot-through currents, potentially exceeding absolute maximum ratings. To avoid this, implement software-controlled direction switching with a short delay (≥10 ns) after deasserting OE#, or use hardware interlocks such as enable gating based on handshake signals. In multi-master systems, coordinate DIR transitions via arbitration logic to eliminate race conditions.

Are there any known substitution risks when replacing the SN74LVC245APWE4 with the 74LVC2245APW in a legacy design?: The 74LVC2245APW is electrically compatible with the SN74LVC245APWE4 and shares identical pinout and functionality, but differs in packaging—typically SOIC instead of TSSOP. This may affect mechanical fit in space-constrained layouts. More importantly, the 2245 variant lacks some TI-specific process optimizations present in the APWE4, resulting in marginally higher power consumption and slightly slower edge rates under heavy capacitive loading. While direct substitution works in most cases, verify thermal performance in dense assemblies and confirm that output slew rates meet system noise requirements. Also check RoHS compliance status, as regional variations may exist despite both being marked compliant.

How should the output enable (OE#) timing be managed when using the SN74LVC245APWE4 to interface with a memory-mapped peripheral?: Assert OE# early enough to ensure valid data appears on the output bus before the peripheral samples it—ideally 1–2 clock cycles before address decoding completes. Deassert OE# only after the peripheral has finished reading, allowing the bus to float safely in high-impedance state. Avoid toggling OE# asynchronously with data changes, as this can corrupt bus contents during partial enable states. For write operations, OE# should remain inactive (high) throughout the entire cycle. Implement OE# control through FPGA GPIO or dedicated logic to synchronize with internal state machines, ensuring no glitches occur due to metastable latch-up in the enable path.

What are the implications of using the SN74LVC245APWE4 in battery-powered IoT nodes where power budget is constrained?: Although the SN74LVC245APWE4 consumes low static power (<1 μA), dynamic power scales with switching frequency and load capacitance. In ultra-low-power modes, disable unused channels via OE# or route them to ground to minimize leakage. Use 3-state outputs to isolate inactive sections, reducing cross-talk and unnecessary transitions. Select external pull-downs rather than relying on internal structures to avoid unintended current paths. At 1.8V operation, dynamic current drops significantly—ideal for coin-cell applications. However, avoid frequent direction changes, as each transition incurs overhead from internal node charging/discharging.

How does the package thermal resistance of the 20-TSSOP affect heat dissipation when driving multiple LEDs simultaneously?: The 20-TSSOP package has a junction-to-ambient thermal resistance (θJA) of approximately 120°C/W under still air. Driving four 24 mA LED channels continuously generates ~0.23 W of power (8 channels × 24 mA × 1.8V avg swing). This raises junction temperature by ~28°C above ambient, which remains within safe limits for most applications. However, in sealed enclosures with poor airflow, cumulative heating from adjacent ICs can elevate case temperature beyond 85°C, triggering thermal shutdown. Distribute LED drivers across multiple devices or use external MOSFETs instead. Always verify thermal performance using worst-case power simulations and include derating curves in design documentation.

What testing methodology ensures reliable operation of the SN74LVC245APWE4 in systems subject to rapid voltage transients or brownouts?: Perform transient immunity tests per IEC 61000-4-11 standards, simulating voltage dips down to 70% of nominal for 100 ms. Ensure the device resets cleanly and recovers without corrupting data. Add bulk capacitors (10–100 μF) near the supply input and place ferrite chokes in series to suppress conducted emissions. Monitor OE# and DIR signals during brownouts to prevent unintended bus activity. Validate recovery behavior using automated test scripts that inject step changes in VCC and measure output stability within 1 µs. Include EFT/Burst immunity testing at ±2 kV levels to catch latch-up scenarios caused by fast transients on shared power rails.

Can the SN74LVC245APWE4 be used in hot-swap applications where power sequencing is not guaranteed?: Limited hot-swap capability exists due to the absence of built-in current-limiting diodes on VCC pins. Without external circuitry, plugging in a powered module can cause inrush currents exceeding 100 mA if the supply rail rises rapidly. Mitigate this by adding soft-start controllers or current-limited regulators upstream. Alternatively, use TVS diodes and pre-charge circuits to equalize potentials before mating connectors. During disconnection, ensure OE# is asserted high to prevent back-driving into active stages. While functional, hot-swap usage demands external safeguards to protect both the SN74LVC245APWE4 and connected systems from damage due to uncontrolled power surges.

What documentation resources beyond the datasheet are essential for successful implementation of the SN74LVC245APWE4 in safety-critical systems?: Refer to TI’s Application Report SLLA354 (“Designing with LVC Logic”) for layout guidelines, noise modeling techniques, and timing analysis methods. Cross-reference with IPC-7351B for proper footprint design in high-reliability builds. Review JEDEC JESD22-C101 for ESD testing protocols applicable to end-system validation. For automotive implementations, consult AEC-Q100 qualification details and incorporate failure mode analysis (FMEA) covering latch-up, electromigration, and solder joint fatigue. Always validate corner cases—minimum voltage, maximum temperature, and worst-case fan-out—using SPICE simulations before committing to hardware prototypes.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN74LVC245APWE4

Product Attribute
Part Number	SN74LVC245APWTE4	SN74LVC245APWRE4	SN74LVC245APWRG4	SN74LVC245APWG4
Manufacturer	Luminary Micro / Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Input Type	-	-	-	Differential
Number of Bits per Element	-	-	-	-
Voltage - Supply	-	-	-	-
Output Type	-	Current - Unbuffered	Voltage - Buffered	-
Number of Elements	-	-	-	-
Series	-	-	-	-
Logic Type	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Current - Output High, Low	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C

SN74LVC245APWE4 Datasheet PDF

Download SN74LVC245APWE4 pdf datasheets and Texas Instruments documentation for SN74LVC245APWE4 - Texas Instruments.

Datasheets: Logic Guide.pdf SN74LVC245A.pdf
HTML Datasheet: SN74LVC245A.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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