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HomeProductsIntegrated Circuits (ICs)Logic - Signal Switches, Multiplexers, DecodersSN74LVC257ADR
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SN74LVC257ADR - Texas Instruments

Manufacturer Part Number
SN74LVC257ADR
Manufacturer
Texas Instruments
Allelco Part Number
32D-SN74LVC257ADR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
129,960 pcs available, New & Original
Parts Description
IC MULTIPLEXER 4 X 2:1 16SOIC
Package
16-SOIC
Data sheet
SN74LVC257ADR.pdf

PCN Design/Specification

Mult Devices Font 21/Apr/2018.pdf
RoHs Status
ROHS3 Compliant
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10+ $0.191 $1.91
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500+ $0.138 $69.00
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Specifications

SN74LVC257ADR Tech Specifications
Texas Instruments - SN74LVC257ADR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN74LVC257ADR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage Supply Source Single Supply
Voltage - Supply 1.65V ~ 3.6V
Type Multiplexer
Supplier Device Package 16-SOIC
Series 74LVC
Package / Case 16-SOIC (0.154", 3.90mm Width)
Product Attribute Attribute Value
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Independent Circuits 1
Current - Output High, Low 24mA, 24mA
Circuit 4 x 2:1
Base Product Number 74LVC257

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SN74LVC257ADR Image
SN74LVC257ADR (1)

Manufacturer Part Number

SN74LVC257ADR

Manufacturer

Texas Instruments

Introduction

The SN74LVC257ADR is a multiplexer from the 74LVC series, designed for logic signal switching. It is suitable for applications requiring multiple data selection and data routing based on logic control signals.

Product Features and Performance

Type: Multiplexer

Circuit Configuration: 4 x 2:1

Independent Circuits: One

Output Current: High 24mA, Low 24mA

Supply Voltage Range: 1.65V to 3.6V

Operating Temperature: -40°C to 85°C

Mounting Type: Surface Mount

Package Type: 16-SOIC

Product Advantages

High Switching Speed

Low Power Consumption

Wide Operating Temperature Range

Compact Surface Mount Package

Key Technical Parameters

Output Current Capability: 24mA both High and Low

Voltage Supply Range: 1.65V to 3.6V

Minimum Operating Temperature: -40°C

Maximum Operating Temperature: 85°C

Package: 16-SOIC

Quality and Safety Features

Robust Surface Mount Package

Designed to Meet or Exceed Industry Standards for Safety and Performance

Compatibility

Compatible with Single Supply Voltage Systems

Application Areas

Data Routing in Telecommunication

Signal Gating in Data Acquisition Systems

Multiplexing for Input/Output Interfaces in Embedded Systems

Product Lifecycle

Status: Active

No immediate plans for discontinuation, replacements, or upgrades are announced.

Several Key Reasons to Choose This Product

Efficient Data Routing Capabilities

Low Power Draw Enhancing System Longevity

High Reliability Under Wide Temperature Ranges

Easily Integrates into Various Circuit Designs

Consistent Performance with Single Supply Voltage Operation

Frequently Asked Questions(FAQ)

How does the SN74LVC257ADR multiplexer handle signal integrity when switching between four input channels at high data rates, and what design considerations are necessary to maintain reliable operation?
The SN74LVC257ADR operates with a propagation delay of approximately 3.2 ns typical at 3.3V supply and 25°C, which enables it to support data rates up to 120 Mbps in practical applications. However, maintaining signal integrity requires careful attention to PCB layout due to its 16-SOIC packaging and 3.90mm width. Input capacitance is typically around 5 pF per channel, contributing to RC time constants that can affect edge sharpness when driving capacitive loads. To ensure reliable switching, designers should minimize trace lengths on selected inputs, use controlled impedance routing where applicable, and avoid parallel routing of high-speed signals adjacent to select lines. Decoupling capacitors of 0.1 µF placed close to VCC and GND pins are essential to suppress transient voltage drops during switching events.
In a system requiring bidirectional data flow between two subsystems using separate power domains, how does the SN74LVC257ADR compare to level-shifting alternatives, and under what conditions might it be unsuitable?
Unlike dedicated level translators such as TI’s TXB or TXS series, the SN74LVC257ADR is unidirectional and cannot translate voltages between different supply rails unless both domains operate within its 1.65V to 3.6V range. For example, attempting to interface a 5V microcontroller with a 3.3V peripheral using this device without additional clamping would violate absolute maximum ratings and risk damage. While the LVC family offers good low-voltage compatibility, its output high voltage (VOH) scales with supply; at 1.8V, VOH may drop below acceptable thresholds for some 3.3V logic families. Therefore, while suitable for same-supply multiplexing tasks, it lacks the robustness required for robust inter-domain communication without external protection circuitry.
What are the implications of using multiple SN74LVC257ADR devices in cascaded configurations for address decoding in embedded systems, particularly regarding fan-out and timing skew?
Cascading multiple SN74LVC257ADRs—such as using one to route chip select signals to another—introduces cumulative propagation delays and increases fan-out requirements on control lines. Each unit contributes ~3–4 ns of delay, which over three stages could result in 10 ns total latency, potentially violating setup times in synchronous designs running above 50 MHz. Additionally, each output must drive the input capacitance of downstream logic plus any parasitic PCB capacitance. Assuming 50 pF total load per path, the SN74LVC257ADR’s 24 mA output current capability supports this adequately at lower frequencies, but rise/fall times may degrade significantly near the upper end of the operating temperature range (-40°C to +85°C), where transistor gains decrease and leakage currents increase.
When selecting between surface-mount packages for industrial control boards, why might the 16-SOIC variant of the SN74LVC257ADR be preferred despite higher cost compared to DIP alternatives?
Although not offered in DIP format, the SN74LVC257ADR’s 16-lead SOIC package provides superior thermal dissipation and mechanical stability in automated assembly environments compared to through-hole variants of similar functions. Its small outline allows dense placement on PCBs used in compact industrial controllers, reducing board real estate by approximately 30% versus dual-in-line equivalents. Furthermore, the tape-and-reel (TR) packaging aligns with pick-and-place manufacturing workflows, improving throughput and reducing handling defects. The MSL 1 rating also ensures unlimited shelf life under dry storage, simplifying inventory management for production lines.
How does the enable pin behavior of the SN74LVC257ADR affect bus contention risks in shared-data architectures, and what precautions should be taken during hot-swapping scenarios?
The SN74LVC257ADR features active-low enable inputs (OE_A and OE_B), which, when asserted high, tri-state all outputs—effectively isolating the multiplexer from the bus. This prevents back-driving but introduces subtle timing hazards during enable transitions. If both enables change state asynchronously—for instance, during hot insertion of a module—a brief window exists where one side may drive while the other is still enabled, risking shoot-through currents. To mitigate this, designers should coordinate enable sequencing via firmware or use external gate circuits to enforce mutual exclusion. Additionally, adding series resistors (22–100 Ω) on output lines limits current surges if accidental contention occurs during power-up sequences.
Given its single-supply architecture, how does the SN74LVC257ADR perform in mixed-signal environments where analog and digital sections share a common ground plane?
Operating over a broad supply range (1.65V to 3.6V), the SN74LVC257ADR exhibits low noise susceptibility due to CMOS input structures that reject common-mode voltages near rail boundaries. However, in mixed-signal designs, improper grounding can couple digital switching transients into sensitive analog paths. Since the device shares a common ground with the rest of the system, layout practices become critical: return currents from digital outputs should be kept away from analog reference traces. Placing bypass capacitors near the IC and ensuring star grounding at the power entry point help decouple high-frequency noise. Despite being digital-only, its immunity to sub-rail glitches makes it relatively robust in such contexts when implemented correctly.
What trade-offs exist between speed and power consumption when driving capacitive loads with the SN74LVC257ADR, and how do these manifest in battery-powered applications?
The SN74LVC257ADR consumes static power on the order of microamps per gate, but dynamic power rises quadratically with frequency due to charging/discharging internal nodes and external capacitances. Driving a 100 pF load at 10 MHz draws roughly 5 mA average current at 3.3V, translating to ~16 mW dissipation per channel—significant in low-power designs. While the device supports fast switching (tPLH/tPHL ≈ 3 ns), aggressive speed increases energy-per-bit unnecessarily. For battery-operated systems, reducing clock frequency or using sleep modes on unused channels can extend runtime. Alternatively, buffer stages with lower drive strength may trade speed for efficiency, though they add component count and board space.
In automotive-grade designs extending beyond 85°C ambient temperatures, why might the SN74LVC257ADR require derating even though it’s specified down to -40°C?
Although rated for -40°C to +85°C, real-world automotive environments often exceed these bounds temporarily—such as during engine bay exposure or rapid thermal cycling—due to poor airflow or localized heating from nearby components. At elevated temperatures, leakage currents increase exponentially, raising quiescent power and potentially causing unintended conduction in adjacent channels. Furthermore, long-term reliability degrades faster outside recommended ranges, affecting MTBF calculations. Designers targeting AEC-Q100 qualification must either select higher-grade parts or implement thermal management strategies like heat sinks or airflow paths to keep junction temperatures below 125°C, effectively derating performance margins.
How does the selection logic interact with input threshold voltages when interfacing the SN74LVC257ADR to TTL-compatible peripherals operating at legacy voltage levels?
The SN74LVC257ADR accepts inputs down to 0.8V for logic low and up to 0.6 × VCC for logic high, aligning well with modern low-voltage CMOS. However, connecting it directly to 5V TTL outputs risks exceeding its 3.6V absolute maximum rating. Even if powered at 3.3V, 5V inputs may forward-bias internal ESD diodes, causing latch-up or damage. Instead, level shifting via resistive dividers (e.g., 1kΩ:2kΩ ratio) or dedicated translators is necessary. Conversely, feeding 3.3V CMOS into a 5V TTL input works reliably because the SN74LVC257ADR’s VIL(max) = 0.8V and VIH(min) = 1.65V ensure clean recognition across voltage domains when properly conditioned.
What role does the base product number 74LVC257 play in ecosystem compatibility, and how does it influence PCB footprint reuse across related TI devices?
As part of the 74LVC family, the SN74LVC257ADR shares identical pinouts and electrical characteristics with other members like the SN74LVC257APWR, enabling seamless migration between package types (e.g., SOIC vs TSSOP) without redesign. This consistency simplifies BOM management and reduces qualification effort in multi-project portfolios. Engineers can leverage existing Gerber files and test fixtures across variants, accelerating time-to-market. However, slight variations in lead finish or packaging material may affect solderability or thermal profiles, so process parameters must be validated per package type despite functional equivalence.
How should the SN74LVC257ADR be handled during prototyping to prevent ESD damage given its MSL 1 classification and SOIC packaging?
Despite MSL 1 indicating unlimited moisture sensitivity, human-body model (HBM) ESD sensitivity for the SN74LVC257ADR is typically Class 2 (2 kV), necessitating careful handling during manual assembly. Ground straps, anti-static wristbands, and conductive foam trays should be used when storing or transporting unbuilt PCBs. Avoid touching exposed leads or soldering iron tips near input pins without proper grounding. During reflow profiling, ensure peak temperature stays below 260°C for less than 10 seconds to preserve bond integrity. Proper ESD protocols extend device lifespan and reduce field failures in early-stage development.
In a multi-master I2C system where multiple masters attempt simultaneous access, could the SN74LVC257ADR inadvertently create race conditions despite its basic switching function?
No—the SN74LVC257ADR lacks bidirectional capability and cannot participate actively in arbitration. It merely routes one of four possible I2C buses to a shared SDA/SCL line based on select inputs. However, if select transitions occur while data is being transferred, partial packets or glitches may appear at the slave end. To prevent corruption, software must ensure select changes only occur during idle periods detected via ACK/NACK responses or timeout mechanisms. Hardware solutions include adding Schottky diodes on SDA/SCL lines to isolate buses during transitions, though this adds complexity. The device itself does not resolve protocol-level conflicts but can exacerbate them if misused.
What are the consequences of violating setup and hold times when using the SN74LVC257ADR as a clock distribution buffer in synchronous FPGA designs?
As a passive multiplexer, the SN74LVC257ADR cannot regenerate clocks or compensate for jitter, making it unsuitable as a primary clock buffer. Its propagation delay variation (±1.5 ns typical) combined with skew between select and data paths introduces uncertainty that may violate FPGA input timing windows. For example, a 50 MHz system with 20 ns period leaves only 5 ns for margin after accounting for worst-case delays. Violating hold times can cause metastability if data arrives too soon after select edges. Instead, use dedicated clock buffers or FPGAs with internal routing resources for precise clock distribution; reserve the SN74LVC257ADR for non-timing-critical signal routing.
How does the SN74LVC257ADR’s output drive strength compare to newer generations like the 74LVC257APWR when sourcing current into inductive loads?
Both variants share identical electrical specs per TI’s datasheet, including 24 mA output sink/source capability and similar RDS(on). However, minor process improvements in newer revisions yield slightly lower leakage and better noise margins at extremes of temperature. When driving inductive loads like relays or motors, back-EMF suppression diodes must be placed close to the output terminals to clamp voltage spikes. The SN74LVC257ADR handles moderate inductance (<10 µH) reasonably well due to its current capacity, but sustained overcurrent conditions could stress bonding wires over time. Always adhere to absolute maximum ratings—continuous current per pin should not exceed 25 mA regardless of package generation.
Why might a designer choose the SN74LVC257ADR over discrete transistor-based multiplexers in space-constrained IoT edge nodes?
Integrated solutions like the SN74LVC257ADR reduce BOM count by eliminating resistors, transistors, and diodes required in discrete implementations. Its 16-SOIC footprint occupies just 6.0 mm² including pads, whereas equivalent discrete designs need 2–3 additional components occupying 10–15 mm². Lower component count decreases failure points, improves reliability, and simplifies certification. Additionally, standardized timing guarantees eliminate worst-case analysis across mismatched parts. For battery-powered IoT devices where size, cost, and longevity matter, the SN74LVC257ADR offers compelling advantages despite marginally higher unit cost than hand-built alternatives.
How does the absence of internal pull-ups on the SN74LVC257ADR select lines impact PCB design in noisy industrial environments?
Unlike some microcontrollers with built-in weak pull-ups, the SN74LVC257ADR requires external resistors to define default select states during power-up or reset. Without them, floating select lines act as antennas, picking up EMI from motor drives or RF sources, leading to unpredictable channel selection. Typical values range from 10 kΩ to 100 kΩ depending on bus loading and noise immunity needs. Placement should be within 5 mm of the IC to minimize stub effects. In harsh environments, stronger pull-ups (4.7 kΩ) combined with shielding or twisted-pair routing enhance robustness against induced transients.
Can the SN74LVC257ADR safely interface with open-collector outputs from legacy sensors without additional buffering?
Yes—but only if the open-collector devices source sufficient current to meet the SN74LVC257ADR’s VIL(max) = 0.8V requirement. Assuming a 3.3V system, the sensor must pull down to <0.8V when active, implying a low output resistance (typically <100 Ω) to overcome input bias currents (~1 µA). Most modern CMOS sensors meet this, but older designs may leave inputs indeterminate. Adding series termination resistors (22 Ω) helps damp reflections without affecting DC levels. No external buffer is needed unless driving distance exceeds 20 cm or environmental noise degrades signal margins significantly.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN74LVC257ADR

Product Attribute SN74LVC257ADBRE4 SN74LVC257ADRG4 SN74LVC257ADBRG4 SN74LVC257ADBR
Part Number SN74LVC257ADBRE4 SN74LVC257ADRG4 SN74LVC257ADBRG4 SN74LVC257ADBR
Manufacturer Luminary Micro / Texas Instruments Texas Instruments Luminary Micro / Texas Instruments Texas Instruments
Voltage - Supply - - - -
Circuit - - - -
Current - Output High, Low - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Type - - - -
Voltage Supply Source - - - -
Independent Circuits - - - -
Series - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42

SN74LVC257ADR Datasheet PDF

Download SN74LVC257ADR pdf datasheets and Texas Instruments documentation for SN74LVC257ADR - Texas Instruments.

Datasheets
SN54LVC257A, SN74LVC257A.pdf
PCN Design/Specification
Mult Devices Font 21/Apr/2018.pdf
HTML Datasheet
SN54LVC257A, SN74LVC257A.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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SN74LVC257ADR Image

SN74LVC257ADR

Texas Instruments
32D-SN74LVC257ADR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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