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HomeProductsIntegrated Circuits (ICs)Data Acquisition - Digital to Analog Converters (DAC)TLV5616IDGK
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TLV5616IDGK - Texas Instruments

Manufacturer Part Number
TLV5616IDGK
Manufacturer
Texas Instruments
Allelco Part Number
32D-TLV5616IDGK
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,299 pcs available, New & Original
Parts Description
IC DAC 12BIT V-OUT 8VSSOP
Package
8-VSSOP
Data sheet
TLV5616IDGK.pdf

HTML Datasheet

TLV5616C, TLV5616I.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 7299
  • Unit Price: $2.103
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.103 $2.10
10+ $1.832 $18.32
30+ $1.671 $50.13
100+ $1.507 $150.70
500+ $1.432 $716.00
1000+ $1.399 $1,399.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TLV5616IDGK Tech Specifications
Texas Instruments - TLV5616IDGK technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TLV5616IDGK

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply, Digital 2.7V ~ 3.3V, 5V
Voltage - Supply, Analog 2.7V ~ 3.3V, 5V
Supplier Device Package 8-VSSOP
Settling Time 20µs
Series -
Reference Type External
Package / Case 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Package Tube
Output Type Voltage - Buffered
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Number of D/A Converters 1
Number of Bits 12
Mounting Type Surface Mount
INL/DNL (LSB) ±1.9, ±0.5
Differential Output No
Data Interface SPI
Base Product Number TLV5616
Architecture String DAC

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TLV5616IDGK Image
TLV5616IDGK (1)

Manufacturer Part Number

TLV5616IDGK

Manufacturer

Texas Instruments

Introduction

The TLV5616IDGK is a 12-bit Digital to Analog Converter (DAC) from Texas Instruments, designed for easy implementation in systems requiring digital to analog signal conversion.

Product Features and Performance

12-bit resolution

Single DAC channel

Fast settling time of 20µs

Buffered voltage output

SPI data interface

External voltage reference required

Supports analog supply voltage from 2.7V to 5V

Digital supply voltage range from 2.7V to 5V

String DAC architecture

Operating temperature range from -40°C to 85°C

Surface mount package

Product Advantages

High-resolution 12-bit output for precise analog output

Quick response with 20µs settling time helps to achieve fast system performance

Buffered output ensures drive capabilities

Flexible voltage support accommodates various system designs

Key Technical Parameters

Number of Bits: 12

Settling Time: 20µs

Output Type: Voltage Buffered

Data Interface: SPI

Voltage Supply, Analog: 2.7V ~ 3.3V, 5V

Voltage Supply, Digital: 2.7V ~ 3.3V, 5V

INL/DNL (LSB): ±1.9, ±0.5

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

String DAC architecture for precise and stable performance

Built to operate reliably in a temperature range of -40°C to 85°C

Compatibility

Compatible with systems requiring SPI interface for data transfer

Supports multiple voltage levels for flexible integration into various designs

Application Areas

Industrial automation systems

Data acquisition systems

Digital control systems

Temperature control systems

Product Lifecycle

Currently active product

No immediate discontinuation announced

Support for future upgrades and replacements available

Several Key Reasons to Choose This Product

High precision 12-bit resolution ideal for sensitive applications

Quick settling time enabling real-time performance

Robust operation over a wide range of temperatures makes it suitable for industrial environments

Easy integration due to SPI interface and voltage flexibility

Frequently Asked Questions(FAQ)

How does the TLV5616IDGK's INL and DNL performance compare to other 12-bit DACs in similar voltage supply ranges, and what implications does this have for precision analog output applications?
The TLV5616IDGK exhibits an integral nonlinearity (INL) of ±1.9 LSB and a differential nonlinearity (DNL) of ±0.5 LSB, which indicates relatively high linearity for a string architecture DAC operating within a single-channel configuration. When compared to pipeline or successive approximation register (SAR) based 12-bit DACs in the same 2.7V–3.3V/5V supply range, such as the MCP4921 or AD5668, the TLV5616 typically shows slightly inferior INL due to its string topology limitations. However, the DNL performance is competitive, especially given the cost and simplicity advantages. For applications requiring absolute accuracy below 2 LSB RMS, external calibration may be necessary unless the system operates within tight signal bandwidth constraints where dynamic linearity dominates.
What are the key trade-offs when selecting the TLV5616IDGK over higher-speed 12-bit DAC alternatives like the DAC8562 or DAC8734 from TI, particularly in terms of settling time and noise performance?
The TLV5616IDGK offers a settling time of 20µs, which is significantly slower than modern CMOS-based DACs such as the DAC8562 (typically <1µs). This makes it unsuitable for high-throughput data acquisition systems or wideband signal generation. However, the string architecture contributes to lower glitch energy and better inherent power supply rejection, resulting in cleaner outputs at lower frequencies. While the TLV5616 lacks the multi-channel capability of the DAC8734, its single-channel design simplifies control logic and reduces SPI overhead—making it preferable in space-constrained, low-to-moderate speed applications where absolute precision outweighs speed.
Can the TLV5616IDGK be used reliably in industrial environments with temperature fluctuations between -40°C and 85°C, and how do its electrical characteristics hold up under these conditions?
Yes, the TLV5616IDGK is specified for operation across the full -40°C to +85°C range, making it suitable for industrial-grade applications. Within this interval, the reference input sensitivity and internal resistor ladder tolerances remain stable enough to maintain INL within ±2 LSB, assuming a well-buffered external reference. However, users should verify that the chosen external voltage reference also meets industrial temperature compliance. Additionally, long-term drift of the internal components may introduce minor offset shifts over time, so periodic recalibration might be needed in mission-critical systems.
Why would one choose an external reference for the TLV5616IDGK instead of relying on internal references, and what impact does reference selection have on overall system accuracy?
The TLV5616IDGK requires an external reference because it lacks an internal bandgap or voltage reference. Selecting a high-precision, low-noise external reference—such as the REF5025 or ADR391—can improve system-level accuracy by reducing gain errors and improving stability across temperature. Since the full-scale output scales directly with the reference voltage, mismatches between the reference and supply rails can lead to gain inaccuracies. Using a well-regulated, low-drift reference ensures consistent output amplitude, which is critical in closed-loop control systems or measurement instrumentation.
How does the SPI interface implementation affect timing requirements when integrating the TLV5616IDGK into a microcontroller-based system, and what clock speeds are practical for reliable communication?
The TLV5616IDGK uses standard SPI protocol with synchronous serial data transfer. It supports clock rates up to 20 MHz, though typical implementations use 5–10 MHz due to PCB trace capacitance and microcontroller limitations. The device requires careful attention to setup and hold times around the rising edge of SCLK, especially if using long cables or shared bus lines. Because the DAC accepts data in 16-bit frames (control byte followed by data), timing margins become tighter at higher frequencies. Designers should consult both the MCU’s SPI peripheral specifications and the DAC’s timing diagram to avoid misalignment or incomplete writes.
What considerations apply when cascading multiple TLV5616IDGK devices via SPI, and how can daisy-chaining be implemented without compromising data integrity?
While the TLV5616IDGK supports daisy-chained SPI configurations, doing so requires precise control over chip select (CS) timing and proper isolation of each device’s output. Each DAC must receive its own dedicated CS line or use open-drain CS with pull-up resistors to prevent contention. Alternatively, software-based addressing can be employed by including unique control bits in the transmitted command byte. However, due to the single-channel nature of the TLV5616, adding more channels increases component count and board area compared to multi-DAC solutions like the DAC8562. Therefore, daisy-chaining is only justified if channel count expansion is minimal and cost-sensitive.
In what scenarios would the buffered output of the TLV5616IDGK provide significant benefits over unbuffered alternatives, and how does loading affect performance?
The buffered output improves drive strength and reduces output impedance, allowing the TLV5616IDGK to source or sink current effectively without degrading linearity. This is beneficial when driving capacitive loads (e.g., op-amp inputs or cable capacitances >100pF) or resistive loads below 1kΩ. Without buffering, excessive loading causes droop and increased settling time. In battery-powered systems, however, the active buffer consumes additional quiescent current, potentially impacting power efficiency. For low-current applications (<1mA), an external buffer may still be preferred to preserve resolution.
How does the choice of package (8-VSSOP) influence thermal and layout constraints when integrating the TLV5616IDGK into compact designs, and what soldering precautions are recommended?
The 8-VSSOP package measures 3mm × 3mm with a 0.5mm pitch, enabling high-density layouts but presenting challenges for manual assembly and reflow profiling. Its small size limits heat dissipation, though the TLV5616’s low power consumption (<1mW typ.) minimizes thermal concerns. During reflow soldering, peak temperatures should not exceed 245°C for MSL 1 devices to avoid delamination. Adequate pad design and solder paste volume ensure reliable connections, while avoiding tombstoning during placement. Thermal vias beneath the package can help stabilize junction temperature in harsh environments.
What role does the Moisture Sensitivity Level (MSL) classification play in storage and handling of the TLV5616IDGK, and how should inventory management adapt accordingly?
Classified as MSL 1, the TLV5616IDGK is exempt from moisture sensitivity warnings and can be stored indefinitely under normal conditions without baking prior to use. This simplifies procurement planning and shelf-life management, especially for long-term projects. However, once opened, the device should be consumed within the manufacturer-recommended timeframe (usually 6 months) if not kept in hermetically sealed packaging. Proper ESD protection remains essential during handling due to the sensitive gate oxides in CMOS processes.
How does the RoHS3 and REACH compliance status of the TLV5616IDGK align with global regulatory standards, and what documentation is typically required for compliance audits?
The TLV5616IDGK is RoHS3 compliant and unaffected by REACH regulations, meaning it contains no restricted substances above threshold levels and does not require SVHC declaration. Manufacturers and distributors usually provide Certificates of Compliance and material composition reports upon request. These documents support environmental certifications such as ISO 14001 or conflict minerals reporting, particularly important for automotive or medical end markets where supply chain transparency is mandated.
What are the implications of using the TLV5616IDGK in battery-powered portable equipment, considering its supply voltage range and quiescent current behavior?
Operating from 2.7V to 5V allows the TLV5616IDGK to integrate seamlessly into single-cell Li-ion or alkaline-powered systems. At 3.3V supply, typical quiescent current is under 1µA, contributing minimally to standby drain. However, the SPI interface and output buffer draw current during active conversion periods, which may necessitate duty-cycling in ultra-low-power designs. To extend battery life, firmware should disable unused peripherals and minimize write frequency. The absence of internal references further reduces complexity and leakage paths, enhancing suitability for wearable or IoT sensor nodes.
How does the string DAC architecture of the TLV5616IDGK compare in terms of monotonicity and glitch impulse to switched-capacitor or current-steering types in dynamic switching applications?
As a string DAC, the TLV5616IDGK inherently maintains monotonic behavior across all codes due to its resistor network structure, unlike some early SAR DACs that could exhibit non-monotonic transitions under poor layout conditions. Glitch energy is generally low compared to switched-capacitor designs, which can generate transient currents during code changes. However, string DACs suffer from limited resolution and temperature coefficient matching compared to R-2R ladders or segmented architectures. For slow-changing signals or DC-coupled outputs, this trade-off favors reliability and simplicity over high-speed performance.
What layout best practices should be followed when routing signals near the TLV5616IDGK to minimize noise coupling and preserve output integrity?
Place the TLV5616IDGK away from high-speed digital traces, switching regulators, and RF sources to prevent electromagnetic interference. Keep the analog ground return path short and separate from digital grounds at a single point near the power entry. Route the external reference input differentially if possible, and bypass both analog and digital supplies with 0.1µF ceramic capacitors placed within 2mm of the VDD pins. Avoid vias on sensitive signal lines to reduce impedance discontinuities. Ground planes under the package enhance shielding and thermal performance.
Can the TLV5616IDGK be used for PWM-to-analog filtering applications, and what filter design considerations arise from its 20µs settling time?
Yes, the TLV5616IDGK can serve as the final stage in a digital-to-analog conversion chain after a PWM modulator, provided the update rate exceeds twice the desired analog bandwidth. Given its 20µs settling time, the effective bandwidth is approximately 1/(2π × 20µs) ≈ 8 kHz. Thus, anti-imaging filters must be designed accordingly, using second-order RC or active Butterworth topologies with cutoff frequencies well below this limit. Oversampling the digital input further improves SNR and eases filter requirements, making the TLV5616 viable for audio-level reconstruction or sensor calibration loops.
How does the absence of built-in offset/gain calibration features in the TLV5616IDGK affect system-level error budgets, and what mitigation strategies exist?
Without internal trimming circuits, the TLV5616IDGK relies entirely on external precision components and careful PCB layout to minimize offset and gain errors. Typical initial accuracy might be ±1 LSB or worse depending on resistor matching and reference stability. System designers must allocate margin in their error budget for these uncertainties, possibly reserving a portion of the 12-bit word for fine-tuning via software gain adjustment. Calibration routines using known reference voltages can compensate for drift over temperature, though they add firmware complexity.
What is the significance of the HTSUS code 8542.39.0001 for the TLV5616IDGK, and how does it impact import duties and customs classification in international supply chains?
The Harmonized Tariff Schedule of the United States (HTSUS) code 8542.39.0001 classifies the TLV5616IDGK as a "Electronic integrated circuits: Processors and controllers," specifically excluding microprocessors and digital signal processors. This designation generally results in moderate duty rates (typically 0–2.5% depending on origin) and facilitates smoother cross-border logistics. Accurate classification avoids customs delays and ensures compliance with trade agreements, particularly beneficial for OEMs sourcing globally for mass production.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TLV5616IDGK

Product Attribute TLV5616IDGKR TLV5616IDGKG4 TLV5616CDGKRG4 TLV5616IDG4
Part Number TLV5616IDGKR TLV5616IDGKG4 TLV5616CDGKRG4 TLV5616IDG4
Manufacturer Texas Instruments Luminary Micro / Texas Instruments Texas Instruments Luminary Micro / Texas Instruments
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Architecture - Current Source R-2R Pipelined
Reference Type - External, Internal External External, Internal
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of D/A Converters - 4 4 -
Number of Bits - 16 8 14
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Settling Time - 10ns (Typ) 4.5µs -
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
Data Interface - LVDS - Parallel I²C LVDS - Parallel, Parallel
INL/DNL (LSB) - ±4, ±2 ±1 (Max), ±1 (Max) -
Differential Output - Yes No -
Output Type - Current - Unbuffered Voltage - Buffered -
Series - - - -

TLV5616IDGK Datasheet PDF

Download TLV5616IDGK pdf datasheets and Texas Instruments documentation for TLV5616IDGK - Texas Instruments.

HTML Datasheet
TLV5616C, TLV5616I.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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TLV5616IDGK Image

TLV5616IDGK

Texas Instruments
32D-TLV5616IDGK

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