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HomeProductsIntegrated Circuits (ICs)Data Acquisition - Digital to Analog Converters (DAC)TLV5616CDRG4
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TLV5616CDRG4 - Texas Instruments

Manufacturer Part Number
TLV5616CDRG4
Manufacturer
Texas Instruments
Allelco Part Number
32D-TLV5616CDRG4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,470 pcs available, New & Original
Parts Description
IC DAC 12BIT V-OUT 8SOIC
Package
8-SOIC
Data sheet
TLV5616CDRG4.pdf

HTML Datasheet

TLV5616C, TLV5616I.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 5470
  • Unit Price: $4.616
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1+ $4.616 $4.62
10+ $4.616 $46.16
30+ $4.616 $138.48
200+ $1.787 $357.40
500+ $1.724 $862.00
1000+ $1.693 $1,693.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TLV5616CDRG4 Tech Specifications
Texas Instruments - TLV5616CDRG4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TLV5616CDRG4

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply, Digital 2.7V ~ 3.3V, 5V
Voltage - Supply, Analog 2.7V ~ 3.3V, 5V
Supplier Device Package 8-SOIC
Settling Time 20µs
Series -
Reference Type External
Package / Case 8-SOIC (0.154", 3.90mm Width)
Package Tape & Reel (TR)
Output Type Voltage - Buffered
Product Attribute Attribute Value
Operating Temperature 0°C ~ 70°C
Number of D/A Converters 1
Number of Bits 12
Mounting Type Surface Mount
INL/DNL (LSB) ±1.9, ±0.5
Differential Output No
Data Interface SPI
Base Product Number TLV5616
Architecture String DAC

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TLV5616CDRG4 Image
TLV5616CDRG4 (1)

Manufacturer Part Number

TLV5616CDRG4

Manufacturer

Texas Instruments

Introduction

The TLV5616CDRG4 is a 12-bit Digital to Analog Converter designed for easy integration into various data acquisition and control applications, providing a voltage-buffered output.

Product Features and Performance

12-bit resolution for precise data conversion

Fast settling time of 20µs enables quick response to change

Voltage-buffered output ensures stable and consistent performance

SPI data interface allows for easy integration with microcontrollers and digital systems

External reference type grants flexibility in setting the voltage levels

Compatible with both 2.7V ~ 3.3V and 5V supply voltages for analog and digital parts

The architecture is based on a String DAC for reliable conversion

Operates within a 0°C ~ 70°C temperature range accommodating most environmental conditions

Product Advantages

The compact 8-SOIC package saves space on PCB designs

Surface mount design facilitates easier and faster assembly

Precision of ±1.9 INL and ±0.5 DNL ensures accurate signal conversion

Low power consumption suitable for battery-powered devices

Key Technical Parameters

Number of Bits: 12

Number of D/A Converters: 1

Settling Time: 20µs

Output Type: Voltage Buffered

Differential Output: No

Data Interface: SPI

Reference Type: External

Voltage Supply, Analog: 2.7V ~ 3.3V, 5V

Voltage Supply, Digital: 2.7V ~ 3.3V, 5V

INL/DNL (LSB): ±1.9, ±0.5

Operating Temperature: 0°C ~ 70°C

Package / Case: 8-SOIC

Mounting Type: Surface Mount

Quality and Safety Features

Compliant with industry-standard quality and safety protocols ensuring reliable performance in various application settings.

Compatibility

SPI communication interface for broad compatibility with digital systems

Supports a wide range of supply voltages for versatile use across different power environments

Application Areas

Industrial control systems

Data acquisition systems

Portable instrumentation

Analog output drives for digital systems

Product Lifecycle

Discontinued at Digi-Key, but alternatives or upgrades may be available directly through Texas Instruments or other distributors.

Several Key Reasons to Choose This Product

Precision data conversion with a 12-bit resolution improves system accuracy.

Fast settling time enhances system responsiveness.

Flexible voltage supply options ensure compatibility with various electronic designs.

Low power consumption benefits portable and battery-operated devices.

The compact package offers a solution for space-constrained applications.

Broad application scope from industrial control to portable instrumentation.

Frequently Asked Questions(FAQ)

How does the TLV5616CDRG4 handle output settling time in a 20µs system with multiple DAC updates per second, and what design considerations arise from its string architecture?
The TLV5616CDRG4 has a specified settling time of 20µs, which directly impacts the maximum update rate achievable in continuous-output applications. In a system requiring frequent updates—such as one operating at 50 kSPS (kilo-samples per second)—the DAC must settle fully before the next conversion begins to avoid glitches or inaccuracies. Given the string architecture, this device relies on internal resistor networks to generate analog outputs, which can introduce propagation delays and sensitivity to supply noise. Designers must ensure sufficient guard time between SPI transactions and account for potential variations due to temperature drift within the 0°C to 70°C range. While the settling time is adequate for moderate-speed applications, systems demanding faster response or higher linearity may require external buffering or alternative architectures.
What are the implications of using an external voltage reference with the TLV5616CDRG4 when targeting high-precision analog outputs, and how does INL affect real-world accuracy?
Because the TLV5616CDRG4 supports an external reference, designers can optimize precision by selecting a low-drift, low-noise reference such as the REF5030 or ADR391. This allows tighter control over the full-scale output range compared to internal references. However, the integral nonlinearity (INL) of ±1.9 LSB introduces non-ideal step placement across the code range, meaning that even with perfect coding, the actual analog output may deviate from the ideal by up to nearly two least significant bits. For example, in a 12-bit system spanning 3.3 V, this equates to a potential deviation of about 2 mV at midscale. When combined with DNL of ±0.5 LSB, which ensures monotonicity but limits differential accuracy, total error budgets must include these nonlinearities. Therefore, calibration routines or post-processing may be necessary in measurement or control loops where absolute accuracy is critical.
Can the TLV5616CDRG4 drive capacitive loads effectively without additional buffering, and what risks exist if it connects directly to sensitive analog circuitry?
The TLV5616CDRG4 features a buffered output stage capable of driving moderate capacitive loads, but its ability to do so depends heavily on the magnitude of capacitance and load impedance. Direct connection to large capacitors or long PCB traces can cause overshoot, ringing, or extended settling times beyond the 20µs specification due to RC time constants. In worst-case scenarios, such as driving 100 pF through a 50 Ω source impedance, transient responses may degrade significantly. Connecting the output directly to high-impedance stages like op-amp inputs without isolation increases susceptibility to noise injection and instability. It is generally advisable to use series resistance (e.g., 10–50 Ω) at the DAC output to dampen oscillations and protect against charge injection effects inherent in digital-to-analog switching.
How should power sequencing be managed when using both analog and digital supplies of the TLV5616CDRG4, given its dual-supply voltage ranges?
The TLV5616CDRG4 accepts simultaneous analog and digital supplies ranging from 2.7 V to 3.3 V or 5 V, but mismatched or poorly sequenced rail voltages can lead to latch-up or data corruption. Since the device shares common ground but decouples internal logic and analog sections, it is essential to ensure that neither supply exceeds the other by more than the absolute maximum ratings (typically ±0.3 V). In mixed-voltage environments, always bring up digital VDD first to establish proper logic thresholds before enabling analog VDDA. If using 5 V for digital rails and 3.3 V for analog, consider level-shifting signals accordingly. Additionally, decoupling capacitors (e.g., 100 nF ceramic near each pin) help stabilize each supply during transient events, preventing digital noise from coupling into the sensitive analog path.
What are the key differences between the TLV5616CDRG4 and the TLV5616CDR, particularly regarding package compatibility and long-term reliability?
The TLV5616CDRG4 and TLV5616CDR differ primarily in packaging: the RG4 variant uses the same 8-SOIC footprint but includes enhanced moisture sensitivity labeling and possibly stricter manufacturing controls under TI’s Green packaging initiative. Both share identical electrical characteristics, including 12-bit resolution, SPI interface, and 20 µs settling time. However, the RG4 designation often appears in newer production batches with updated RoHS compliance documentation and improved handling instructions for automated assembly lines. From a design perspective, they are functionally interchangeable in most applications, provided solder reflow profiles remain within JEDEC standards. Engineers should verify current availability and shelf-life expectations, as MSL 1 implies unlimited floor life only if stored properly.
Is it feasible to cascade multiple TLV5616CDRG4 devices to extend output channels, and what challenges emerge from shared clocking and timing alignment?
Cascading multiple TLV5616CDRG4 units via SPI is technically possible by daisy-chaining their serial inputs and asserting chip-select lines individually. However, each DAC has independent settling behavior, and cumulative propagation delay across the chain can misalign update timing. For instance, if three devices are used, the third may not settle fully before the next frame starts, introducing skew errors in multi-channel systems. Synchronization becomes critical when outputs are meant to act in concert, such as in waveform generation or phased arrays. Moreover, the string architecture lacks inherent channel-to-channel matching, so gain and offset errors accumulate across units. Unless compensated through calibration or using integrated multi-DAC solutions, cascading offers limited benefit for precision applications and increases firmware complexity.
How does the operating temperature range of 0°C to 70°C influence performance stability in industrial environments, and what compensation strategies apply?
Operating across 0°C to 70°C exposes the TLV5616CDRG4 to thermal gradients that affect both the string DAC’s resistor ladder and any external reference. Resistor mismatch in the internal string degrades over temperature, potentially increasing INL beyond the specified ±1.9 LSB. Similarly, if an external reference exhibits poor TC (temperature coefficient), full-scale output shifts occur. In contrast, military-grade alternatives might offer better specs but exceed this part’s commercial-grade profile. To mitigate drift, designers should select components with tight temperature tolerances and implement software-based linearization or periodic recalibration. Monitoring ambient conditions and avoiding localized heating near the IC also preserves baseline accuracy. Note that exceeding the max junction temperature (not explicitly stated but implied by ambient limits) risks permanent damage regardless of input conditions.
Why might a designer choose a string DAC architecture like the TLV5616CDRG4 instead of successive approximation register (SAR) or sigma-delta types, despite trade-offs in speed and linearity?
The string DAC architecture provides inherently monotonic output behavior with excellent DNL performance (±0.5 LSB), making it suitable for applications requiring guaranteed monotonic transitions such as digital potentiometers or simple control loops. Unlike SAR DACs, which trade off speed for resolution, the string DAC delivers consistent settling times regardless of code changes, beneficial in stepped voltage applications. Compared to sigma-delta converters, it avoids complex decimation filters and achieves faster conversion rates with lower power consumption—important in battery-powered edge devices. The TLV5616CDRG4 thus strikes a balance between cost, simplicity, and predictable performance in medium-resolution, moderate-speed roles. Its buffered output also simplifies interfacing without needing additional amplification stages, reducing board space and component count.
What precautions are necessary when routing SPI signals near the TLV5616CDRG4 to minimize electromagnetic interference and ensure reliable communication?
To maintain robust SPI communication with the TLV5616CDRG4, keep signal traces short and avoid parallel routing with noisy lines such as clock generators or switching regulators. Terminate unused pins (e.g., NC or RESET) with pull-down resistors or tie them to appropriate rails per datasheet recommendations. Clock rates above 1 MHz should employ controlled impedance routing if trace lengths exceed λ/10 (~3 cm at 10 MHz). Decouple VDD pins with 100 nF capacitors placed within 5 mm of each pin to suppress high-frequency noise. Also, isolate digital return currents from analog grounds using split planes or ferrite beads if necessary. These practices preserve data integrity, especially important given the 12-bit resolution where single-bit errors translate to ~0.8 mV inaccuracies at 3.3 V full scale.
How does the choice of external reference affect effective number of bits (ENOB) in practical implementations using the TLV5616CDRG4?
The ENOB of the TLV5616CDRG4 is constrained not only by its INL/DNL but also by the quality of the external reference. A high-stability reference like the REF5025 (±5 ppm/°C drift) yields higher effective resolution than one with loose specs (e.g., ±50 ppm/°C). Assuming ideal conditions, the theoretical ENOB is approximately 11.5 bits due to INL limitations. However, adding reference noise or ripple reduces this further; for example, 10 mV RMS reference noise at 3.3 V full scale corresponds to ~1 LSB error, lowering ENOB to around 11 bits. Thus, achieving optimal performance requires pairing the DAC with a clean, stable reference and accounting for all noise sources in the signal chain—including power supply ripple and PCB layout artifacts.
Can the TLV5616CDRG4 be used in battery-operated devices, and what factors determine its power efficiency relative to other 12-bit DACs?
Yes, the TLV5616CDRG4 can operate efficiently in low-power applications, drawing typically less than 1 mA at 3.3 V when active. Its string architecture avoids the dynamic power overhead of switched-capacitor designs found in some SAR DACs, offering better static power savings. However, idle current consumption rises slightly during active conversion cycles due to internal biasing networks. For intermittent duty cycles—common in sensor conditioning or alarm systems—this makes it viable for coin-cell powered devices. Compared to delta-sigma DACs optimized for ultra-low power, however, the TLV5616 trades off peak throughput for simplicity. Designers should disable the device via hardware shutdown (if available) or software commands during inactive periods to minimize leakage and extend battery life.
What impact does supply voltage variation have on output swing and gain accuracy in the TLV5616CDRG4, especially when stepping between 2.7 V and 5 V modes?
Supply voltage affects the absolute output range and internal reference scaling. When operating at 2.7 V, the maximum output swing is reduced proportionally compared to 5 V operation, assuming the same external reference. For example, with a 2.5 V reference, output spans from 0 V to 2.5 V regardless of VDD, but noise margins shrink at lower supplies. Additionally, supply rejection ratio (SSR) degrades outside optimal ranges, allowing fluctuations in VDD to modulate the output. At 2.7 V, even 100 mV of ripple can induce noticeable glitches, whereas at 5 V, tolerance improves due to higher PSRR headroom. Designers targeting variable-supply systems should either fix the supply rail or ensure tight regulation (±1% or better) and verify performance across the entire voltage range during qualification testing.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TLV5616CDRG4

Product Attribute TLV5616CDGKRG4 TLV5616CDG4 TLV5616IDG4 TLV5616CDGK
Part Number TLV5616CDGKRG4 TLV5616CDG4 TLV5616IDG4 TLV5616CDGK
Manufacturer Texas Instruments Texas Instruments Luminary Micro / Texas Instruments Texas Instruments
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
Data Interface - LVDS - Parallel I²C LVDS - Parallel, Parallel
Output Type - Current - Unbuffered Voltage - Buffered -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Architecture - Current Source R-2R Pipelined
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Differential Output - Yes No -
INL/DNL (LSB) - ±4, ±2 ±1 (Max), ±1 (Max) -
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V
Number of D/A Converters - 4 4 -
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of Bits - 16 8 14
Series - - - -
Reference Type - External, Internal External External, Internal
Settling Time - 10ns (Typ) 4.5µs -

TLV5616CDRG4 Datasheet PDF

Download TLV5616CDRG4 pdf datasheets and Texas Instruments documentation for TLV5616CDRG4 - Texas Instruments.

HTML Datasheet
TLV5616C, TLV5616I.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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TLV5616CDRG4 Image

TLV5616CDRG4

Texas Instruments
32D-TLV5616CDRG4

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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