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HomeProductsIntegrated Circuits (ICs)Data Acquisition - Digital to Analog Converters (DAC)TLV5616CDGK
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TLV5616CDGK - Texas Instruments

Manufacturer Part Number
TLV5616CDGK
Manufacturer
Texas Instruments
Allelco Part Number
32D-TLV5616CDGK
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,581 pcs available, New & Original
Parts Description
IC DAC 12BIT V-OUT 8VSSOP
Package
8-VSSOP
Data sheet
TLV5616CDGK.pdf

HTML Datasheet

TLV5616C, TLV5616I.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 6581
  • Unit Price: $8.824
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $8.824 $8.82
200+ $3.416 $683.20
500+ $3.295 $1,647.50
1000+ $3.237 $3,237.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TLV5616CDGK Tech Specifications
Texas Instruments - TLV5616CDGK technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TLV5616CDGK

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply, Digital 2.7V ~ 3.3V, 5V
Voltage - Supply, Analog 2.7V ~ 3.3V, 5V
Supplier Device Package 8-VSSOP
Settling Time 20µs
Series -
Reference Type External
Package / Case 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Package Tube
Output Type Voltage - Buffered
Product Attribute Attribute Value
Operating Temperature 0°C ~ 70°C
Number of D/A Converters 1
Number of Bits 12
Mounting Type Surface Mount
INL/DNL (LSB) ±1.9, ±0.5
Differential Output No
Data Interface SPI
Base Product Number TLV5616
Architecture String DAC

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

TLV5616CDGK Image
TLV5616CDGK (1)

Manufacturer Part Number

TLV5616CDGK

Manufacturer

Texas Instruments

Introduction

The TLV5616CDGK is a 12-bit digital-to-analog converter (DAC) designed for easy interfacing to microcontrollers.

Product Features and Performance

12-bit resolution

One D/A converter channel

20µs settling time

Buffered voltage output

SPI data interface

External reference voltage

Dual supply voltage support for analog and digital circuits

String DAC architecture

Industrial operating temperature range from 0°C to 70°C

Product Advantages

Low power consumption

High integration level with built-in output amplifier

Simple SPI interface for digital communications

Competitive accuracy with INL/DNL of ±1.9LSB and ±0.5LSB

Supports a wide range of supply voltages for flexible design options

Key Technical Parameters

Number of Bits: 12

Settling Time: 20µs

Output Type: Voltage - Buffered

Reference Type: External

Voltage - Supply, Analog: 2.7V ~ 3.3V, 5V

Voltage - Supply, Digital: 2.7V ~ 3.3V, 5V

INL/DNL (LSB): ±1.9, ±0.5

Operating Temperature: 0°C ~ 70°C

Quality and Safety Features

Precise calibration ensures accuracy

Robust design capable of operating in commercial temperature ranges

Compatibility

SPI interface compatible with many microcontrollers

Application Areas

Data acquisition systems

Process control

Instrumentation

Medical equipment

Battery-operated devices

Product Lifecycle

Active status

Not currently nearing discontinuation

Replacement or upgrade options may be available

Several Key Reasons to Choose This Product

High resolution of 12-bits tailored for precision applications

Fast settling time suitable for real-time data processing

Low-integral and differential nonlinearity errors enhance the accuracy of output signals

Flexible operation with multiple supply voltage options cater to diverse power requirements

The compact 8-VSSOP package enables miniaturization of PCB designs

Surface mount compatible for modern automated PCB assembly processes

Direct interfacing with a variety of microcontrollers facilitates ease of integration into existing systems

Frequently Asked Questions(FAQ)

How does the settling time of the TLV5616CDGK compare to typical requirements in industrial sensor signal conditioning applications, and what design implications does this impose?
The TLV5616CDGK achieves a settling time of 20 µs, which is suitable for moderate-speed analog output tasks such as driving precision voltage references in sensor front-end conditioning. While this meets basic requirements for many industrial control loops operating below 50 kHz update rates, it may introduce latency in high-precision measurement systems requiring sub-10 µs response. Designers should evaluate whether this settling behavior aligns with closed-loop bandwidth needs, especially when interfacing with high-gain amplifiers or active filter stages where timing mismatches can degrade linearity.
What are the key trade-offs between using the TLV5616CDGK with an external versus internal reference in terms of accuracy, noise performance, and system complexity?
The TLV5616CDGK supports external reference operation, allowing users to select higher-grade references for improved INL/DNL performance—critical in applications demanding better than ±1 LSB integral nonlinearity. However, relying on an external reference increases board space, adds cost, and introduces additional noise coupling paths if not properly decoupled. In contrast, using an integrated (if available) internal reference simplifies layout but may compromise absolute accuracy and long-term stability compared to precision shunt or bandgap references like those from TI’s REF series.
How does the architecture of the TLV5616CDGK influence its susceptibility to glitches during SPI data transitions, and how can this be mitigated in real-world designs?
As a string DAC, the TLV5616CDGK inherently exhibits potential glitch energy during code transitions due to charge redistribution across capacitive nodes in the resistor ladder. This effect is more pronounced at high-frequency SPI updates unless careful attention is paid to power supply decoupling and output filtering. To minimize impact, designers often add RC low-pass networks at the output or ensure that SPI write operations update only once per control cycle rather than streaming data continuously. Additionally, using buffered output modes helps isolate downstream circuits from transient artifacts.
Can the TLV5616CDGK drive loads beyond 1 kΩ without degradation in output accuracy, and what happens if capacitive loading exceeds 10 nF?
The buffered output stage of the TLV5616CDGK can typically drive resistive loads down to a few hundred ohms with minimal droop, but performance degrades significantly with capacitive loads above approximately 10 nF due to increased settling time and potential oscillation risk. In such cases, an external unity-gain buffer op-amp (e.g., OPAx series from TI) should be inserted between the DAC and load to maintain stability and speed. Without buffering, phase margin degradation may result in overshoot or extended settling beyond the specified 20 µs limit.
Why might a designer choose the VSSOP package variant over standard TSSOP when integrating the TLV5616CDGK into compact handheld instrumentation?
The 8-VSSOP package used in the TLV5616CDGK offers a slightly smaller footprint (3.0 mm width vs. 4.4 mm) and reduced pin spacing, enabling tighter routing in space-constrained designs. For handheld medical or portable test equipment where board real estate is limited, this enables higher component density while maintaining adequate thermal dissipation given the device’s low power consumption. However, VSSOP requires compatible pick-and-place equipment and may present slightly greater soldering challenges due to narrower leads.
How does temperature drift affect INL and DNL specifications over the full operating range of 0°C to 70°C, and is calibration required for precision applications?
Although the datasheet lists INL and DNL at room temperature (±1.9 LSB and ±0.5 LSB respectively), these values do not account for temperature-induced offset shifts across the -40°C to +85°C industrial range. Over 70°C of operational span, resistor matching in the string DAC structure can shift, degrading effective resolution. In high-accuracy systems (e.g., >14-bit equivalent), periodic calibration routines or use of temperature-compensated references become necessary. For most general-purpose control applications, however, the TLV5616CDGK’s behavior remains sufficiently stable without active compensation.
Is it possible to cascade multiple TLV5616CDGK devices via SPI to extend dynamic range, and what synchronization considerations apply?
Yes, multiple TLV5616CDGK units can be daisy-chained using their SPI interface by connecting the DOUT pin of one to the DIN of the next. However, each device must be addressed individually through chip-select signals or software-based frame sequencing to prevent bus contention. Careful attention to propagation delays and clock skew is needed to maintain correct timing alignment, particularly when updating all DACs simultaneously for coordinated analog output generation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TLV5616CDGK

Product Attribute TLV5616CDGKR TLV5616CDGKRG4 TLV5616IDGK TLV5616CDG4
Part Number TLV5616CDGKR TLV5616CDGKRG4 TLV5616IDGK TLV5616CDG4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Bits - 16 8 14
Differential Output - Yes No -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V
Architecture - Current Source R-2R Pipelined
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of D/A Converters - 4 4 -
Output Type - Current - Unbuffered Voltage - Buffered -
INL/DNL (LSB) - ±4, ±2 ±1 (Max), ±1 (Max) -
Reference Type - External, Internal External External, Internal
Data Interface - LVDS - Parallel I²C LVDS - Parallel, Parallel
Settling Time - 10ns (Typ) 4.5µs -

TLV5616CDGK Datasheet PDF

Download TLV5616CDGK pdf datasheets and Texas Instruments documentation for TLV5616CDGK - Texas Instruments.

HTML Datasheet
TLV5616C, TLV5616I.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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TLV5616CDGK Image

TLV5616CDGK

Texas Instruments
32D-TLV5616CDGK

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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