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HomeProductsIntegrated Circuits (ICs)Memory24LC64-E/SM
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24LC64-E/SM - Microchip Technology

Manufacturer Part Number
24LC64-E/SM
Manufacturer
Microchip Technology
Allelco Part Number
98D-24LC64-E/SM
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,822 pcs available, New & Original
Parts Description
IC EEPROM 64KBIT I2C 8SOIJ
Package
8-SOIJ
Data sheet
24LC64-E/SM.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 31822
  • Unit Price: $1.645
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.645 $1.65
10+ $1.425 $14.25
30+ $1.288 $38.64
100+ $1.147 $114.70
500+ $1.083 $541.50
1000+ $1.055 $1,055.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

24LC64-E/SM Tech Specifications
Microchip Technology - 24LC64-E/SM technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - 24LC64-E/SM

Product Attribute Attribute Value
Manufacturer Microchip Technology
Write Cycle Time - Word, Page 5ms
Voltage - Supply 2.5V ~ 5.5V
Technology EEPROM
Supplier Device Package 8-SOIJ
Series -
Package / Case 8-SOIC (0.209', 5.30mm Width)
Package Tube
Operating Temperature -40°C ~ 125°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 64Kbit
Memory Organization 8K x 8
Memory Interface I²C
Memory Format EEPROM
Clock Frequency 400 kHz
Base Product Number 24LC64
Access Time 900 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0051

Frequently Asked Questions(FAQ)

How does the 24LC64-E/SM handle write cycles in a high-vibration industrial environment, and what is the expected endurance under continuous operation at 125°C?
The 24LC64-E/SM supports up to 1 million write cycles per memory location, which remains valid across the full operating temperature range of -40°C to 125°C. At 125°C, internal charge pump efficiency decreases slightly due to semiconductor behavior, but the EEPROM architecture maintains reliable program/erase operations with 5ms word/page write times. In vibration-prone applications, the surface-mount SOIJ package offers robust mechanical attachment when paired with proper PCB layout and solder profile selection. Engineers should avoid exceeding 100 write cycles per hour during continuous data logging to preserve long-term reliability.
What are the key differences between the 24LC64-E/SM and the standard 24LC64 in terms of packaging and thermal performance?
The 24LC64-E/SM uses an 8-SOIJ (Small Outline Integrated J-lead) package instead of the traditional SOIC, offering improved solder joint reliability under thermal cycling due to the J-lead design that enhances coplanarity and reduces stress on the PCB. While both versions share identical electrical characteristics—64Kbit capacity, I²C interface, 400kHz clock frequency, and 2.5V–5.5V supply range—the SOIJ variant provides better mechanical compliance and higher moisture sensitivity level tolerance during reflow. Thermal resistance is marginally improved in the E/SM variant due to the larger lead frame, though not specified in datasheet parameters; designers should still ensure adequate copper pour for heat dissipation during sustained writes.
Can the 24LC64-E/SM be used in automotive-grade systems requiring ISO 26262 compliance, and what design considerations apply?
The 24LC64-E/SM itself is not AEC-Q100 qualified and thus not inherently suitable for functional safety-critical automotive applications under ISO 26262. However, it can support non-safety-related ECU parameter storage if used within its environmental limits. For such use cases, engineers must implement software-level error detection (e.g., CRC on stored data), limit write frequency to prevent premature wear-out, and validate retention beyond 10 years at elevated temperatures using accelerated life testing. Additionally, I²C bus integrity must be maintained through pull-up resistor tuning and noise filtering to avoid corrupted writes or read failures.
What is the maximum number of devices that can coexist on a single I²C bus when using multiple 24LC64-E/SM EEPROMs?
Up to eight 24LC64-E/SM devices can operate simultaneously on one I²C bus by assigning unique hardware address pins. The device uses a 7-bit slave address format where bits A2, A1, and A0 are configurable via pins. With these three bits, 8 distinct addresses are possible (0x50 to 0x57 assuming default base address 0xA0). Engineers must ensure pull-up resistors meet rise-time requirements for 400kHz operation and that address conflicts are avoided during system initialization. Bus capacitance should remain below 400pF to maintain signal integrity across all connected nodes.
How does supply voltage droop during a page write affect the 24LC64-E/SM’s functionality, and what safeguards should be implemented?
During a 5ms page write cycle, the 24LC64-E/SM requires stable supply voltage above VIL(max) = 0.8V to prevent corruption. A droop below VCC(min) = 2.5V may cause incomplete programming or lockup. To mitigate this, designers should include bulk decoupling capacitors (e.g., 10µF tantalum + 0.1µF ceramic near VCC/GND) and ensure trace inductance is minimized. In battery-powered systems, brown-out detection circuitry or firmware polling of the busy flag before initiating writes adds robustness. Voltage supervisors can also reset the microcontroller if VCC falls below threshold during critical operations.
Is it safe to read from the 24LC64-E/SM immediately after power-up without waiting for internal stabilization?
Yes, reading is permitted immediately after power-up since access time is only 900ns and no external stabilization delay is required. However, writing should only commence once the I²C bus has stabilized and the device acknowledges communication. Microchip recommends waiting 5ms after power-up before issuing any write commands to allow internal circuits to fully initialize. This precaution helps avoid spurious write attempts due to transient noise on the power rail during startup.
How does temperature variation impact data retention in the 24LC64-E/SM, and what are realistic expectations for mission-critical applications?
Data retention degrades exponentially with temperature. At 25°C, the 24LC64-E/SM guarantees 10-year retention; at 85°C, this drops to approximately 1 year; at 125°C, retention falls to about 10 days under worst-case conditions. For long-life embedded systems, engineers often derate operating temperature or reduce write frequency. If storing calibration constants or configuration data that must survive decades, consider periodic refresh cycles or migrate to FRAM alternatives. Always validate retention empirically under actual deployment conditions rather than relying solely on datasheet specs.
What happens if two masters attempt simultaneous I²C transactions with the 24LC64-E/SM, and how does arbitration work?
The 24LC64-E/SM does not participate in arbitration—it only responds when addressed. Arbitration occurs at the controller level using standard I²C protocol rules. If two masters transmit simultaneously, the one sending logic "0" wins and continues; the loser detects a mismatch between transmitted and received bits and stops driving the line. The 24LC64-E/SM simply listens passively during this process and resumes normal operation once the bus is free. No special handling is needed unless the system includes multiple controllers sharing the same EEPROM bank, in which case software coordination or hardware addressing becomes essential.
Can the 24LC64-E/SM be erased and rewritten in-place without affecting adjacent memory sectors?
Yes, the 24LC64-E/SM supports byte-level write capability within pages, allowing individual bytes to be updated without disturbing other locations. Each write operation modifies only the targeted byte(s) within a predefined page boundary (typically 32 bytes). Erasing is not necessary before overwriting—only programming is required. However, repeated writes to the same byte accelerate wear; spreading updates across different addresses extends lifetime. This flexibility simplifies firmware delta updates but demands careful management of write distribution in high-update-rate applications.
How should the 24LC64-E/SM be handled during assembly to minimize ESD risk given its MSL rating?
With an MSL rating of 1 (unlimited floor life), the 24LC64-E/SM is highly tolerant to humidity exposure prior to reflow. However, electrostatic discharge remains a concern during manual handling. Use grounded wrist straps, anti-static mats, and ionized air systems when probing or soldering. Although the device lacks explicit ESD protection ratings, standard JEDEC guidelines apply: HBM > 2kV is typical for SOIJ packages. Avoid contact with ungrounded conductors and store components in conductive foam or metalized bags until use. Proper grounding during wave or reflow soldering further reduces risk.
What is the significance of the 900ns access time in real-world I²C systems, and how does it compare to SPI-based alternatives?
The 900ns access time indicates how quickly the device responds after receiving an address command, enabling fast sequential reads. In practice, total read latency includes I²C overhead: start condition, ACK, address byte, register pointer, repeated start, data bytes, and stop. Even with 400kHz clock, a 64-byte read takes ~1.5ms including protocol delays. Compared to SPI-based memory like the AT25 series, which offers direct parallel or quad-SPI access with microsecond-scale transfers, the 24LC64-E/SM trades speed for lower pin count and compatibility with existing I²C infrastructure. Choose based on system throughput needs versus complexity budget.
Does the 24LC64-E/SM require external pull-up resistors, and how do they affect performance across voltage levels?
Yes, the 24LC64-E/SM requires external pull-up resistors on SDA and SCL lines. Resistor values depend on bus capacitance and supply voltage. For 2.5V operation, typical values range from 1kΩ to 4.7kΩ; for 5.5V, 2.2kΩ to 10kΩ is common. Lower resistances increase speed but raise power consumption; higher values reduce current but slow rise times, potentially violating 400kHz timing. Ensure RC time constant allows <1μs rise time per I²C specification. When operating near VCC min or max, recalculate resistor range to maintain valid logic thresholds throughout supply variations.
Can the 24LC64-E/SM retain data during brief power interruptions, and what backup strategies exist for critical settings?
The device cannot sustain writes during power loss, but previously written data remains intact if VCC stays above VIL(max). For critical data, combine the EEPROM with a supercapacitor or small Li-ion backup cell charged from the main supply. Upon power failure detection, firmware can save volatile RAM contents to the last known valid EEPROM address before shutdown. Alternatively, use dual-bank storage: write new data to one sector while verifying old data in another, switching pointers atomically. This approach minimizes corruption risk during brownouts.
How does page size influence firmware update efficiency when using the 24LC64-E/SM, and what trade-offs exist?
The 24LC64-E/SM typically organizes memory into 32-byte pages. Firmware updates should align with these boundaries to maximize efficiency—writing partial pages wastes bandwidth and increases write count. If an update spans multiple pages, pad unused bytes to reach page length. However, excessive padding reduces available user memory. For small configuration changes, consider storing data in variable-length records with length headers to avoid alignment waste. Balancing update granularity against storage overhead is key in constrained designs.
What precautions should be taken when replacing a 24LC64-E/SM in an existing PCB layout to avoid signal integrity issues?
Maintain consistent trace lengths for SDA/SCL, keep them short (<10cm), and route away from noisy signals like PWM or switching regulators. Add series termination resistors (~22Ω) near the microcontroller if reflections occur. Ensure ground plane continuity beneath the device to reduce impedance. Avoid vias on signal paths if possible, as they introduce inductance. Verify pull-up placement close to master side to minimize stub effects. Finally, test bus timing with oscilloscope to confirm rise/fall times meet I²C spec under worst-case load conditions.
How does the absence of a dedicated chip select affect multi-device I²C implementations using the 24LC64-E/SM?
Unlike SPI memories, the 24LC64-E/SM relies entirely on unique I²C addresses for device differentiation. Without CS pins, every device must have a distinct hardware address set via A2/A1/A0 pins. This limits scalability to eight devices per bus unless additional addressing layers (e.g., multiplexers) are used. Designers must carefully plan address allocation early to avoid rework. Software must poll each device sequentially or use interrupt-driven acknowledgment patterns. This constraint favors smaller systems or those already leveraging I²C topology.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology 24LC64-E/SM

Product Attribute 24LC64-I/SM 24LC64-E/ST16KVAO 24LC64-E/SN 24LC64-E/SN16KVAO
Part Number 24LC64-I/SM 24LC64-E/ST16KVAO 24LC64-E/SN 24LC64-E/SN16KVAO
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Technology - - - -
Memory Format - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Memory Size - - - -
Write Cycle Time - Word, Page - - - -
Series - - - -
Access Time - - - -
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Memory Type - - - -
Memory Interface - - - -
Memory Organization - - - -
Clock Frequency - - - -

24LC64-E/SM Datasheet PDF

Download 24LC64-E/SM pdf datasheets and Microchip Technology documentation for 24LC64-E/SM - Microchip Technology.

PCN Assembly/Origin
2.73KHz.pdf
PCN Packaging
Packing Changes 10/Oct/2016.pdf Label and Packing Changes 23/Sep/2015.pdf
PCN Design/Specification
24AA64/24FC64/24LC64 09/Apr/2022.pdf 24AA64/24FC64/24LC64 18/Mar/2022.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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24LC64-E/SM Image

24LC64-E/SM

Microchip Technology
98D-24LC64-E/SM

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